MC7447AHX1420LB

IC MPU MPC74XX 1.42GHZ 360FCCBGA
Part Description

PowerPC G4 Microprocessor IC MPC74xx 1 Core, 32-Bit 1.42GHz 360-FCCBGA (25x25)

Quantity 1,255 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMC7447
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; SIMDCore ProcessorPowerPC G4Device Package360-FCCBGA (25x25)
ECCN3A991A2Graphics AccelerationNoHTS Code8542.31.0001
Moisture Sensitivity Level1 (Unlimited)Mounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width1 Core, 32-BitOperating Temperature0°C ~ 105°C (TA)Package / Case360-BCBGA, FCCBGA
REACH ComplianceREACH UnaffectedRoHS ComplianceRoHS non-compliantSpeed1.42GHz
Supplier Device Package360-FCCBGA (25×25)Voltage – I/O1.8V, 2.5V

Overview of MC7447AHX1420LB – IC MPU MPC74XX 1.42GHZ 360FCCBGA

The MC7447AHX1420LB is a PowerPC G4 microprocessor in a single‑core, 32‑bit implementation running at 1.42 GHz. It combines a high‑performance superscalar core with on‑chip system features and is targeted at networking and computing systems and embedded applications.

Designed by NXP Semiconductors, the device integrates a 512‑Kbyte L2 cache and includes multimedia/SIMD co‑processor capabilities, along with power and thermal management features suitable for consumer‑grade designs operating from 0 °C to 105 °C.

Key Features

  • Core and Performance — PowerPC G4 single‑core, 32‑bit processor running at 1.42 GHz, delivering superscalar execution for general‑purpose embedded and computing workloads.
  • On‑chip Cache — Integrated 512‑Kbyte L2 cache to reduce external memory bandwidth requirements and improve data locality for sustained performance.
  • Floating‑Point and Multimedia — Double‑precision floating‑point unit plus a SIMD multimedia unit to accelerate signal and media processing tasks.
  • System Interfaces — Memory storage subsystem supporting the MPX bus protocol and a subset of the 60x bus protocol for main memory and system resource connectivity.
  • Power and Thermal Management — Built‑in thermal/power management features and Dynamic Frequency Switching (DFS) to assist system power control and thermal response.
  • Debug and Test — JTAG/COP interface support for system debug and in‑circuit test integration.
  • Package and Mounting — 360‑FCCBGA (25×25) package, surface‑mount mounting for compact board designs.
  • Operating Range and Compliance — Consumer qualification with an operating temperature range of 0 °C to 105 °C; RoHS compliant.

Typical Applications

  • Networking and Communications — Suitable for network processing and control tasks where a PowerPC G4 core and L2 cache support packet handling and protocol processing.
  • Computing Systems — Applicable in compact computing platforms that require a single‑core 32‑bit processor with floating‑point and multimedia acceleration.
  • Embedded Appliances — Fits consumer embedded products that benefit from integrated cache, multimedia SIMD, and thermal/power management.

Unique Advantages

  • High single‑core throughput: 1.42 GHz PowerPC G4 core with superscalar architecture for sustained single‑threaded performance.
  • On‑chip L2 cache: 512‑Kbyte L2 reduces external memory accesses and improves responsiveness for embedded workloads.
  • Floating‑point and SIMD acceleration: Built‑in double‑precision FPU and multimedia unit accelerate numerically intensive and media tasks.
  • Integrated system features: MPX bus support, DFS, and thermal/power management simplify system design and control.
  • Compact, surface‑mount package: 360‑FCCBGA (25×25) package enables dense PCB layouts for space‑constrained applications.
  • Documented by supplier: Supported by manufacturer documentation from NXP Semiconductors and the associated MPC7447/A hardware specifications.

Why Choose MC7447AHX1420LB?

The MC7447AHX1420LB positions itself as a single‑core PowerPC G4 solution that balances compute capability, on‑chip cache, and multimedia acceleration for consumer and embedded networking or computing systems. Its integrated system features and thermal/power management facilities reduce external component count and help simplify board‑level design.

This device is appropriate for designers seeking a documented NXP Semiconductors PowerPC G4 implementation with a defined operating temperature range and a compact BGA footprint for medium‑density embedded platforms.

Request a quote or submit an inquiry to obtain pricing and availability for the MC7447AHX1420LB.

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