MC7447AVU1000NB
| Part Description |
PowerPC G4 Microprocessor IC MPC74xx 1 Core, 32-Bit 1.0GHz 360-FCCBGA (25x25) |
|---|---|
| Quantity | 130 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | MC7447 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; SIMD | Core Processor | PowerPC G4 | Device Package | 360-FCCBGA (25x25) | ||
|---|---|---|---|---|---|---|---|
| ECCN | 3A991A2 | Graphics Acceleration | No | HTS Code | 8542.31.0001 | ||
| Moisture Sensitivity Level | 1 (Unlimited) | Mounting Method | Surface Mount | Mounting Type | Surface Mount | ||
| Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | 0°C ~ 105°C (TA) | Package / Case | 360-BCBGA, FCCBGA | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | Speed | 1.0GHz | ||
| Supplier Device Package | 360-FCCBGA (25×25) | Voltage – I/O | 1.8V, 2.5V |
Overview of MC7447AVU1000NB – IC MPU MPC74XX 1.0GHZ 360FCCBGA
The MC7447AVU1000NB is a PowerPC G4 microprocessor — a single 32-bit core running at 1.0 GHz — designed for embedded networking and computing systems. It combines a superscalar core with a double-precision floating-point unit and an on-chip SIMD multimedia unit to address compute- and media-oriented embedded workloads.
Integrated system features and on-die memory reduce external component count while built-in thermal and power management features help maintain reliable operation across the specified 0 °C to 105 °C operating range.
Key Features
- Core Architecture PowerPC G4 32-bit single core at 1.0 GHz with a superscalar pipeline and double-precision floating-point support.
- Cache and Memory Subsystem Includes on-die 512-Kbyte L2 cache and 32-Kbyte instruction and 32-Kbyte data L1 caches to improve memory performance; supports the MPX bus protocol and a subset of the 60x bus protocol for system memory interfaces.
- Multimedia and DSP On-chip SIMD multimedia unit and multimedia co-processor support for accelerating signal and media processing tasks.
- System and Debug Integrated JTAG/COP interface, performance monitor, time base counter and decrementer provide visibility and control for development and optimization.
- Power & Thermal Management Thermal and power management features, temperature diode, clock multiplier and Dynamic Frequency Switching (DFS) for adaptive performance and thermal control.
- Package & Mounting 360-FCCBGA (25×25) surface-mount package (360-BCBGA, FCCBGA packing options) to support compact board layouts.
- Operating Range & Compliance Consumer-qualified device with an operating temperature range of 0 °C to 105 °C and RoHS-compliant manufacturing.
Typical Applications
- Networking and Computing Systems Targeted at networking and computing system applications where a 32-bit PowerPC core and integrated system features are required.
- Embedded Systems Suitable for embedded designs that need a compact, surface-mount processor with on-chip cache and system management features.
- Consumer Electronics Consumer-qualified processor for media-capable consumer devices that benefit from on-chip multimedia acceleration and RoHS compliance.
- Multimedia and Signal Processing Appliances On-die SIMD multimedia unit and co-processor capability for accelerating media and DSP tasks within embedded platforms.
Unique Advantages
- Balanced compute and memory integration: 1.0 GHz PowerPC G4 core combined with 512-Kbyte L2 cache and 32-Kbyte L1 I/D caches for responsive application performance without excessive external memory tuning.
- On-chip multimedia acceleration: SIMD multimedia unit reduces the need for separate DSP chips for many media and signal-processing tasks, lowering BOM complexity.
- Built-in system observability and control: JTAG/COP, performance monitor and time-base features simplify development, debugging and performance tuning.
- Thermal and frequency management: Temperature diode, thermal/power management and Dynamic Frequency Switching (DFS) enable adaptive operation across varying workloads and thermal conditions.
- Compact, manufacturable package: 360-FCCBGA (25×25) surface-mount package supports high-density board design while maintaining robust electrical and thermal interfaces.
- Consumer-grade compliance: Consumer qualification and RoHS compliance align the device with regulated consumer product manufacturing requirements.
Why Choose MC7447AVU1000NB?
The MC7447AVU1000NB positions itself as a practical, integrated solution for embedded networking and computing designs that require a 1.0 GHz PowerPC G4 core with on-die multimedia acceleration and a substantive L2 cache. Its combination of system features, debug interfaces and thermal/power management makes it suitable for development-focused environments and production consumer products alike.
Manufactured by NXP Semiconductors, the device benefits from documented hardware specifications and on-chip features that help reduce external component count and streamline system integration for designers working within the embedded and consumer markets.
Request a quote or submit a pricing inquiry to receive availability and lead-time information for the MC7447AVU1000NB.

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