Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

Featured Brands

About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,052
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
MC68HRC98JL3ECDWMC68HRC98JL3ECDWNXP SemiconductorsIC MCU 8BIT 4KB FLASH 28SOICMicrocontrollers28-SOICN/A-40°C ~ 85°C (TA)
Core Processor:
HC08
Core Size:
8-Bit
Speed:
8MHz
Peripherals:
LED, LVD, POR, PWM
Number of I/O:
15
Program Memory Size:
4KB (4K x 8)
Program Memory Type:
FLASH
RAM Size:
128 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.3V
Data Converters:
A/D 12x8b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
28-SOIC
Package / Case:
28-SOIC (0.295″”, 7.50mm Width)
1,034
MC68HSC705J1ACPEMC68HSC705J1ACPENXP SemiconductorsIC MCU 8BIT 1.2KB OTP 20DIPMicrocontrollers20-DIPN/A-40°C ~ 85°C (TA)
Core Processor:
HC05
Core Size:
8-Bit
Speed:
4MHz
Peripherals:
POR, WDT
Number of I/O:
14
Program Memory Size:
1.2KB (1.2K x 8)
Program Memory Type:
OTP
RAM Size:
64 x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Through Hole
Supplier Device Package:
20-DIP
Package / Case:
20-DIP (0.300″”, 7.62mm)
1,440
MC68HSR705J1ACPEMC68HSR705J1ACPENXP SemiconductorsIC MCU 8BIT 1.2KB OTP 20DIPMicrocontrollers20-DIPN/A-40°C ~ 85°C (TA)
Core Processor:
HC05
Core Size:
8-Bit
Speed:
4MHz
Peripherals:
POR, WDT
Number of I/O:
14
Program Memory Size:
1.2KB (1.2K x 8)
Program Memory Type:
OTP
RAM Size:
64 x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Through Hole
Supplier Device Package:
20-DIP
Package / Case:
20-DIP (0.300″”, 7.62mm)
869
MC68L11E1CFNE2MC68L11E1CFNE2NXP SemiconductorsIC MCU 8BIT ROMLESS 52PLCCMicrocontrollers52-PLCC (19.1x19.1)N/A-40°C ~ 85°C (TA)
Core Processor:
HC11
Core Size:
8-Bit
Speed:
2MHz
Connectivity:
SCI, SPI
Peripherals:
POR, WDT
Number of I/O:
38
Program Memory Type:
ROMless
EEPROM Size:
512 x 8
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 8x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
52-PLCC (19.1×19.1)
Package / Case:
52-LCC (J-Lead)
892
MC68L11E1FNE2MC68L11E1FNE2NXP SemiconductorsIC MCU 8BIT ROMLESS 52PLCCMicrocontrollers52-PLCC (19.1x19.1)N/A0°C ~ 70°C (TA)
Core Processor:
HC11
Core Size:
8-Bit
Speed:
2MHz
Connectivity:
SCI, SPI
Peripherals:
POR, WDT
Number of I/O:
38
Program Memory Type:
ROMless
EEPROM Size:
512 x 8
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 8x8b
Oscillator Type:
Internal
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
52-PLCC (19.1×19.1)
Package / Case:
52-LCC (J-Lead)
1,855
MC68L11F1CFNE3MC68L11F1CFNE3NXP SemiconductorsIC MCU 8BIT ROMLESS 68PLCCMicrocontrollers68-PLCC (24.21x24.21)N/A-40°C ~ 85°C (TA)
Core Processor:
HC11
Core Size:
8-Bit
Speed:
3MHz
Connectivity:
SCI, SPI
Peripherals:
POR, WDT
Number of I/O:
30
Program Memory Type:
ROMless
EEPROM Size:
512 x 8
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 8x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
68-PLCC (24.21×24.21)
Package / Case:
68-LCC (J-Lead)
132
MC68L11K1FUE2MC68L11K1FUE2NXP SemiconductorsIC MCU 8BIT ROMLESS 80QFPMicrocontrollers80-QFP (14x14)N/A0°C ~ 70°C (TA)
Core Processor:
HC11
Core Size:
8-Bit
Speed:
2MHz
Connectivity:
SCI, SPI
Peripherals:
POR, PWM, WDT
Number of I/O:
37
Program Memory Type:
ROMless
EEPROM Size:
640 x 8
RAM Size:
768 x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 8x8b
Oscillator Type:
Internal
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-QFP (14×14)
Package / Case:
80-QFP
631
MC68LC040FE25AMC68LC040FE25ANXP SemiconductorsIC MPU M680X0 25MHZ 184CQFPMicroprocessors184-CQFP (31.3x31.3)N/A0°C ~ 70°C (TA)
Core Processor:
68040
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
25MHz
Graphics Acceleration:
No
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
184-BCQFP
Supplier Device Package:
184-CQFP (31.3×31.3)
1,028
MC68LC040RC25AMC68LC040RC25ANXP SemiconductorsIC MPU M680X0 25MHZ 179PGAMicroprocessors179-PGA (47.24x47.24)N/A0°C ~ 70°C (TA)
Core Processor:
68040
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
25MHz
Graphics Acceleration:
No
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Through Hole
Package / Case:
179-BEPGA
Supplier Device Package:
179-PGA (47.24×47.24)
169
MC68LC040RC33AMC68LC040RC33ANXP SemiconductorsIC MPU M680X0 33MHZ 179PGAMicroprocessors179-PGA (47.24x47.24)N/A0°C ~ 70°C (TA)
Core Processor:
68040
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
33MHz
Graphics Acceleration:
No
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Through Hole
Package / Case:
179-BEPGA
Supplier Device Package:
179-PGA (47.24×47.24)
923
MC68LC060BRC66MC68LC060BRC66NXP SemiconductorsIC MPU M680X0 66MHZ 206PGAMicroprocessors206-PGA (47.25x47.25)N/A-40°C ~ 70°C (TA)
Core Processor:
68060
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
66MHz
Graphics Acceleration:
No
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 70°C (TA)
Mounting Type:
Through Hole
Package / Case:
206-BPGA
Supplier Device Package:
206-PGA (47.25×47.25)
340
MC68LC060RC50MC68LC060RC50NXP SemiconductorsIC MPU M680X0 50MHZ 206PGAMicroprocessors206-PGA (47.25x47.25)N/A0°C ~ 70°C (TA)
Core Processor:
68060
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
50MHz
Graphics Acceleration:
No
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Through Hole
Package / Case:
206-BPGA
Supplier Device Package:
206-PGA (47.25×47.25)
960
MC68LC060RC66MC68LC060RC66NXP SemiconductorsIC MPU M680X0 66MHZ 206PGAMicroprocessors206-PGA (47.25x47.25)N/A0°C ~ 70°C (TA)
Core Processor:
68060
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
66MHz
Graphics Acceleration:
No
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Through Hole
Package / Case:
206-BPGA
Supplier Device Package:
206-PGA (47.25×47.25)
1,874
MC68LC060RC75MC68LC060RC75NXP SemiconductorsIC MPU M680X0 75MHZ 206PGAMicroprocessors206-PGA (47.25x47.25)N/A0°C ~ 70°C (TA)
Core Processor:
68060
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
75MHz
Graphics Acceleration:
No
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Through Hole
Package / Case:
206-BPGA
Supplier Device Package:
206-PGA (47.25×47.25)
866
MC68LC302AF16CTMC68LC302AF16CTNXP SemiconductorsIC MPU M683XX 16MHZ 100LQFPMicroprocessors100-LQFP (14x14)N/A0°C ~ 70°C (TA)
Core Processor:
M68000
Number of Cores/Bus Width:
1 Core, 8/16-Bit
Speed:
16MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
100-LQFP
Supplier Device Package:
100-LQFP (14×14)
1,209
MC68LC302AF16VCTMC68LC302AF16VCTNXP SemiconductorsIC MPU M683XX 16MHZ 100LQFPMicroprocessors100-LQFP (14x14)N/A0°C ~ 70°C (TA)
Core Processor:
M68000
Number of Cores/Bus Width:
1 Core, 8/16-Bit
Speed:
16MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
100-LQFP
Supplier Device Package:
100-LQFP (14×14)
1,794
MC68LC302AF20CTMC68LC302AF20CTNXP SemiconductorsIC MPU M683XX 20MHZ 100LQFPMicroprocessors100-LQFP (14x14)N/A0°C ~ 70°C (TA)
Core Processor:
M68000
Number of Cores/Bus Width:
1 Core, 8/16-Bit
Speed:
20MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
100-LQFP
Supplier Device Package:
100-LQFP (14×14)
1,164
MC68LC302AF20VCTMC68LC302AF20VCTNXP SemiconductorsIC MPU M683XX 20MHZ 100LQFPMicroprocessors100-LQFP (14x14)N/A0°C ~ 70°C (TA)
Core Processor:
M68000
Number of Cores/Bus Width:
1 Core, 8/16-Bit
Speed:
20MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
100-LQFP
Supplier Device Package:
100-LQFP (14×14)
1,479
MC68LC302AF25CTMC68LC302AF25CTNXP SemiconductorsIC MPU M683XX 25MHZ 100LQFPMicroprocessors100-LQFP (14x14)N/A0°C ~ 70°C (TA)
Core Processor:
M68000
Number of Cores/Bus Width:
1 Core, 8/16-Bit
Speed:
25MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
100-LQFP
Supplier Device Package:
100-LQFP (14×14)
1,087
MC68LC302CAF16CTMC68LC302CAF16CTNXP SemiconductorsIC MPU M683XX 16MHZ 100LQFPMicroprocessors100-LQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
M68000
Number of Cores/Bus Width:
1 Core, 8/16-Bit
Speed:
16MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Voltage – I/O:
5.0V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
100-LQFP
Supplier Device Package:
100-LQFP (14×14)
561

See What We Have to Offer!

See What We Have to Offer!

keyboard_arrow_up