1ST280EY3F55E3VGS1

The 1ST280EY3F55E3VGS1 is an Intel Stratix® 10 TX field programmable gate array (FPGA) in a 2912-BBGA FCBGA package. It integrates a high-performance monolithic core fabric with 2,800,000 logic elements and large on-chip RAM to address demanding, high-bandwidth system designs.

As part of the Stratix 10 TX family, the device targets applications that require high aggregate bandwidth and advanced transceiver and processing capabilities, leveraging series-level innovations such as the HyperFlex core architecture and dual-mode transceivers for PAM4 and NRZ operation.

Key Features

• Core Capacity  2,800,000 logic elements provide a large programmable fabric suitable for complex logic integration and high-density designs.
• Embedded Memory  Total on-chip RAM of 240,123,904 bits delivers substantial internal storage for buffering, packet processing, and algorithmic state.
• I/O Count  296 I/O pins support broad external connectivity and system integration while enabling flexible interfacing options.
• High-speed Transceiver Technology (Series)  Stratix 10 TX series includes dual-mode transceivers capable of 57.8 Gbps PAM4 and 28.9 Gbps NRZ operation for chip-to-chip, chip-to-module, and backplane links.
• Hard IP Blocks (Series)  Family-level hard IP includes PCI Express Gen3 and 10/25/100 Gbps Ethernet MAC with Reed-Solomon FEC options for NRZ and PAM4 signaling.
• Power and Operating Range  Device core supply range is 770 mV to 970 mV; operating temperature range is 0°C to 100°C, suitable for systems specified within that range.
• Package & Mounting  2912-BBGA (FCBGA) package, supplier package 2912-FBGA, FC (55×55), surface-mount mounting type for standard PCB assembly flows.
• Compliance & Grade  RoHS compliant; device grade is Extended.

Typical Applications

• High-bandwidth networking  Use in switching, routing, and line-card designs that require large programmable fabric and series-level transceiver support for multi-gigabit links.
• Telecom and datacenter interconnect  Integration of packet processing and forwarding logic with on-chip RAM and hardened Ethernet/PCIe capabilities for high-throughput systems.
• Backplane and chip-to-chip interfaces  Leverage series transceiver modes (PAM4/NRZ) for reliable, high-speed board-to-board and module connections.

Unique Advantages

• Large, monolithic programmable fabric: 2.8 million logic elements enable consolidation of complex functions into a single FPGA, reducing system BOM and interconnect complexity.
• Extensive on-chip memory: 240,123,904 bits of RAM support buffering and stateful processing without immediate dependence on external memory.
• High I/O density: 296 I/Os allow versatile external interfacing for multi-channel systems and diverse peripheral integration.
• High-speed serial capability (series-level): Dual-mode transceivers and hardened MAC/PCIe blocks provide bandwidth and protocol support needed for modern high-speed links.
• Compact, production-ready package: 2912-BBGA FCBGA in a surface-mount format simplifies board-level integration for volume manufacturing.
• Regulatory readiness: RoHS compliance facilitates deployment in markets requiring lead-free components.

Why Choose 1ST280EY3F55E3VGS1?

The 1ST280EY3F55E3VGS1 positions itself for designs that demand a large programmable fabric combined with significant on-chip memory and high I/O density. As a member of the Intel Stratix 10 TX family, it aligns with series-level innovations such as the HyperFlex core architecture and dual-mode transceiver technology, enabling high-throughput, complex logic and connectivity integration.

This device is well suited for engineers building high-bandwidth networking, telecom, and backplane systems that need consolidation of logic, buffering capacity, and flexible high-speed I/O in a production-ready BBGA package. Its electrical and thermal ranges support deployment in systems specified for the provided supply and operating-temperature limits.

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