1ST280EY2F55I2VGAS
| Part Description |
Stratix® 10 TX Field Programmable Gate Array (FPGA) IC 296 2800000 2912-BBGA, FCBGA |
|---|---|
| Quantity | 475 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 2912-FBGA, FC (55x55) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 2912-BBGA, FCBGA | Number of I/O | 296 | Voltage | 770 mV - 970 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 350000 | Number of Logic Elements/Cells | 2800000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 240123904 |
Overview of 1ST280EY2F55I2VGAS – Stratix® 10 TX FPGA, 2,800,000 logic elements, 2912‑BBGA
The 1ST280EY2F55I2VGAS is an Intel Stratix® 10 TX Field Programmable Gate Array (FPGA) supplied in a 2912‑BBGA FCBGA package. It integrates a high‑density monolithic core fabric and heterogeneous transceiver tiles, delivering a platform for high‑bandwidth, high‑performance system designs.
Built on Intel’s HyperFlex core architecture and 14 nm FinFET technology (as described for Stratix 10 TX devices), this device targets applications that require large logic capacity, extensive on‑chip RAM, and multi‑Gbps serial connectivity while operating across industrial temperature ranges.
Key Features
- Logic Capacity 2,800,000 logic elements (LEs) suitable for large, complex logic implementations and high‑density design partitioning.
- Internal Memory 240,123,904 total RAM bits for on‑chip buffering, lookup tables, and intermediate storage.
- High‑Speed Transceivers Dual‑mode transceivers in the Stratix 10 TX family support PAM4 and NRZ operation and are engineered for multi‑tens of Gbps serial links (per device family documentation).
- Hard IP Blocks Family‑level features include hardened PCI Express Gen3 and multi‑rate Ethernet MACs with Reed‑Solomon FEC support, enabling protocol offload and deterministic link behavior.
- Embedded Processing (Family) Select Stratix 10 TX devices include an embedded quad‑core 64‑bit Arm Cortex‑A53 Hard Processor System (HPS) for application‑class processing and system control.
- Package and I/O 2912‑BBGA (FCBGA) packaging with 296 I/O pins provides a large, high‑density footprint for board integration; supplier package listed as 2912‑FBGA, FC (55×55).
- Power and Thermal Core voltage supply range of 770 mV–970 mV and an operating temperature range of −40 °C to 100 °C for industrial operating conditions.
- Compliance RoHS‑compliant manufacturing status for environmental‑driven procurement requirements.
Typical Applications
- High‑Performance Networking Use the device for switch, router, and line card designs that demand multi‑Tbps aggregate bandwidth and hardware protocol acceleration.
- Data Center Acceleration Deploy as a reconfigurable accelerator for packet processing, encryption, and custom compute offload leveraging large logic and memory resources.
- Telecom and Optical Transport Implement high‑speed PAM4/NRZ serial links and forward‑error‑correction engines for backplane and optical module interfaces.
- Protocol Bridging and Interface Aggregation Combine hardened PCIe and Ethernet MACs with dense I/O to consolidate multiple protocol endpoints in a single FPGA solution.
Unique Advantages
- Large Logic Fabric: 2,800,000 logic elements provide the capacity to integrate complex designs and multiple subsystems on a single device, reducing BOM count.
- Extensive On‑Chip RAM: 240,123,904 total RAM bits enable large buffers and data staging without constant external memory accesses.
- High‑Speed, Dual‑Mode Transceivers: Family‑level support for PAM4 and NRZ serial links allows flexible link design for chip‑to‑chip, module, and backplane applications.
- Protocol Hard IP: Hardened PCIe Gen3 and 10/25/100 Gb Ethernet MACs with FEC reduce development time for standard high‑speed interfaces and improve determinism.
- Industrial Reliability Range: Rated for operation from −40 °C to 100 °C and RoHS‑compliant, supporting deployment in industrial environments.
- High‑Density Package and I/O: 2912‑BBGA package with 296 I/O pins supports dense board routing and numerous peripheral connections.
Why Choose 1ST280EY2F55I2VGAS?
The 1ST280EY2F55I2VGAS Stratix 10 TX FPGA combines very large logic capacity and substantial on‑chip RAM with the family’s high‑speed transceiver and hardened IP capabilities. Its industrial operating range and packaged I/O density make it a fit for systems that require sustained throughput, complex protocol handling, and on‑device acceleration.
This device is appropriate for design teams building high‑bandwidth networking, telecom, and data center applications that benefit from a reconfigurable platform with integrated IP blocks and a scalable core fabric. The combination of logic density, memory, transceiver flexibility, and industrial temperature rating supports long‑term deployment and system scalability.
Request a quote or submit an inquiry to receive availability and pricing information for the 1ST280EY2F55I2VGAS Stratix 10 TX FPGA.

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