 | | MC68LC302CAF20CT | NXP Semiconductors | IC MPU M683XX 20MHZ 100LQFP | Microprocessors | 100-LQFP (14x14) | N/A | -40°C ~ 85°C (TA) | Number of Cores/Bus Width: 1 Core, 8/16-Bit Co-Processors/DSP: Communications; RISC CPM Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LQFP (14×14) | 1,815 | |
 | | MC68LC302CPU16CT | NXP Semiconductors | IC MPU M683XX 16MHZ 100LQFP | Microprocessors | 100-LQFP (14x14) | N/A | -40°C ~ 85°C (TA) | Number of Cores/Bus Width: 1 Core, 8/16-Bit Co-Processors/DSP: Communications; RISC CPM Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LQFP (14×14) | 754 | |
 | | MC68LC302CPU20CT | NXP Semiconductors | IC MPU M683XX 20MHZ 100LQFP | Microprocessors | 100-LQFP (14x14) | N/A | -40°C ~ 85°C (TA) | Number of Cores/Bus Width: 1 Core, 8/16-Bit Co-Processors/DSP: Communications; RISC CPM Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LQFP (14×14) | 560 | |
 | | MC68LC302PU16CT | NXP Semiconductors | IC MPU M683XX 16MHZ 100LQFP | Microprocessors | 100-LQFP (14x14) | N/A | 0°C ~ 70°C (TA) | Number of Cores/Bus Width: 1 Core, 8/16-Bit Co-Processors/DSP: Communications; RISC CPM Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LQFP (14×14) | 1,322 | |
 | | MC68LC302PU16VCT | NXP Semiconductors | IC MPU M683XX 16MHZ 100LQFP | Microprocessors | 100-LQFP (14x14) | N/A | 0°C ~ 70°C (TA) | Number of Cores/Bus Width: 1 Core, 8/16-Bit Co-Processors/DSP: Communications; RISC CPM Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LQFP (14×14) | 238 | |
 | | MC68LC302PU20CT | NXP Semiconductors | IC MPU M683XX 20MHZ 100LQFP | Microprocessors | 100-LQFP (14x14) | N/A | 0°C ~ 70°C (TA) | Number of Cores/Bus Width: 1 Core, 8/16-Bit Co-Processors/DSP: Communications; RISC CPM Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LQFP (14×14) | 140 | |
 | | MC68LC302PU20VCT | NXP Semiconductors | IC MPU M683XX 20MHZ 100LQFP | Microprocessors | 100-LQFP (14x14) | N/A | 0°C ~ 70°C (TA) | Number of Cores/Bus Width: 1 Core, 8/16-Bit Co-Processors/DSP: Communications; RISC CPM Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LQFP (14×14) | 316 | |
 | | MC68LK332ACAG16 | NXP Semiconductors | IC MCU 32BIT ROMLESS 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 85°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, SCI, SPI, UART/USART Peripherals: POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 664 | |
 | | MC68LK332ACEH16 | NXP Semiconductors | IC MCU 32BIT ROMLESS 132PQFP | Microcontrollers | 132-PQFP (24.13x24.13) | N/A | -40°C ~ 85°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, SCI, SPI, UART/USART Peripherals: POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 132-PQFP (24.13×24.13) Package / Case: 132-BQFP Bumpered | 478 | |
 | | MC68LK332ACPV16 | NXP Semiconductors | IC MCU 32BIT ROMLESS 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 85°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, SCI, SPI, UART/USART Peripherals: POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 339 | |
 | | MC68LK332GCAG16 | NXP Semiconductors | IC MCU 32BIT ROMLESS 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 85°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, SCI, SPI, UART/USART Peripherals: POR, PWM, WDT Program Memory Type: ROMless Oscillator Type: External, Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 467 | |
 | | MC68LK332GCEH16 | NXP Semiconductors | IC MCU 32BIT ROMLESS 132PQFP | Microcontrollers | 132-PQFP (24.13x24.13) | N/A | -40°C ~ 85°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, SCI, SPI, UART/USART Peripherals: POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 132-PQFP (24.13×24.13) Package / Case: 132-BQFP Bumpered | 1,231 | |
 | | MC68LK332GCPV16 | NXP Semiconductors | IC MCU 32BIT ROMLESS 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 85°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, SCI, SPI, UART/USART Peripherals: POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 5 | |
 | | MC68MH360AI25L | NXP Semiconductors | IC MPU M683XX 25MHZ 240FQFP | Microprocessors | 240-FQFP (32x32) | N/A | 0°C ~ 70°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 240-FQFP (32×32) | 441 | |
 | | MC68MH360AI25VL | NXP Semiconductors | IC MPU M683XX 25MHZ 240FQFP | Microprocessors | 240-FQFP (32x32) | N/A | 0°C ~ 70°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 240-FQFP (32×32) | 1,909 | |
 | | MC68MH360AI33L | NXP Semiconductors | IC MPU M683XX 33MHZ 240FQFP | Microprocessors | 240-FQFP (32x32) | N/A | 0°C ~ 70°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 240-FQFP (32×32) | 893 | |
 | | MC68MH360CAI25L | NXP Semiconductors | IC MPU M683XX 25MHZ 240FQFP | Microprocessors | 240-FQFP (32x32) | N/A | -40°C ~ 85°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 240-FQFP (32×32) | 539 | |
 | N/A | MC68MH360EM33L | NXP Semiconductors | IC MPU M683XX 33MHZ 240FQFP | Microprocessors | 240-FQFP (32x32) | N/A | 0°C ~ 70°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 240-FQFP (32×32) | 570 | |
| N/A | | MC68MH360RC25L | NXP Semiconductors | IC MPU M683XX 25MHZ 241PGA | Microprocessors | 241-PGA (47.24x47.24) | N/A | 0°C ~ 70°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Through Hole Supplier Device Package: 241-PGA (47.24×47.24) | 160 | |
 | | MC68MH360ZP25VL | NXP Semiconductors | IC MPU M683XX 25MHZ 357BGA | Microprocessors | 357-PBGA (25x25) | N/A | 0°C ~ 70°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 357-PBGA (25×25) | 101 | |