Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

Featured Brands

About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,052
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
MC68HC908QY4CPEMC68HC908QY4CPENXP SemiconductorsIC MCU 8BIT 4KB FLASH 16DIPMicrocontrollers16-PDIPN/A-40°C ~ 85°C (TA)
Core Processor:
HC08
Core Size:
8-Bit
Speed:
8MHz
Peripherals:
LVD, POR, PWM
Number of I/O:
13
Program Memory Size:
4KB (4K x 8)
Program Memory Type:
FLASH
RAM Size:
128 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 4x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Through Hole
Supplier Device Package:
16-PDIP
Package / Case:
16-DIP (0.300″”, 7.62mm)
1,300
MC68HC908QY4MDTEMC68HC908QY4MDTENXP SemiconductorsIC MCU 8BIT 4KB FLASH 16TSSOPMicrocontrollers16-TSSOPN/A-40°C ~ 125°C (TA)
Core Processor:
HC08
Core Size:
8-Bit
Speed:
8MHz
Peripherals:
LVD, POR, PWM
Number of I/O:
13
Program Memory Size:
4KB (4K x 8)
Program Memory Type:
FLASH
RAM Size:
128 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 4x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
16-TSSOP
Package / Case:
16-TSSOP (0.173″”, 4.40mm Width)
293
MC68HC908QY4MPEMC68HC908QY4MPENXP SemiconductorsIC MCU 8BIT 4KB FLASH 16DIPMicrocontrollers16-PDIPN/A-40°C ~ 125°C (TA)
Core Processor:
HC08
Core Size:
8-Bit
Speed:
8MHz
Peripherals:
LVD, POR, PWM
Number of I/O:
13
Program Memory Size:
4KB (4K x 8)
Program Memory Type:
FLASH
RAM Size:
128 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 4x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Through Hole
Supplier Device Package:
16-PDIP
Package / Case:
16-DIP (0.300″”, 7.62mm)
531
MC68HC908QY4VDTMC68HC908QY4VDTNXP SemiconductorsIC MCU 8BIT 4KB FLASH 16TSSOPMicrocontrollers16-TSSOPN/A-40°C ~ 105°C (TA)
Core Processor:
HC08
Core Size:
8-Bit
Speed:
8MHz
Peripherals:
LVD, POR, PWM
Number of I/O:
13
Program Memory Size:
4KB (4K x 8)
Program Memory Type:
FLASH
RAM Size:
128 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 4x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
16-TSSOP
Package / Case:
16-TSSOP (0.173″”, 4.40mm Width)
1,373
MC68HC908QY4VDTEMC68HC908QY4VDTENXP SemiconductorsIC MCU 8BIT 4KB FLASH 16TSSOPMicrocontrollers16-TSSOPN/A-40°C ~ 105°C (TA)
Core Processor:
HC08
Core Size:
8-Bit
Speed:
8MHz
Peripherals:
LVD, POR, PWM
Number of I/O:
13
Program Memory Size:
4KB (4K x 8)
Program Memory Type:
FLASH
RAM Size:
128 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 4x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
16-TSSOP
Package / Case:
16-TSSOP (0.173″”, 4.40mm Width)
2
MC68HC908QY4VPEMC68HC908QY4VPENXP SemiconductorsIC MCU 8BIT 4KB FLASH 16DIPMicrocontrollers16-PDIPN/A-40°C ~ 105°C (TA)
Core Processor:
HC08
Core Size:
8-Bit
Speed:
8MHz
Peripherals:
LVD, POR, PWM
Number of I/O:
13
Program Memory Size:
4KB (4K x 8)
Program Memory Type:
FLASH
RAM Size:
128 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 4x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Through Hole
Supplier Device Package:
16-PDIP
Package / Case:
16-DIP (0.300″”, 7.62mm)
1,521
MC68HC908RF2CFAMC68HC908RF2CFANXP SemiconductorsIC MCU 8BIT 2KB FLASH 32LQFPMicrocontrollers32-LQFP (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
HC08
Core Size:
8-Bit
Speed:
4MHz
Peripherals:
LVD, POR, PWM, RF Mod
Number of I/O:
12
Program Memory Size:
2KB (2K x 8)
Program Memory Type:
FLASH
RAM Size:
128 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-LQFP (7×7)
Package / Case:
32-LQFP
982
MC68HC908SR12CBMC68HC908SR12CBNXP SemiconductorsIC MCU 8BIT 12KB FLASH 42DIPMicrocontrollers42-PDIPN/A-40°C ~ 85°C (TA)
Core Processor:
HC08
Core Size:
8-Bit
Speed:
8MHz
Connectivity:
I2C, SCI
Peripherals:
LVD, POR, PWM, Temp Sensor
Number of I/O:
29
Program Memory Size:
12KB (12K x 8)
Program Memory Type:
FLASH
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 11x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Through Hole
Supplier Device Package:
42-PDIP
Package / Case:
42-SDIP (0.600″”, 15.24mm)
508
MC68HC908SR12CFAMC68HC908SR12CFANXP SemiconductorsIC MCU 8BIT 12KB FLASH 48LQFPMicrocontrollers48-LQFP (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
HC08
Core Size:
8-Bit
Speed:
8MHz
Connectivity:
I2C, SCI
Peripherals:
LVD, POR, PWM, Temp Sensor
Number of I/O:
31
Program Memory Size:
12KB (12K x 8)
Program Memory Type:
FLASH
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 14x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-LQFP (7×7)
Package / Case:
48-LQFP
490
MC68HC912B32CFU8MC68HC912B32CFU8NXP SemiconductorsIC MCU 16BIT 32KB FLASH 80QFPMicrocontrollers80-QFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
CPU12
Core Size:
16-Bit
Speed:
8MHz
Connectivity:
SCI, SPI
Peripherals:
POR, PWM, WDT
Number of I/O:
63
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
EEPROM Size:
768 x 8
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-QFP (14×14)
Package / Case:
80-QFP
1,218
MC68HC98LJ12CFUEMC68HC98LJ12CFUENXP SemiconductorsIC MCU 8BIT 12KB FLASH 64QFPMicrocontrollers64-QFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
HC08
Core Size:
8-Bit
Speed:
8MHz
Connectivity:
IRSCI, SPI
Peripherals:
LCD, LVD, POR, PWM
Number of I/O:
32
Program Memory Size:
12KB (12K x 8)
Program Memory Type:
FLASH
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 6x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-QFP (14×14)
Package / Case:
64-QFP
1,178
MC68HCP11E0FNMC68HCP11E0FNNXP SemiconductorsIC MCU 8BIT ROMLESS 52PLCCMicrocontrollers52-PLCC (19.1x19.1)N/A0°C ~ 70°C (TA)
Core Processor:
HC11
Core Size:
8-Bit
Speed:
3MHz
Connectivity:
SCI, SPI
Peripherals:
POR, WDT
Number of I/O:
38
Program Memory Type:
ROMless
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x8b
Oscillator Type:
Internal
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
52-PLCC (19.1×19.1)
Package / Case:
52-LCC (J-Lead)
1,128
MC68HCP11E0FNEMC68HCP11E0FNENXP SemiconductorsIC MCU 8BIT ROMLESS 52PLCCMicrocontrollers52-PLCC (19.1x19.1)N/A0°C ~ 70°C (TA)
Core Processor:
HC11
Core Size:
8-Bit
Speed:
3MHz
Connectivity:
SCI, SPI
Peripherals:
POR, WDT
Number of I/O:
38
Program Memory Type:
ROMless
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x8b
Oscillator Type:
Internal
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
52-PLCC (19.1×19.1)
Package / Case:
52-LCC (J-Lead)
863
MC68HCP11E1CFNE2MC68HCP11E1CFNE2NXP SemiconductorsIC MCU 8BIT ROMLESS 52PLCCMicrocontrollers52-PLCC (19.1x19.1)N/A-40°C ~ 85°C (TA)
Core Processor:
HC11
Core Size:
8-Bit
Speed:
2MHz
Connectivity:
SCI, SPI
Peripherals:
POR, WDT
Number of I/O:
38
Program Memory Type:
ROMless
EEPROM Size:
512 x 8
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
52-PLCC (19.1×19.1)
Package / Case:
52-LCC (J-Lead)
107
MC68HCP11E1CFNE3MC68HCP11E1CFNE3NXP SemiconductorsIC MCU 8BIT ROMLESS 52PLCCMicrocontrollers52-PLCC (19.1x19.1)N/A-40°C ~ 85°C (TA)
Core Processor:
HC11
Core Size:
8-Bit
Speed:
3MHz
Connectivity:
SCI, SPI
Peripherals:
POR, WDT
Number of I/O:
38
Program Memory Type:
ROMless
EEPROM Size:
512 x 8
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
52-PLCC (19.1×19.1)
Package / Case:
52-LCC (J-Lead)
994
MC68HRC705KJ1CPMC68HRC705KJ1CPNXP SemiconductorsIC MCU 8BIT 1.2KB OTP 16DIPMicrocontrollers16-PDIPN/A-40°C ~ 85°C (TA)
Core Processor:
HC05
Core Size:
8-Bit
Speed:
4.2MHz
Peripherals:
POR, WDT
Number of I/O:
14
Program Memory Size:
1.2KB (1.2K x 8)
Program Memory Type:
OTP
RAM Size:
64 x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Through Hole
Supplier Device Package:
16-PDIP
Package / Case:
16-DIP (0.300″”, 7.62mm)
402
MC68HRC908JK1CDWN/AMC68HRC908JK1CDWNXP SemiconductorsIC MCU 8BIT 1.5KB FLASH 20SOICMicrocontrollers20-SOICN/A-40°C ~ 85°C (TA)
Core Processor:
HC08
Core Size:
8-Bit
Speed:
8MHz
Peripherals:
LED, LVD, POR, PWM
Number of I/O:
15
Program Memory Size:
1.5KB (1.5K x 8)
Program Memory Type:
FLASH
RAM Size:
128 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.3V
Data Converters:
A/D 12x8b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
20-SOIC
Package / Case:
20-SOIC (0.295″”, 7.50mm Width)
195
MC68HRC908JK1CPN/AMC68HRC908JK1CPNXP SemiconductorsIC MCU 8BIT 1.5KB FLASH 20DIPMicrocontrollers20-DIPN/A-40°C ~ 85°C (TA)
Core Processor:
HC08
Core Size:
8-Bit
Speed:
8MHz
Peripherals:
LED, LVD, POR, PWM
Number of I/O:
15
Program Memory Size:
1.5KB (1.5K x 8)
Program Memory Type:
FLASH
RAM Size:
128 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.3V
Data Converters:
A/D 12x8b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Through Hole
Supplier Device Package:
20-DIP
Package / Case:
20-DIP (0.300″”, 7.62mm)
1,278
MC68HRC908JK3CDWN/AMC68HRC908JK3CDWNXP SemiconductorsIC MCU 8BIT 4KB FLASH 20SOICMicrocontrollers20-SOICN/A-40°C ~ 85°C (TA)
Core Processor:
HC08
Core Size:
8-Bit
Speed:
8MHz
Peripherals:
LED, LVD, POR, PWM
Number of I/O:
15
Program Memory Size:
4KB (4K x 8)
Program Memory Type:
FLASH
RAM Size:
128 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.3V
Data Converters:
A/D 12x8b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
20-SOIC
Package / Case:
20-SOIC (0.295″”, 7.50mm Width)
194
MC68HRC908JK3CPN/AMC68HRC908JK3CPNXP SemiconductorsIC MCU 8BIT 4KB FLASH 20DIPMicrocontrollers20-DIPN/A-40°C ~ 85°C (TA)
Core Processor:
HC08
Core Size:
8-Bit
Speed:
8MHz
Peripherals:
LED, LVD, POR, PWM
Number of I/O:
15
Program Memory Size:
4KB (4K x 8)
Program Memory Type:
FLASH
RAM Size:
128 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.3V
Data Converters:
A/D 12x8b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Through Hole
Supplier Device Package:
20-DIP
Package / Case:
20-DIP (0.300″”, 7.62mm)
1,799

See What We Have to Offer!

See What We Have to Offer!

keyboard_arrow_up