1ST280EY2F55I2LGAS

The 1ST280EY2F55I2LGAS is an Intel Stratix® 10 TX field programmable gate array (FPGA) in a 2912-BBGA surface-mount package. It combines Intel HyperFlex™ core architecture and high-density programmable logic with high-speed transceiver capability suitable for demanding bandwidth applications.

Designed for industrial-grade systems, this device offers 2,800,000 logic elements, large on-chip RAM (240,123,904 bits), and extensive I/O, enabling high-throughput designs such as next-generation networking, compute acceleration, and high-speed data transport.

Key Features

• Core & architecture 
  Intel HyperFlex™ core architecture and 14 nm technology deliver the architectural foundation described for the Stratix 10 TX family.
• Logic density 
  2,800,000 logic elements provide a high-capacity fabric for complex algorithms, data path logic, and large-scale state machines.
• On-chip memory 
  240,123,904 total RAM bits support large buffering and on-chip data storage for high-throughput designs.
• High-speed transceivers 
  Stratix 10 TX family transceivers support dual-mode operation (PAM4 and NRZ) with data-rate capabilities cited in the device overview for chip-to-chip, chip-to-module, and backplane applications.
• Hard IP support 
  Family-level features include hardened PCI Express Gen3 and high-speed Ethernet MACs with Reed-Solomon FEC for NRZ and PAM4 signals, as documented in the device overview.
• I/O and package 
  296 user I/O pins in a 2912-BBGA (FCBGA) package; supplier device package noted as 2912-FBGA, FC (55×55). Mounting type is surface mount.
• Power and operating conditions 
  Specified core voltage supply range is 820 mV to 880 mV. Operating temperature range is −40 °C to 100 °C, and the device is RoHS compliant.

Typical Applications

• High-performance networking 
  Use the device for packet processing, line cards, and MAC-offload functions where high transceiver bandwidth and hardened Ethernet/IP features accelerate throughput.
• Data center and switch fabric 
  Leverage dense logic and large on-chip memory for traffic shaping, telemetry, and forwarding engines in switch and router platforms.
• Chip-to-module and backplane connectivity 
  Dual-mode transceiver capability supports high-speed links for board-to-board and backplane interconnects.
• Compute acceleration and custom processing 
  Large logic capacity and RAM allow implementation of accelerators, DSP pipelines, and custom packet-processing engines.

Unique Advantages

• High logic capacity: The 2,800,000 logic elements enable large, integrated designs that reduce the need for multiple FPGAs and simplify system architecture.
• Substantial on-chip memory: 240,123,904 bits of RAM support deep buffering and in-line data processing without relying exclusively on external memory.
• Integrated high-speed I/O: 296 I/O pins and family-level high-rate transceiver support facilitate high-bandwidth interfaces for networking and interconnect applications.
• Industrial-grade operation: Rated for −40 °C to 100 °C operation and supplied in a 2912-BBGA surface-mount package suitable for robust system deployment.
• Power-specified core: A defined core voltage supply range (820 mV–880 mV) helps with predictable power planning and board-level design.
• Standards-aligned hard IP: Family documentation cites hardened PCIe and Ethernet MAC IP blocks that accelerate common protocol implementations.

Why Choose 1ST280EY2F55I2LGAS?

This Stratix® 10 TX FPGA variant delivers a high-density, industrial-grade platform for designs that demand large programmable fabric, substantial on-chip memory, and high-speed I/O. Its combination of 2.8 million logic elements, extensive RAM, and the Stratix 10 TX architectural features makes it suitable for complex networking, acceleration, and high-bandwidth transport applications.

Selecting this device provides a scalable hardware foundation for systems requiring integrated transceiver capability, hardened protocol IP at the family level, and predictable operating and power parameters—supporting long-term development and deployment in industrial environments.

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