1ST250EU2F50I2LG

The 1ST250EU2F50I2LG is an industrial‑grade Stratix® 10 TX Field Programmable Gate Array (FPGA) IC featuring 2,500,000 logic elements, 440 general‑purpose I/O, and 204,472,320 total on‑chip RAM bits in a 2397‑BBGA (2397‑FBGA, FC 50×50) surface‑mount package. The device operates from a core supply voltage of 820 mV to 880 mV and supports an operating temperature range of −40 °C to 100 °C.

As part of the Stratix 10 TX family, the device builds on Intel’s HyperFlex core architecture and the series’ high‑speed transceiver, hardened PCI Express and Ethernet MAC IP capabilities described in the device overview. These attributes make the part suitable for applications that demand high logic capacity, extensive on‑chip memory, and high‑bandwidth I/O connectivity.

Key Features

• Core Architecture  Intel Stratix 10 TX family HyperFlex core architecture, delivering substantial core performance improvements relative to previous generation architectures as documented in the device series overview.
• Logic Capacity  2,500,000 logic elements to support large, complex FPGA designs and high gate counts.
• On‑chip Memory  204,472,320 total RAM bits for deep buffering and data storage within the FPGA fabric.
• High‑speed Transceivers  Stratix 10 TX series dual‑mode transceivers support PAM4 and NRZ operation (series data documents up to 57.8 Gbps PAM4 and 28.9 Gbps NRZ).
• Hardened Interfaces  Series overview cites hardened PCI Express Gen3 and 10/25/100 Gbps Ethernet MAC IP blocks with dedicated FEC options to accelerate system integration.
• I/O and Package  440 general‑purpose I/O in a 2397‑BBGA (2397‑FBGA, FC 50×50) surface‑mount package for high pin count designs and dense board layouts.
• Power and Thermal  Core supply range 820 mV to 880 mV with an industrial operating temperature range of −40 °C to 100 °C, suitable for temperature‑sensitive deployments.
• Configuration and Security  Stratix 10 TX device family documentation includes device configuration, secure device manager, and device security features to support secure configuration and management (per series overview).

Typical Applications

• High‑bandwidth Networking & Data Center  Large logic capacity, extensive on‑chip RAM, and high‑speed transceiver capability enable packet processing, switch fabric, and data center interconnect applications.
• Telecommunications & Optical Transport  Dual‑mode transceivers and hardened Ethernet/PCIe IP blocks support backplane, module, and chip‑to‑chip transport use cases.
• High‑Performance Compute & Acceleration  Substantial logic and memory resources make the device suitable for FPGA‑based accelerators and compute‑intensive algorithms.
• Industrial Systems  Industrial temperature grading and robust package I/O count suit demanding industrial control, measurement, and communications equipment.

Unique Advantages

• Extensive Logic & Memory Capacity: 2,500,000 logic elements and over 204 million RAM bits provide the resources needed for large, multi‑function FPGA designs without excessive external memory reliance.
• High‑bandwidth I/O: 440 I/O pins in a compact 2397‑BBGA package enable dense, high‑pin‑count system implementations while simplifying board routing.
• Industrial‑grade Operation: Specified operating range of −40 °C to 100 °C and surface‑mount packaging meet industrial environmental requirements.
• Integrated Hardened IP (Series): Availability of hardened PCIe Gen3 and Ethernet MAC IP blocks in the Stratix 10 TX family reduces development time for common high‑speed interfaces.
• Power‑optimized Core Voltage: Narrow core supply range (820–880 mV) supports controlled power provisioning and thermal planning in system design.
• Family‑level Innovations: Stratix 10 TX family features such as HyperFlex core architecture and advanced transceiver technology provide a foundation for high‑performance implementations (per series documentation).

Why Choose 1ST250EU2F50I2LG?

The 1ST250EU2F50I2LG positions itself where high logic density, substantial on‑chip memory, and wide I/O count intersect with industrial temperature requirements. Its placement in the Stratix 10 TX family gives designers access to advanced architecture and high‑speed transceiver capabilities documented for the series, helping accelerate integration of PCIe and Ethernet‑centric systems.

This device is well suited for engineering teams developing high‑bandwidth networking equipment, telecommunications modules, compute accelerators, and industrial systems that require a combination of large programmable logic resources, abundant internal RAM, and robust I/O in a high‑density BGA package.

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