1ST280EY3F55E3VG

The 1ST280EY3F55E3VG is an Intel Stratix® 10 TX field programmable gate array (FPGA) offered in a 2912-BBGA FCBGA package (55×55). It implements Intel's HyperFlex® core architecture and a high-density fabric with 2,800,000 logic elements and large on-chip RAM for demanding, transceiver‑intensive system designs.

Designed for high-bandwidth, power-conscious applications, this device integrates high‑speed dual‑mode transceivers, hardened IP blocks, and advanced packaging to support chip‑to‑chip, chip‑to‑module, and backplane topologies while operating over an extended temperature range.

Key Features

• Core Architecture  HyperFlex® core architecture implemented in Intel 14 nm tri‑gate (FinFET) technology; the family documentation cites a significant core performance uplift compared to prior-generation devices.
• Logic Density  2,800,000 logic elements (LEs) to accommodate large, complex FPGA designs and high logic resource demands.
• On‑chip Memory  Total RAM capacity of 240,123,904 bits with internal memory block support for embedded M20K SRAM structures and optional embedded eSRAM in select devices.
• High‑Speed Transceivers  Dual‑mode transceivers supporting both 57.8 Gbps PAM4 and 28.9 Gbps NRZ operation, suitable for chip‑to‑chip, chip‑to‑module, and backplane applications; family documentation references up to 144 full‑duplex transceiver channels.
• Hardened IP  Family devices include hardened PCI Express Gen3 and 10/25/100 Gbps Ethernet MAC IP blocks with dedicated Reed‑Solomon FEC options for NRZ and PAM4 signals.
• I/O and Package  296 user I/Os in a surface‑mount 2912‑BBGA FCBGA package (supplier package: 2912‑FBGA, FC, 55×55) for compact board integration.
• Power and Operating Range  Core voltage supply range 770 mV to 970 mV; operating temperature range 0 °C to 100 °C; Extended grade and RoHS‑compliant.
• System Features  Family documentation highlights features such as embedded hard processor options in select devices, device configuration and Secure Device Manager (SDM), fractional synthesis PLLs, and SEU detection and correction capabilities.

Typical Applications

• Backplane and High‑Speed Interconnects  Used for high‑bandwidth chip‑to‑chip and backplane links where multi‑mode transceivers and aggregate bandwidth are critical.
• Optical and Packet Networking  Implements hardened Ethernet MAC and FEC IP for high‑rate network transport and packet processing functions.
• Compute and Acceleration Platforms  Provides large logic capacity and significant on‑chip RAM to support acceleration, protocol offload, and complex dataplane logic.
• System Prototyping and Integration  High I/O count and a dense BGA package simplify integration in systems requiring compact, high‑density programmable logic.

Unique Advantages

• Highly integrated fabric and transceivers: Monolithic 14 nm core fabric combined with heterogeneous transceiver tiles reduces system complexity for high‑bandwidth designs.
• Massive logic and memory resources: 2.8 million logic elements and 240,123,904 bits of on‑chip RAM enable large, feature‑rich FPGA implementations without immediate external memory dependence.
• Flexible high‑speed connectivity: Dual‑mode transceivers supporting PAM4 and NRZ modes allow designers to target multiple link types and data rates with the same device family.
• Hardened protocol IP: Built‑in PCIe Gen3 and multi‑rate Ethernet MACs with FEC reduce development time and provide proven protocol building blocks.
• Board‑level integration: 296 I/Os in a 2912‑BBGA (55×55) surface‑mount package supports dense board routing and compact system layouts.
• Operational robustness: Extended grade and specified operating range (0 °C to 100 °C) with RoHS compliance for enterprise and industrial applications.

Why Choose 1ST280EY3F55E3VG?

The 1ST280EY3F55E3VG delivers a combination of very high logic density, substantial on‑chip memory, and advanced transceiver capabilities in a compact BGA package. It is targeted at system designs that require large programmable fabric, multi‑mode high‑speed links, and hardened protocol IP to accelerate time to market.

This device is suited for engineering teams building high‑bandwidth networking, interconnect, and compute acceleration equipment where integration, scalability, and available family‑level features (such as HyperFlex® architecture and hardened Ethernet/PCIe IP) provide long‑term design value and ecosystem support.

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