1ST250EY3F55I3VG

The 1ST250EY3F55I3VG is an Intel Stratix® 10 TX field programmable gate array (FPGA) provided in a 2912-ball BGA FCBGA package with surface-mount mounting. It delivers high logic density—2,500,000 logic elements—and deep on-chip memory (204,472,320 total RAM bits) for demanding, compute- and bandwidth-intensive systems.

Built on the Stratix 10 TX family architecture, the device leverages Intel HyperFlex core architecture and heterogeneous packaging innovations to address high-bandwidth chip-to-chip, chip-to-module, and backplane applications. Industrial temperature grading and a wide core voltage supply range make it suitable for robust deployments that require sustained performance across environments.

Key Features

• Core Density  2,500,000 logic elements provide the programmable fabric required for large-scale hardware acceleration and complex FPGA designs.
• High-Speed Transceivers  Stratix 10 TX family transceivers support dual-mode operation with PAM4 up to 57.8 Gbps and NRZ up to 28.9 Gbps, and the family supports up to 144 full-duplex transceiver channels for high aggregate bandwidth applications.
• On-Chip Memory & DSP  204,472,320 total RAM bits of internal memory and family-level hardened DSP resources support data buffering, packet processing, and signal processing workloads.
• Hardened IP  Family features include hardened PCI Express Gen3 and 10/25/100 Gbps Ethernet MAC IP blocks with dedicated Reed–Solomon FEC options for NRZ and PAM4 operation.
• Advanced Architecture & Packaging  HyperFlex core architecture and Intel 14 nm tri-gate (FinFET) technology are leveraged by the Stratix 10 TX family; heterogeneous 3D SiP transceiver tiles and Intel EMIB packaging technologies are used at the family level to optimize transceiver integration and board-level connectivity.
• I/O & Package  296 user I/Os in a 2912-BBGA (2912-FBGA, FC 55×55) package, surface-mount mounting suitable for compact, high-density board designs.
• Power & Operating Range  Core voltage supply range from 770 mV to 970 mV and industrial operating temperature range from −40 °C to 100 °C for reliable operation in challenging environments.
• Security & Configuration  Family-level features include device configuration, secure device manager capabilities, and partial/dynamic reconfiguration options (as described in the Stratix 10 TX device overview).

Typical Applications

• High-Speed Networking & Telecom  Backplane, line-card, and module-level designs that require multi-gigabit transceiver bandwidth and on-chip buffering for packet processing.
• Data Center Switching & Routing  Switch and router fabrics that need high aggregate bandwidth and programmable pipelines using large logic and memory resources.
• High-Performance Compute & Acceleration  Hardware acceleration for compute-intensive workloads leveraging dense logic, DSP resources, and large internal memory.
• Chip-to-Module and Chip-to-Chip Interfaces  Applications requiring high-speed serial links and flexible protocol implementations across board-to-board or module interfaces.

Unique Advantages

• High Logic Capacity: 2,500,000 logic elements provide the scale to implement large custom accelerators and complex packet-processing engines.
• Deep On-Chip Memory: Over 204 million bits of RAM reduce external memory dependence and improve deterministic data-path performance.
• Broad High-Speed I/O: 296 I/Os and family-level multi-gigabit transceivers enable flexible connectivity and high aggregate throughput.
• Industrial Temperature Range: Rated −40 °C to 100 °C, suitable for deployments that require extended temperature operation.
• Advanced Packaging & Integration: Stratix 10 TX family packaging and heterogeneous transceiver tiles help consolidate high-speed interfaces while preserving board space.
• Hardened Protocol IP Options: Available hardened IP for PCIe and multiple Ethernet speeds shortens development time for standard interfaces.

Why Choose 1ST250EY3F55I3VG?

The 1ST250EY3F55I3VG combines high logic density, extensive on-chip memory, and a broad complement of I/O and transceiver capability in a single industrial-grade FCBGA package. It is positioned for engineers who need programmable performance and high-bandwidth connectivity in compact, thermally robust implementations.

This device is well suited to designs that demand large programmable fabrics and high-speed serial links, such as network switching, telecom line cards, and hardware acceleration platforms. The Stratix 10 TX family-level innovations—HyperFlex architecture, advanced FinFET process, and heterogeneous packaging—provide a scalable foundation for long-term platform development.

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