 | | MC68HRC98JL3ECDW | NXP Semiconductors | IC MCU 8BIT 4KB FLASH 28SOIC | Microcontrollers | 28-SOIC | N/A | -40°C ~ 85°C (TA) | Peripherals: LED, LVD, POR, PWM Program Memory Size: 4KB (4K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 3.3V Data Converters: A/D 12x8b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 28-SOIC Package / Case: 28-SOIC (0.295″”, 7.50mm Width) | 1,034 | |
 | | MC68HSC705J1ACPE | NXP Semiconductors | IC MCU 8BIT 1.2KB OTP 20DIP | Microcontrollers | 20-DIP | N/A | -40°C ~ 85°C (TA) | Program Memory Size: 1.2KB (1.2K x 8) Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Through Hole Supplier Device Package: 20-DIP Package / Case: 20-DIP (0.300″”, 7.62mm) | 1,440 | |
 | | MC68HSR705J1ACPE | NXP Semiconductors | IC MCU 8BIT 1.2KB OTP 20DIP | Microcontrollers | 20-DIP | N/A | -40°C ~ 85°C (TA) | Program Memory Size: 1.2KB (1.2K x 8) Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Through Hole Supplier Device Package: 20-DIP Package / Case: 20-DIP (0.300″”, 7.62mm) | 869 | |
 | | MC68L11E1CFNE2 | NXP Semiconductors | IC MCU 8BIT ROMLESS 52PLCC | Microcontrollers | 52-PLCC (19.1x19.1) | N/A | -40°C ~ 85°C (TA) | Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 52-PLCC (19.1×19.1) Package / Case: 52-LCC (J-Lead) | 892 | |
 | | MC68L11E1FNE2 | NXP Semiconductors | IC MCU 8BIT ROMLESS 52PLCC | Microcontrollers | 52-PLCC (19.1x19.1) | N/A | 0°C ~ 70°C (TA) | Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 52-PLCC (19.1×19.1) Package / Case: 52-LCC (J-Lead) | 1,855 | |
 | | MC68L11F1CFNE3 | NXP Semiconductors | IC MCU 8BIT ROMLESS 68PLCC | Microcontrollers | 68-PLCC (24.21x24.21) | N/A | -40°C ~ 85°C (TA) | Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 68-PLCC (24.21×24.21) Package / Case: 68-LCC (J-Lead) | 132 | |
 | | MC68L11K1FUE2 | NXP Semiconductors | IC MCU 8BIT ROMLESS 80QFP | Microcontrollers | 80-QFP (14x14) | N/A | 0°C ~ 70°C (TA) | Peripherals: POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 80-QFP (14×14) | 631 | |
 | | MC68LC040FE25A | NXP Semiconductors | IC MPU M680X0 25MHZ 184CQFP | Microprocessors | 184-CQFP (31.3x31.3) | N/A | 0°C ~ 70°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 184-CQFP (31.3×31.3) | 1,028 | |
 | | MC68LC040RC25A | NXP Semiconductors | IC MPU M680X0 25MHZ 179PGA | Microprocessors | 179-PGA (47.24x47.24) | N/A | 0°C ~ 70°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Through Hole Supplier Device Package: 179-PGA (47.24×47.24) | 169 | |
 | | MC68LC040RC33A | NXP Semiconductors | IC MPU M680X0 33MHZ 179PGA | Microprocessors | 179-PGA (47.24x47.24) | N/A | 0°C ~ 70°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Through Hole Supplier Device Package: 179-PGA (47.24×47.24) | 923 | |
 | | MC68LC060BRC66 | NXP Semiconductors | IC MPU M680X0 66MHZ 206PGA | Microprocessors | 206-PGA (47.25x47.25) | N/A | -40°C ~ 70°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Operating Temperature: -40°C ~ 70°C (TA) Mounting Type: Through Hole Supplier Device Package: 206-PGA (47.25×47.25) | 340 | |
 | | MC68LC060RC50 | NXP Semiconductors | IC MPU M680X0 50MHZ 206PGA | Microprocessors | 206-PGA (47.25x47.25) | N/A | 0°C ~ 70°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Through Hole Supplier Device Package: 206-PGA (47.25×47.25) | 960 | |
 | | MC68LC060RC66 | NXP Semiconductors | IC MPU M680X0 66MHZ 206PGA | Microprocessors | 206-PGA (47.25x47.25) | N/A | 0°C ~ 70°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Through Hole Supplier Device Package: 206-PGA (47.25×47.25) | 1,874 | |
 | | MC68LC060RC75 | NXP Semiconductors | IC MPU M680X0 75MHZ 206PGA | Microprocessors | 206-PGA (47.25x47.25) | N/A | 0°C ~ 70°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Through Hole Supplier Device Package: 206-PGA (47.25×47.25) | 866 | |
 | | MC68LC302AF16CT | NXP Semiconductors | IC MPU M683XX 16MHZ 100LQFP | Microprocessors | 100-LQFP (14x14) | N/A | 0°C ~ 70°C (TA) | Number of Cores/Bus Width: 1 Core, 8/16-Bit Co-Processors/DSP: Communications; RISC CPM Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LQFP (14×14) | 1,209 | |
 | | MC68LC302AF16VCT | NXP Semiconductors | IC MPU M683XX 16MHZ 100LQFP | Microprocessors | 100-LQFP (14x14) | N/A | 0°C ~ 70°C (TA) | Number of Cores/Bus Width: 1 Core, 8/16-Bit Co-Processors/DSP: Communications; RISC CPM Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LQFP (14×14) | 1,794 | |
 | | MC68LC302AF20CT | NXP Semiconductors | IC MPU M683XX 20MHZ 100LQFP | Microprocessors | 100-LQFP (14x14) | N/A | 0°C ~ 70°C (TA) | Number of Cores/Bus Width: 1 Core, 8/16-Bit Co-Processors/DSP: Communications; RISC CPM Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LQFP (14×14) | 1,164 | |
 | | MC68LC302AF20VCT | NXP Semiconductors | IC MPU M683XX 20MHZ 100LQFP | Microprocessors | 100-LQFP (14x14) | N/A | 0°C ~ 70°C (TA) | Number of Cores/Bus Width: 1 Core, 8/16-Bit Co-Processors/DSP: Communications; RISC CPM Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LQFP (14×14) | 1,479 | |
 | | MC68LC302AF25CT | NXP Semiconductors | IC MPU M683XX 25MHZ 100LQFP | Microprocessors | 100-LQFP (14x14) | N/A | 0°C ~ 70°C (TA) | Number of Cores/Bus Width: 1 Core, 8/16-Bit Co-Processors/DSP: Communications; RISC CPM Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LQFP (14×14) | 1,087 | |
 | | MC68LC302CAF16CT | NXP Semiconductors | IC MPU M683XX 16MHZ 100LQFP | Microprocessors | 100-LQFP (14x14) | N/A | -40°C ~ 85°C (TA) | Number of Cores/Bus Width: 1 Core, 8/16-Bit Co-Processors/DSP: Communications; RISC CPM Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LQFP (14×14) | 561 | |