1ST250EY3F55E3VG

The 1ST250EY3F55E3VG is an Intel Stratix® 10 TX field programmable gate array (FPGA) packaged in a 2912-BBGA FCBGA format. It provides a high-capacity programmable fabric with 2,500,000 logic elements and extensive on-chip RAM, designed for bandwidth‑heavy applications that require dense logic and large memory resources.

Built for high-performance system designs, this device targets applications needing large logic count, abundant RAM, and high-speed I/O while operating within a 0 °C to 100 °C temperature range and a core supply window of 770 mV to 970 mV.

Key Features

• Core Capacity — 2,500,000 logic elements providing a large FPGA fabric for complex logic, custom compute engines, and extensive datapath implementations.
• On‑Chip Memory — 204,472,320 total RAM bits to support large buffers, caches, and memory‑intensive algorithms directly in the FPGA fabric.
• I/O Density — 296 I/O pins to accommodate wide parallel interfaces and multiple high-speed links.
• High‑Speed Transceiver Technology — Stratix 10 TX family transceivers support dual‑mode operation (PAM4 and NRZ) and very high data rates as described for this device family, enabling chip‑to‑chip, chip‑to‑module, and backplane connectivity.
• Package and Mounting — 2912‑BBGA (FCBGA) package, supplier device package listed as 2912‑FBGA, FC (55×55), suitable for standard surface‑mount PCB assembly.
• Power and Operating Range — Core supply range of 770 mV to 970 mV and operating temperature range of 0 °C to 100 °C, supporting designs with defined thermal and power budgets.
• Extended Grade — Device grade listed as Extended, aligning with applications that require broader-than-commercial temperature and performance stability.
• Standards Compliance — RoHS compliant.

Typical Applications

• High‑Performance Networking — Implement packet processing, protocol offload, and high‑rate Ethernet MAC functionality using the device's large logic and RAM resources together with family transceiver capabilities.
• Data Center Fabric and Interconnect — Support for multi‑Tbps aggregate bandwidth designs where dense logic, on‑chip memory, and high‑speed links are required for switching, routing, and transport tasks.
• Telecommunications Equipment — Use for line cards, OTN/optical interfaces, and backplane applications that demand high I/O count and advanced transceiver operation.
• Test, Measurement, and Protocol Emulation — Large logic capacity and internal RAM enable complex real‑time signal processing, protocol stacks, and emulation platforms.

Unique Advantages

• Large Programmable Fabric: 2,500,000 logic elements let designers implement extensive custom logic and compute pipelines without external ASICs.
• Massive On‑Chip Memory: Over 204 million RAM bits reduce dependence on external memory for buffering and accelerate data‑intensive tasks.
• High I/O Count: 296 I/O pins provide flexibility for parallel interfaces, multiple transceiver lanes, and control signals on complex PCBs.
• High‑Speed Connectivity Potential: Family transceiver capabilities support both PAM4 and NRZ modes for versatile high‑bandwidth link implementations.
• Compact, Standard Package: 2912‑BBGA (55×55) FCBGA package enables dense board layouts and surface‑mount assembly processes.
• Defined Power and Thermal Envelope: Explicit core supply range (770 mV–970 mV) and 0 °C–100 °C operating range simplify power delivery and thermal design considerations.

Why Choose 1ST250EY3F55E3VG?

The 1ST250EY3F55E3VG delivers a high‑capacity Stratix 10 TX FPGA platform for systems that need a combination of very large logic resources, substantial on‑chip RAM, and extensive I/O. Its package and operating specifications make it suitable for demanding networking, data center, and telecom designs where integration density and memory bandwidth are critical.

Choosing this device provides a scalable foundation for complex hardware acceleration, protocol processing, and high‑bandwidth interfacing, and it is backed by Intel Stratix 10 TX family technologies documented in the device overview.

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