MC7447AHX1333LB

IC MPU MPC74XX 1.333GHZ 360BGA
Part Description

PowerPC G4 Microprocessor IC MPC74xx 1 Core, 32-Bit 1.333GHz 360-FCCBGA (25x25)

Quantity 654 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMC7447
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; SIMDCore ProcessorPowerPC G4Device Package360-FCCBGA (25x25)
ECCNOBSOLETEGraphics AccelerationNoHTS Code0000.00.0000
Moisture Sensitivity Level1 (Unlimited)Mounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width1 Core, 32-BitOperating Temperature0°C ~ 105°CPackage / Case360-BCBGA, FCCBGA
REACH ComplianceREACH UnaffectedRoHS ComplianceRoHS non-compliantSpeed1.333GHz
Supplier Device Package360-FCCBGA (25×25)Voltage – I/O1.8V, 2.5V

Overview of MC7447AHX1333LB – IC MPU MPC74XX 1.333GHz 360BGA

The MC7447AHX1333LB is a PowerPC G4 microprocessor offered by NXP Semiconductors, featuring a single 32-bit core running at 1.333 GHz. The device pairs a high-performance superscalar core with a 512-Kbyte L2 cache and integrated multimedia/SIMD capabilities, making it suitable for embedded and networking/compute-focused systems.

Packaged in a 360-ball FCC BGA (25×25) surface-mount package and rated for operation from 0 °C to 105 °C, the MC7447AHX1333LB targets consumer-class embedded applications that require floating-point performance and SIMD acceleration within a compact, RoHS-compliant form factor.

Key Features

  • Core & Architecture PowerPC G4 superscalar 32-bit core running at 1.333 GHz for deterministic, RISC-based processing.
  • Cache Integrated 512-Kbyte L2 cache to improve data locality and reduce memory access latency.
  • Floating-Point & Multimedia Double-precision floating-point unit plus a SIMD multimedia unit for accelerated numeric and media workloads.
  • System Interfaces & Bus Support Memory/storage subsystem supports the MPX bus protocol and a subset of the 60x bus protocol for main memory and system resource connectivity.
  • Power & Thermal Management On-chip thermal and power management features including a temperature diode and dynamic frequency switching (DFS) to assist in system-level energy and thermal control.
  • System Debug & Monitoring JTAG/COP interface and an on-chip performance monitor for system debug and runtime analysis.
  • Package & Mounting 360-FCCBGA (25×25) surface-mount package suited for compact board designs and dense system assemblies.
  • Environmental & Qualification Consumer qualification with RoHS compliance and an operating temperature range of 0 °C to 105 °C.

Typical Applications

  • Networking Equipment Suited for networking and communication systems that require a RISC-based core with floating-point and SIMD capabilities.
  • Embedded Compute Modules Compact embedded systems that benefit from an integrated L2 cache and on-chip power/thermal control.
  • Consumer Electronics Consumer-class devices requiring deterministic processing, multimedia acceleration, and a small BGA footprint.

Unique Advantages

  • Balanced Compute and Cache The combination of a 1.333 GHz PowerPC G4 core and 512-Kbyte L2 cache provides a balanced mix of processing throughput and on-chip memory bandwidth.
  • Accelerated Numeric and Media Processing Built-in double-precision FPU and SIMD multimedia unit deliver measurable benefits for numeric and media-oriented workloads.
  • System Integration MPX and 60x bus protocol support simplifies integration into existing memory and system architectures.
  • Thermal and Power Controls On-chip DFS and thermal monitoring features help maintain robust operation across the specified temperature range.
  • Compact Surface-Mount Package 360-FCCBGA (25×25) package enables high-density board designs while maintaining robust electrical and thermal characteristics.
  • Regulatory Compliance RoHS-compliant construction supports environmentally conscious product designs.

Why Choose MC7447AHX1333LB?

The MC7447AHX1333LB positions itself as a practical choice for designers needing a single-core PowerPC G4 processor with integrated L2 cache, floating-point performance, and SIMD multimedia acceleration. Its on-chip system features—such as DFS, performance monitoring, and JTAG/COP—help streamline development and runtime management for embedded and networking applications.

This part is well suited to consumer-class embedded designs that require a compact FCC BGA package and controlled operating temperature range, offering a combination of performance, integration, and vendor-backed documentation for system implementation.

Request a quote or submit an RFQ to receive pricing and availability information for the MC7447AHX1333LB and to discuss supply options for your design needs.

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