1ST280EY3F55I3XG

The 1ST280EY3F55I3XG is an Intel Stratix® 10 TX series FPGA offered in a 2912‑ball FCBGA package. It provides a large monolithic core fabric with 2,800,000 logic elements and extensive on‑chip RAM, targeting high‑bandwidth, compute‑intensive system designs.

Designed for applications that require high transceiver bandwidth, dense logic and memory resources, and industrial operating range, this device combines high logic density, large embedded RAM, and industry‑grade operating limits to support demanding networking, datacenter and communications infrastructure designs.

Key Features

• Core Architecture  Monolithic Stratix 10 TX core fabric with 2,800,000 logic elements and Intel HyperFlex™ architecture innovations referenced for the family.
• On‑chip Memory  240,123,904 total RAM bits of embedded memory to support large buffering and state storage for complex designs.
• High‑speed I/O and Transceivers  296 user I/O pins and series‑level dual‑mode transceivers capable of both 57.8 Gbps PAM4 and 28.9 Gbps NRZ operation for chip‑to‑chip, chip‑to‑module, and backplane use cases.
• Hardened Interfaces (Series‑level)  Intel Stratix 10 TX family includes hardened PCI Express Gen3 and 10/25/100 Gbps Ethernet MAC IP blocks and Reed‑Solomon FEC options suitable for high‑throughput interface implementations.
• DSP and Memory Subsystems (Series‑level)  Family features variable‑precision DSP blocks and internal M20K SRAM blocks; select devices offer embedded eSRAM for additional on‑chip storage.
• Package and Mounting  2912‑ball BGA (FCBGA) supplier package (2912‑FBGA, FC 55×55) in a surface‑mount footprint for high‑density board designs.
• Power and Supply  Core supply operating range specified at 820 mV to 880 mV for the device.
• Industrial Operating Range  Rated for operation from −40 °C to 100 °C, supporting deployment in industrial environments.
• Compliance  RoHS compliant.

Typical Applications

• High‑speed Networking & Telecom  Implementation of high‑bandwidth line cards, optical module interfaces and backplane transceivers using the device’s multi‑mode high‑speed transceivers and hardened Ethernet/PCIe IP (series‑level).
• Data Center & Cloud Infrastructure  Acceleration, packet processing, and NIC/adapter designs that benefit from large logic capacity and extensive on‑chip RAM for buffering and stateful processing.
• High‑performance Compute & Signal Processing  DSP‑intensive workloads and floating‑point signal processing leveraging the family’s hardened DSP resources and large logic fabric.
• Chip‑to‑Module and Backplane Interfaces  High‑data‑rate board interconnects and module interfaces that require PAM4/NRZ transceiver support and dense I/O.

Unique Advantages

• Very high logic density: 2,800,000 logic elements provide capacity for large, complex FPGA designs without partitioning across multiple devices.
• Substantial on‑chip RAM: 240,123,904 total RAM bits enable deep buffering, large state machines, and memory‑heavy algorithms on a single device.
• High‑speed serial capability: Series support for dual‑mode transceivers up to 57.8 Gbps PAM4 and 28.9 Gbps NRZ supports next‑generation link rates and dense channel counts.
• Industrial temperature support: −40 °C to 100 °C operating range helps ensure stable operation in industrial and harsh environment deployments.
• Compact, high‑ball‑count package: 2912‑ball FCBGA package provides high pin density for extensive I/O and transceiver channel routing in a compact footprint.
• Low core voltage operation: 820–880 mV supply range supports modern low‑voltage power architectures and board power optimization.

Why Choose 1ST280EY3F55I3XG?

The 1ST280EY3F55I3XG brings a high‑capacity Stratix 10 TX FPGA fabric into a 2912‑ball FCBGA package with substantial on‑chip memory and extensive I/O. It is positioned for designs that demand large logic resources, significant embedded RAM, and high‑speed serial links within an industrial operating range.

Choose this device when your design requires scalable logic and memory, multi‑mode high‑speed transceivers, and a surface‑mount, high‑density package. The combination of series‑level hardened IP and device‑level electrical and environmental specifications supports long‑term deployment in networking, communications, and compute‑dense systems.

Request a quote or submit an inquiry to obtain pricing and availability for the 1ST280EY3F55I3XG.