Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,052
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
MC7447AHX1333LBMC7447AHX1333LBNXP SemiconductorsIC MPU MPC74XX 1.333GHZ 360BGAMicroprocessors360-FCCBGA (25x25)N/A0°C ~ 105°C
Core Processor:
PowerPC G4
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.333GHz
Co-Processors/DSP:
Multimedia; SIMD
Graphics Acceleration:
No
Voltage – I/O:
1.8V, 2.5V
Operating Temperature:
0°C ~ 105°C
Mounting Type:
Surface Mount
Package / Case:
360-BCBGA, FCCBGA
Supplier Device Package:
360-FCCBGA (25×25)
388
MC7447AHX1420LBMC7447AHX1420LBNXP SemiconductorsIC MPU MPC74XX 1.42GHZ 360FCCBGAMicroprocessors360-FCCBGA (25x25)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC G4
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.42GHz
Co-Processors/DSP:
Multimedia; SIMD
Graphics Acceleration:
No
Voltage – I/O:
1.8V, 2.5V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
360-BCBGA, FCCBGA
Supplier Device Package:
360-FCCBGA (25×25)
658
MC7447AHX600NBMC7447AHX600NBNXP SemiconductorsIC MPU MPC74XX 600MHZ 360FCCBGAMicroprocessors360-FCCBGA (25x25)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC G4
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz
Co-Processors/DSP:
Multimedia; SIMD
Graphics Acceleration:
No
Voltage – I/O:
1.8V, 2.5V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
360-BCBGA, FCCBGA
Supplier Device Package:
360-FCCBGA (25×25)
1,755
MC7447AHX733NBMC7447AHX733NBNXP SemiconductorsIC MPU MPC74XX 733MHZ 360FCCBGAMicroprocessors360-FCCBGA (25x25)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC G4
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
733MHz
Co-Processors/DSP:
Multimedia; SIMD
Graphics Acceleration:
No
Voltage – I/O:
1.8V, 2.5V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
360-BCBGA, FCCBGA
Supplier Device Package:
360-FCCBGA (25×25)
698
MC7447AHX867NBMC7447AHX867NBNXP SemiconductorsIC MPU MPC74XX 867MHZ 360FCCBGAMicroprocessors360-FCCBGA (25x25)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC G4
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
867MHz
Co-Processors/DSP:
Multimedia; SIMD
Graphics Acceleration:
No
Voltage – I/O:
1.8V, 2.5V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
360-BCBGA, FCCBGA
Supplier Device Package:
360-FCCBGA (25×25)
240
MC7447ATHX1000NBMC7447ATHX1000NBNXP SemiconductorsIC MPU MPC74XX 1.0GHZ 360FCCBGAMicroprocessors360-FCCBGA (25x25)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC G4
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Multimedia; SIMD
Graphics Acceleration:
No
Voltage – I/O:
1.8V, 2.5V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
360-BCBGA, FCCBGA
Supplier Device Package:
360-FCCBGA (25×25)
171
MC7447ATHX1167NBMC7447ATHX1167NBNXP SemiconductorsIC MPU MPC74XX 1.167GHZ 360BGAMicroprocessors360-FCCBGA (25x25)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC G4
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.167GHZ
Co-Processors/DSP:
Multimedia; SIMD
Graphics Acceleration:
No
Voltage – I/O:
1.8V, 2.5V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
360-BCBGA, FCCBGA
Supplier Device Package:
360-FCCBGA (25×25)
1,002
MC7447AVS1000NBMC7447AVS1000NBNXP SemiconductorsIC MPU MPC74XX 1.0GHZ 360FCCLGAMicroprocessors360-FCCLGA (25x25)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC G4
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Multimedia; SIMD
Graphics Acceleration:
No
Voltage – I/O:
1.8V, 2.5V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
360-CLGA, FCCLGA
Supplier Device Package:
360-FCCLGA (25×25)
704
MC7447AVS1267LBMC7447AVS1267LBNXP SemiconductorsIC MPU MPC74XX 1.267GHZ 360LGAMicroprocessors360-FCCLGA (25x25)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC G4
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.267GHz
Co-Processors/DSP:
Multimedia; SIMD
Graphics Acceleration:
No
Voltage – I/O:
1.8V, 2.5V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
360-CLGA, FCCLGA
Supplier Device Package:
360-FCCLGA (25×25)
137
MC7447AVU1000LBMC7447AVU1000LBNXP SemiconductorsIC MPU MPC74XX 1.0GHZ 360FCCBGAMicroprocessors360-FCCBGA (25x25)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC G4
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Multimedia; SIMD
Graphics Acceleration:
No
Voltage – I/O:
1.8V, 2.5V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
360-BCBGA, FCCBGA
Supplier Device Package:
360-FCCBGA (25×25)
391
MC7447AVU1000NBMC7447AVU1000NBNXP SemiconductorsIC MPU MPC74XX 1.0GHZ 360FCCBGAMicroprocessors360-FCCBGA (25x25)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC G4
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Multimedia; SIMD
Graphics Acceleration:
No
Voltage – I/O:
1.8V, 2.5V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
360-BCBGA, FCCBGA
Supplier Device Package:
360-FCCBGA (25×25)
1,273
MC7447AVU1167NBMC7447AVU1167NBNXP SemiconductorsIC MPU MPC74XX 1.167GHZ 360BGAMicroprocessors360-FCCBGA (25x25)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC G4
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.167GHZ
Co-Processors/DSP:
Multimedia; SIMD
Graphics Acceleration:
No
Voltage – I/O:
1.8V, 2.5V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
360-BCBGA, FCCBGA
Supplier Device Package:
360-FCCBGA (25×25)
1,886
MC7447AVU1420LBMC7447AVU1420LBNXP SemiconductorsIC MPU MPC74XX 1.42GHZ 360FCCBGAMicroprocessors360-FCCBGA (25x25)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC G4
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.42GHz
Co-Processors/DSP:
Multimedia; SIMD
Graphics Acceleration:
No
Voltage – I/O:
1.8V, 2.5V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
360-BCBGA, FCCBGA
Supplier Device Package:
360-FCCBGA (25×25)
957
MC7447AVU600NBMC7447AVU600NBNXP SemiconductorsIC MPU MPC74XX 600MHZ 360FCCBGAMicroprocessors360-FCCBGA (25x25)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC G4
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz
Co-Processors/DSP:
Multimedia; SIMD
Graphics Acceleration:
No
Voltage – I/O:
1.8V, 2.5V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
360-BCBGA, FCCBGA
Supplier Device Package:
360-FCCBGA (25×25)
874
MC7447AVU733NBMC7447AVU733NBNXP SemiconductorsIC MPU MPC74XX 733MHZ 360FCCBGAMicroprocessors360-FCCBGA (25x25)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC G4
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
733MHz
Co-Processors/DSP:
Multimedia; SIMD
Graphics Acceleration:
No
Voltage – I/O:
1.8V, 2.5V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
360-BCBGA, FCCBGA
Supplier Device Package:
360-FCCBGA (25×25)
1,696
MC7447AVU867NBMC7447AVU867NBNXP SemiconductorsIC MPU MPC74XX 867MHZ 360FCCBGAMicroprocessors360-FCCBGA (25x25)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC G4
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
867MHz
Co-Processors/DSP:
Multimedia; SIMD
Graphics Acceleration:
No
Voltage – I/O:
1.8V, 2.5V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
360-BCBGA, FCCBGA
Supplier Device Package:
360-FCCBGA (25×25)
175
MC7448HX1000NCMC7448HX1000NCNXP SemiconductorsIC MPU MPC74XX 1.0GHZ 360FCCBGAMicroprocessors360-FCCBGA (25x25)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC G4
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Multimedia; SIMD
Graphics Acceleration:
No
Voltage – I/O:
1.5V, 1.8V, 2.5V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
360-BCBGA, FCCBGA
Supplier Device Package:
360-FCCBGA (25×25)
450
MC7448HX1000NDMC7448HX1000NDNXP SemiconductorsIC MPU MPC74XX 1.0GHZ 360FCCBGAMicroprocessors360-FCCBGA (25x25)1.5V, 1.8V, 2.5V0°C – 105°C
Core Processor:
PowerPC G4
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.0GHz
Mounting Type:
Surface Mount
1,257
MC7448HX1250NDMC7448HX1250NDNXP SemiconductorsIC MPU MPC74XX 1.25GHZ 360FCCBGAMicroprocessors360-FCCBGA (25x25)1.5V, 1.8V, 2.5V0°C – 105°C
Core Processor:
PowerPC G4
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.25GHz
Mounting Type:
Surface Mount
1,110
MC7448HX1267NCMC7448HX1267NCNXP SemiconductorsIC MPU MPC74XX 1.267GHZ 360BGAMicroprocessors360-FCCBGA (25x25)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC G4
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.267GHz
Co-Processors/DSP:
Multimedia; SIMD
Graphics Acceleration:
No
Voltage – I/O:
1.5V, 1.8V, 2.5V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
360-BCBGA, FCCBGA
Supplier Device Package:
360-FCCBGA (25×25)
434

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