MC7447ATHX1167NB
| Part Description |
PowerPC G4 Microprocessor IC MPC74xx 1 Core, 32-Bit 1.167GHZ 360-FCCBGA (25x25) |
|---|---|
| Quantity | 179 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | MC7447 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; SIMD | Core Processor | PowerPC G4 | Device Package | 360-FCCBGA (25x25) | ||
|---|---|---|---|---|---|---|---|
| ECCN | 3A991A2 | Graphics Acceleration | No | HTS Code | 8542.31.0001 | ||
| Moisture Sensitivity Level | 1 (Unlimited) | Mounting Method | Surface Mount | Mounting Type | Surface Mount | ||
| Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | -40°C ~ 105°C (TA) | Package / Case | 360-BCBGA, FCCBGA | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | RoHS non-compliant | Speed | 1.167GHZ | ||
| Supplier Device Package | 360-FCCBGA (25×25) | Voltage – I/O | 1.8V, 2.5V |
Overview of MC7447ATHX1167NB – PowerPC G4 1.167 GHz 360-FCCBGA
The MC7447ATHX1167NB is a single-core PowerPC G4 microprocessor implementing a 32-bit RISC architecture clocked at 1.167 GHz. It combines a superscalar core with a 512-Kbyte L2 cache and integrated multimedia extensions to address networking and embedded computing system needs.
Designed for industrial applications, the device offers on-chip floating-point and SIMD multimedia units, system-level features for thermal and power management, and a compact 360-FCCBGA (25×25) surface-mount package suitable for space-constrained boards and harsh operating environments.
Key Features
- Core Architecture PowerPC G4 single-core, 32-bit superscalar microprocessor with double-precision floating-point support.
- Clock Speed 1.167 GHz operating frequency providing deterministic single-core performance.
- On‑Chip Cache Integrated 512-Kbyte L2 cache to reduce external memory access and improve application throughput.
- Multimedia & DSP Extensions SIMD multimedia unit and DSP-style capabilities to accelerate data-parallel workloads.
- System Interfaces Memory subsystem supports the MPX bus protocol and a subset of the 60x bus protocol for main memory and system resource connectivity.
- Power & Thermal Management Features include Dynamic Frequency Switching (DFS), a temperature diode, and on-chip power/thermal management to aid system-level energy and thermals control.
- Debug & Monitoring JTAG/COP interface and performance monitor support for board bring-up and runtime analysis.
- Package & Mounting 360-ball FCCBGA package (25×25) in a surface-mount form factor for compact, high-density assemblies.
- Operating Range & Qualification Industrial-qualified device with an operating temperature range of −40 °C to 105 °C and RoHS compliance.
- Graphics No dedicated graphics acceleration; processing resources are focused on compute and multimedia tasks.
Typical Applications
- Networking Equipment Suited for routers, switches, and network appliances where single-core deterministic processing and system-level integration are required.
- Embedded Computing Used in embedded controllers and compute blades that benefit from a high-performance RISC core and integrated L2 cache.
- Industrial Control Designed for industrial systems requiring an industrial temperature range and robust thermal/power management.
- Communications Infrastructure Applicable to communications modules and protocol processing where DSP-style multimedia instructions accelerate packet and signal processing.
Unique Advantages
- Balanced Single‑Core Performance: 1.167 GHz PowerPC G4 core with double-precision FPU provides predictable compute performance for control and signal-processing tasks.
- Integrated Cache Reduces Memory Bottlenecks: 512-Kbyte L2 cache reduces dependence on external memory for improved application responsiveness.
- Embedded Multimedia Acceleration: SIMD multimedia unit accelerates data-parallel workloads without requiring external accelerators.
- Robust System Management Features: Built-in DFS, thermal diode, and power management features help optimize runtime power and thermal behavior.
- Industrial Temperature Capability: −40 °C to 105 °C operating range supports deployment in temperature-challenging environments.
- Compact, High‑Density Packaging: 360-FCCBGA (25×25) surface-mount package enables compact board designs and high interconnect density.
Why Choose MC7447ATHX1167NB?
The MC7447ATHX1167NB combines a proven PowerPC G4 superscalar core with integrated L2 cache, multimedia extensions, and system management features to deliver a focused solution for networking and embedded computing applications. Its industrial qualification and wide operating temperature range make it suitable for designs that require sustained performance in demanding environments.
This part is appropriate for designers seeking a single-core, deterministic processor with on-chip acceleration for multimedia workloads, integrated power/thermal controls, and a compact FCCBGA package to simplify board-level integration and thermal planning.
If you would like pricing, availability, or a formal quote for the MC7447ATHX1167NB, please request a quote or submit an inquiry to our sales team. We can provide lead-time information and support for your design evaluation and procurement needs.

Date Founded: 2006
Headquarters: Eindhoven, North Brabant, Netherlands
Employees: 38,000+
Revenue: $10.53 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016