1ST280EU1F50I1VG

IC FPGA 440 I/O 2397BGA
Part Description

Stratix® 10 TX Field Programmable Gate Array (FPGA) IC 440 2800000 2397-BBGA, FCBGA

Quantity 1,553 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package2397-FBGA, FC (50x50)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case2397-BBGA, FCBGANumber of I/O440Voltage770 mV - 970 mV
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs350000Number of Logic Elements/Cells2800000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits240123904

Overview of 1ST280EU1F50I1VG – Stratix® 10 TX FPGA, 2.8M logic elements, 440 I/O, 2397-BBGA (FCBGA)

The 1ST280EU1F50I1VG is an Intel Stratix® 10 TX field programmable gate array (FPGA) packaged in a 2397-BBGA FCBGA. It pairs a high-density monolithic core fabric with advanced, dual-mode high-speed transceivers and hardened protocol IP to target demanding, high-bandwidth systems.

Designed for industrial-grade applications, this device delivers large programmable logic capacity, extensive on-chip memory, and a high I/O count—making it suitable for next-generation communications, networking, and compute acceleration designs that require high aggregate bandwidth and integration.

Key Features

  • Core Architecture  Intel HyperFlex® core architecture implemented in 14 nm tri-gate (FinFET) process with a monolithic fabric delivering 2,800,000 logic elements.
  • High-speed Transceivers  Dual-mode transceivers capable of 57.8 Gbps PAM4 and 28.9 Gbps NRZ operation; heterogeneous 3D SiP transceiver tiles enable high channel counts and flexible signal interfaces.
  • Hardened Protocol IP  Includes hardened PCI Express Gen3 and 10/25/100 Gbps Ethernet MAC IP with dedicated Reed–Solomon FEC for selected signal modes, reducing the need for external PHYs and offload logic.
  • On-chip Memory  Total RAM of 240,123,904 bits, with internal M20K SRAM blocks and select devices offering embedded eSRAM (47.25 Mbit) for large buffering and in-hardware data storage.
  • DSP and Processing  Hardened floating-point variable-precision DSP blocks and, in select devices, an embedded quad-core 64-bit Arm Cortex‑A53 Hard Processor System (HPS) for application-class processing.
  • I/O and Package  440 I/O pins in a 2397-BBGA (50 × 50) FCBGA package; surface-mount mounting type suited for high-density board implementations.
  • Power and Thermal  Core voltage supply range of 770 mV to 970 mV and industrial operating temperature range from −40 °C to 100 °C.
  • Configuration, Security, and Reliability  Supports secure device management and configuration features, as well as SEU error detection and correction mechanisms to improve system reliability.

Typical Applications

  • High-bandwidth Networking and Switching  Used to implement switch fabrics, line cards, and backplane interfaces that require aggregated multi-terabit throughput and low-latency packet processing.
  • Data Center Accelerators  Suitable for compute acceleration and custom offload engines that leverage large logic capacity, DSP blocks, and on-chip memory for workload-specific processing.
  • Telecommunications and Optical Transport  Adaptable to PAM4/NRZ transceiver requirements for optical modules, chip-to-module, and chip-to-chip interconnects with integrated FEC and MAC IP.
  • High-speed Serial I/O Systems  Ideal for designs requiring many high-rate serial channels and robust protocol support such as PCIe and multi-rate Ethernet links.

Unique Advantages

  • Highly Integrated Fabric:  2.8 million logic elements and large on-chip RAM reduce external logic and memory needs, simplifying BOM and board complexity.
  • Flexible High-speed I/O:  Dual-mode transceivers and up to hundreds of transceiver channels support a wide range of serial link topologies and data rates for modular system design.
  • Hardened IP Blocks:  Built-in PCIe Gen3 and multi-rate Ethernet MAC with FEC lower development time and provide proven protocol handling in hardware.
  • Industrial Temperature Range:  Rated from −40 °C to 100 °C to meet industrial deployment conditions without derating core specifications.
  • Advanced Packaging and Interconnect:  Heterogeneous 3D SiP and EMIB-based packaging concepts (described for the family) support dense integration of fabric and transceiver tiles.
  • On-chip Processing Options:  Availability of an embedded quad-core Arm Cortex‑A53 HPS in select devices enables tighter hardware/software partitioning and reduced external processor requirements.

Why Choose 1ST280EU1F50I1VG?

The 1ST280EU1F50I1VG delivers a combination of very high logic density, extensive on-chip memory, and robust high-speed transceivers in an industrial-grade Stratix 10 TX package. Its architecture and hardened protocol IP make it a strong candidate for designers targeting high-bandwidth communications, data center acceleration, and advanced serial I/O systems that require integrated handling of complex protocols.

Choosing this device provides a path to scalable, high-performance system designs with features intended to reduce external components and accelerate development—backed by the Stratix 10 TX device family documentation and configuration/security capabilities described in the product literature.

Request a quote or submit an inquiry to obtain pricing, lead time, and availability for the 1ST280EU1F50I1VG.

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