Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

Featured Brands

About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,052
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
MC68VZ328CAGMC68VZ328CAGNXP SemiconductorsIC MPU M683XX 33MHZ 144LQFPMicroprocessors144-LQFP (20x20)3.0V-40°C – 85°C
Core Processor:
FLX68000
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
33MHz
Mounting Type:
Surface Mount
1,037
MC68VZ328CAGR2MC68VZ328CAGR2NXP SemiconductorsIC MPU M683XX 33MHZ 144LQFPMicroprocessors144-LQFP (20x20)3.0V-40°C – 85°C
Core Processor:
FLX68000
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
33MHz
Mounting Type:
Surface Mount
238
MC68VZ328CVPMC68VZ328CVPNXP SemiconductorsIC MPU M683XX 33MHZ 144MAPBGAMicroprocessors144-MAPBGA (13x13)3.0V-40°C – 85°C
Core Processor:
FLX68000
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
33MHz
Mounting Type:
Surface Mount
265
MC68VZ328CVPR2MC68VZ328CVPR2NXP SemiconductorsIC MPU M683XX 33MHZ 144MAPBGAMicroprocessors144-MAPBGA (13x13)3.0V-40°C – 85°C
Core Processor:
FLX68000
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
33MHz
Mounting Type:
Surface Mount
249
MC68VZ328VPMC68VZ328VPNXP SemiconductorsIC MPU M683XX 33MHZ 144MAPBGAMicroprocessors144-MAPBGA (13x13)3.0V0°C – 70°C
Core Processor:
FLX68000
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
33MHz
Mounting Type:
Surface Mount
711
MC705B16NBEMC705B16NBENXP SemiconductorsIC MCU 8BIT 15KB OTP 56PSDIPMicrocontrollers56-PSDIPN/A0°C ~ 70°C (TA)
Core Processor:
HC05
Core Size:
8-Bit
Speed:
2.1MHz
Connectivity:
SCI
Peripherals:
POR, WDT
Number of I/O:
32
Program Memory Size:
15KB (15K x 8)
Program Memory Type:
OTP
EEPROM Size:
256 x 8
RAM Size:
352 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x8b
Oscillator Type:
Internal
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Through Hole
Supplier Device Package:
56-PSDIP
Package / Case:
56-SDIP (0.600″”, 15.24mm)
843
MC705B16NCBEMC705B16NCBENXP SemiconductorsIC MCU 8BIT 15KB OTP 56PSDIPMicrocontrollers56-PSDIPN/A-40°C ~ 85°C (TA)
Core Processor:
HC05
Core Size:
8-Bit
Speed:
2.1MHz
Connectivity:
SCI
Peripherals:
POR, WDT
Number of I/O:
32
Program Memory Size:
15KB (15K x 8)
Program Memory Type:
OTP
EEPROM Size:
256 x 8
RAM Size:
352 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Through Hole
Supplier Device Package:
56-PSDIP
Package / Case:
56-SDIP (0.600″”, 15.24mm)
565
MC705B16NCFNERMC705B16NCFNERNXP SemiconductorsIC MCU 8BIT 15KB OTP 52PLCCMicrocontrollers52-PLCC (19.1x19.1)N/A-40°C ~ 85°C (TA)
Core Processor:
HC05
Core Size:
8-Bit
Speed:
2.1MHz
Connectivity:
SCI
Peripherals:
POR, WDT
Number of I/O:
32
Program Memory Size:
15KB (15K x 8)
Program Memory Type:
OTP
EEPROM Size:
256 x 8
RAM Size:
352 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
52-PLCC (19.1×19.1)
Package / Case:
52-LCC (J-Lead)
46
MC705C8ABEMC705C8ABENXP SemiconductorsIC MCU 8BIT 8KB OTP 42DIPMicrocontrollers42-PDIPN/A0°C ~ 70°C (TA)
Core Processor:
HC05
Core Size:
8-Bit
Speed:
2.1MHz
Connectivity:
SCI, SPI
Peripherals:
POR, WDT
Number of I/O:
24
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
OTP
RAM Size:
304 x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Oscillator Type:
Internal
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Through Hole
Supplier Device Package:
42-PDIP
Package / Case:
42-SDIP (0.600″”, 15.24mm)
1,261
MC705C8ACBEMC705C8ACBENXP SemiconductorsIC MCU 8BIT 8KB OTP 42DIPMicrocontrollers42-PDIPN/A-40°C ~ 85°C (TA)
Core Processor:
HC05
Core Size:
8-Bit
Speed:
2.1MHz
Connectivity:
SCI, SPI
Peripherals:
POR, WDT
Number of I/O:
24
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
OTP
RAM Size:
304 x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Through Hole
Supplier Device Package:
42-PDIP
Package / Case:
42-SDIP (0.600″”, 15.24mm)
506
MC705C8ACFBEN/AMC705C8ACFBENXP SemiconductorsIC MCU 8BIT 8KB OTP 44QFPMicrocontrollers44-QFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
HC05
Core Size:
8-Bit
Speed:
2.1MHz
Connectivity:
SCI, SPI
Peripherals:
POR, WDT
Number of I/O:
24
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
OTP
RAM Size:
304 x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
44-QFP (10×10)
Package / Case:
44-QFP
208
MC705C8ACFNERN/AMC705C8ACFNERNXP SemiconductorsIC MCU 8BIT 8KB OTP 44PLCCMicrocontrollers44-PLCC (16.59x16.59)N/A-40°C ~ 85°C (TA)
Core Processor:
HC05
Core Size:
8-Bit
Speed:
2.1MHz
Connectivity:
SCI, SPI
Peripherals:
POR, WDT
Number of I/O:
24
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
OTP
RAM Size:
304 x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
44-PLCC (16.59×16.59)
Package / Case:
44-LCC (J-Lead)
1,048
MC705C8ACPBEN/AMC705C8ACPBENXP SemiconductorsIC MCU 8BIT 8KB OTP 44LQFPMicrocontrollers44-LQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
HC05
Core Size:
8-Bit
Speed:
2.1MHz
Connectivity:
SCI, SPI
Peripherals:
POR, WDT
Number of I/O:
24
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
OTP
RAM Size:
304 x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
44-LQFP (10×10)
Package / Case:
44-LQFP
1,325
MC705C8ACPEMC705C8ACPENXP SemiconductorsIC MCU 8BIT 8KB OTP 40DIPMicrocontrollers40-PDIPN/A-40°C ~ 85°C (TA)
Core Processor:
HC05
Core Size:
8-Bit
Speed:
2.1MHz
Connectivity:
SCI, SPI
Peripherals:
POR, WDT
Number of I/O:
24
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
OTP
RAM Size:
304 x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Through Hole
Supplier Device Package:
40-PDIP
Package / Case:
40-DIP (0.600″”, 15.24mm)
1,248
MC705C9ACPEMC705C9ACPENXP SemiconductorsIC MCU 8BIT 16KB OTP 40DIPMicrocontrollers40-PDIPN/A-40°C ~ 85°C (TA)
Core Processor:
HC05
Core Size:
8-Bit
Speed:
2.1MHz
Connectivity:
SCI, SPI
Peripherals:
POR, WDT
Number of I/O:
24
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
OTP
RAM Size:
352 x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Through Hole
Supplier Device Package:
40-PDIP
Package / Case:
40-DIP (0.600″”, 15.24mm)
547
MC705J1ACDWEMC705J1ACDWENXP SemiconductorsIC MCU 8BIT 1.2KB OTP 20SOICMicrocontrollers20-SOICN/A-40°C ~ 85°C (TA)
Core Processor:
HC05
Core Size:
8-Bit
Speed:
4MHz
Peripherals:
POR, WDT
Number of I/O:
14
Program Memory Size:
1.2KB (1.2K x 8)
Program Memory Type:
OTP
RAM Size:
64 x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
20-SOIC
Package / Case:
20-SOIC (0.295″”, 7.50mm Width)
603
MC705JJ7CDWEMC705JJ7CDWENXP SemiconductorsIC MCU 8BIT 6KB OTP 20SOICMicrocontrollers20-SOICN/A-40°C ~ 85°C (TA)
Core Processor:
HC05
Core Size:
8-Bit
Speed:
2.1MHz
Connectivity:
SIO
Peripherals:
POR, Temp Sensor, WDT
Number of I/O:
14
Program Memory Size:
6KB (6K x 8)
Program Memory Type:
OTP
RAM Size:
224 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 4x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
20-SOIC
Package / Case:
20-SOIC (0.295″”, 7.50mm Width)
1,211
MC705JP7CPEMC705JP7CPENXP SemiconductorsIC MCU 8BIT 6KB OTP 28DIPMicrocontrollers28-PDIPN/A-40°C ~ 85°C (TA)
Core Processor:
HC05
Core Size:
8-Bit
Speed:
2.1MHz
Connectivity:
SIO
Peripherals:
POR, Temp Sensor, WDT
Number of I/O:
22
Program Memory Size:
6KB (6K x 8)
Program Memory Type:
OTP
RAM Size:
224 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 4x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Through Hole
Supplier Device Package:
28-PDIP
Package / Case:
28-DIP (0.600″”, 15.24mm)
1,588
MC705L16CFUEMC705L16CFUENXP SemiconductorsIC MCU 8BIT 16KB OTP 80QFPMicrocontrollers80-QFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
HC05
Core Size:
8-Bit
Speed:
2.1MHz
Connectivity:
SPI
Peripherals:
LCD, POR, WDT
Number of I/O:
16
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
OTP
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-QFP (14×14)
Package / Case:
80-QFP
1,981
MC705P6ACDWEMC705P6ACDWENXP SemiconductorsIC MCU 8BIT 4.5KB OTP 28SOICMicrocontrollers28-SOICN/A-40°C ~ 85°C (TA)
Core Processor:
HC05
Core Size:
8-Bit
Speed:
2.1MHz
Connectivity:
SIO
Peripherals:
POR, WDT
Number of I/O:
21
Program Memory Size:
4.5KB (4.5K x 8)
Program Memory Type:
OTP
RAM Size:
176 x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 4x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
28-SOIC
Package / Case:
28-SOIC (0.295″”, 7.50mm Width)
265

See What We Have to Offer!

See What We Have to Offer!

keyboard_arrow_up