1ST280EY3F55I3VG

The 1ST280EY3F55I3VG is an Intel Stratix® 10 TX Field Programmable Gate Array (FPGA) supplied in a 2912-BBGA package. It combines a large monolithic FPGA fabric with series-level Stratix 10 TX innovations—including the Intel HyperFlex™ core architecture and heterogeneous transceiver tiles—targeted at high-bandwidth, high-performance system designs.

This device is suited for industrial applications that require extensive programmable logic (2,800,000 logic elements), large on-chip RAM resources, and multi-gigabit transceiver capability, while operating across a wide supply and temperature range.

Key Features

• Core Architecture  Intel HyperFlex™ core architecture providing the Stratix 10 TX series performance enhancements described in the device overview.
• Logic Capacity  2,800,000 logic elements to support large, complex designs.
• Embedded Memory  240,123,904 total RAM bits available for on-chip storage and buffering.
• High‑Speed Transceivers  Series-level Stratix 10 TX transceiver technology with support for dual-mode operation at PAM4 and NRZ data rates as described in the device overview for high-bandwidth links.
• I/O and Package  296 general-purpose I/O pins in a surface-mount 2912-BBGA (2912-FBGA, FC 55×55) package to accommodate dense board-level interconnects.
• Supply Voltage  Core voltage range of 770 mV to 970 mV for integration with modern power delivery schemes.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C for industrial applications and environments.
• Standards and Compliance  RoHS compliant.

Typical Applications

• High‑Performance Networking  Implement Ethernet MACs, Reed‑Solomon FEC, and multi‑lane transceiver links for switches, routers, and optical interconnect equipment.
• Data Center Interconnects  Aggregate large transceiver bandwidth and programmable logic for packet processing, protocol bridging, and linecard designs.
• Backplane and Chip‑to‑Chip Interfaces  Leverage high‑speed PAM4/NRZ transceivers and extensive I/O for backplane and board‑level high‑bandwidth connections.
• Compute and Acceleration  Deploy large FPGA fabric and extensive on‑chip RAM to implement custom accelerators and data‑path processing functions.

Unique Advantages

• Large, Monolithic FPGA Fabric:  2,800,000 logic elements and substantial on‑chip RAM enable complex, high‑density designs without partitioning across multiple devices.
• High‑Bandwidth Transceiver Support:  Series-level dual‑mode transceivers and hardened PHY/IP options facilitate multi‑Gbps links for modern networking and interconnect use cases.
• Industrial‑Grade Operation:  Rated −40 °C to 100 °C to meet industrial temperature requirements and broaden deployment environments.
• Dense I/O and Compact Package:  296 I/O in a 2912‑FBGA (55×55) package balances board space with connectivity for complex systems.
• Power‑Domain Flexibility:  Core supply range of 770 mV to 970 mV supports integration into varied power delivery architectures.
• Regulatory Compliance:  RoHS compliant to meet environmental and manufacturing requirements.

Why Choose 1ST280EY3F55I3VG?

The 1ST280EY3F55I3VG brings Stratix 10 TX series capabilities into a single, industrial‑grade FPGA package—combining a very large logic fabric, extensive on‑chip RAM, dense I/O, and the series’ high‑speed transceiver architecture. It is well suited for engineers designing high‑bandwidth networking, data center interconnect, backplane, and compute acceleration systems that demand programmable performance and industrial reliability.

Choosing this device supports scalability across demanding designs and leverages Intel’s Stratix 10 TX device features for applications that require large programmable resources and robust high‑speed I/O in a compact BGA footprint.

If you would like pricing, availability, or a formal quote for 1ST280EY3F55I3VG, submit a request for a quote or an RFQ and our team will respond with details.