MC7447ATHX1000NB

IC MPU MPC74XX 1.0GHZ 360FCCBGA
Part Description

PowerPC G4 Microprocessor IC MPC74xx 1 Core, 32-Bit 1.0GHz 360-FCCBGA (25x25)

Quantity 349 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMC7447
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; SIMDCore ProcessorPowerPC G4Device Package360-FCCBGA (25x25)
ECCN3A991A2Graphics AccelerationNoHTS Code8542.31.0001
Moisture Sensitivity Level1 (Unlimited)Mounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width1 Core, 32-BitOperating Temperature-40°C ~ 105°C (TA)Package / Case360-BCBGA, FCCBGA
REACH ComplianceREACH UnaffectedRoHS ComplianceRoHS non-compliantSpeed1.0GHz
Supplier Device Package360-FCCBGA (25×25)Voltage – I/O1.8V, 2.5V

Overview of MC7447ATHX1000NB – IC MPU MPC74XX 1.0GHz 360-FCCBGA

The MC7447ATHX1000NB is a PowerPC G4 microprocessor manufactured by NXP Semiconductors, engineered as a 32-bit, single-core MPU running at 1.0 GHz in a 360-FCCBGA (25×25) surface-mount package. It targets networking and embedded computing systems where a balanced mix of integer, floating-point and multimedia processing is required.

Qualified for industrial use and rated for operation from −40 °C to 105 °C, this device integrates core performance features and system-management capabilities to support reliable deployment in commercial and industrial embedded designs.

Key Features

  • Core and Architecture PowerPC G4 32-bit single-core implementation operating at 1.0 GHz, with a superscalar core architecture and support for double-precision floating-point operations.
  • Multimedia and SIMD Integrated SIMD multimedia unit to accelerate multimedia and DSP-style workloads.
  • On-chip Cache and L2 On-die cache structure including 32-Kbyte instruction and 32-Kbyte data caches and a 512-Kbyte L2 cache for improved system-level performance.
  • Memory and Bus Support Memory storage subsystem supports the MPX bus protocol and a subset of the 60x bus protocol for connection to main memory and system resources.
  • System and Debug Includes JTAG/COP interface, performance monitor, time base counter/decrementer and other system-level features for development and monitoring.
  • Power and Thermal Management Built-in thermal/power management features, temperature diode monitoring and Dynamic Frequency Switching (DFS) for adaptive performance and thermal control.
  • Package and Mounting 360-FCCBGA (25×25) surface-mount package for compact board-level integration.
  • Industrial Qualification and Temperature Range Industrial-qualified device rated for operation from −40 °C to 105 °C.
  • Environmental Compliance RoHS compliant.
  • Graphics Acceleration No dedicated graphics acceleration.

Typical Applications

  • Networking Equipment Suited for embedded networking and communications systems that benefit from PowerPC G4 processing and on-chip cache/L2 memory.
  • Embedded Computing Useful in compact embedded computing platforms requiring single-core 32-bit processing with DSP/multimedia support.
  • Industrial Control Systems Industrial qualification and a −40 °C to 105 °C operating range make the device appropriate for industrial automation and control applications.
  • Telecommunications Applicable to telecom and infrastructure modules where deterministic processing and integrated system features are required.

Unique Advantages

  • Integrated L2 Cache: The on-chip 512-Kbyte L2 cache combined with 32-Kbyte I/D caches reduces system memory latency and simplifies memory subsystem design.
  • Balanced Compute Capabilities: The PowerPC G4 core with double-precision FPU and SIMD multimedia unit provides balanced integer, floating-point and media processing in a single device.
  • Industrial Ready: Rated for −40 °C to 105 °C and listed as industrial qualification, supporting deployment in demanding ambient environments.
  • System Management Features: Thermal/power management, DFS and performance monitoring enable runtime adaptability and easier system-level tuning.
  • Compact BGA Package: 360-FCCBGA (25×25) surface-mount package delivers a small footprint for high-density board designs.
  • Standards-Based Bus Support: MPX bus protocol and subset of 60x bus protocol support simplify integration with legacy and system memory interfaces.

Why Choose MC7447ATHX1000NB?

The MC7447ATHX1000NB combines a PowerPC G4 single-core processor with on-chip cache and an integrated 512-Kbyte L2 to deliver a compact, capable solution for networking and embedded computing applications. Its combination of double-precision floating-point support, SIMD multimedia capabilities and system-level features such as JTAG/COP, performance monitoring and DFS make it suitable for designs that need balanced compute and system management in an industrial-qualified device.

Manufactured by NXP Semiconductors and RoHS compliant, the part is aimed at customers designing industrial and embedded systems requiring stable operation across a wide temperature range and a compact 360-FCCBGA package for streamlined board-level integration.

Request a quote or submit an inquiry to begin procurement for MC7447ATHX1000NB and evaluate how this PowerPC G4 microprocessor can fit into your next embedded or networking design.

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