 | | MC705P6ACDWER | NXP Semiconductors | IC MCU 8BIT 4.5KB OTP 28SOIC | Microcontrollers | 28-SOIC | N/A | -40°C ~ 85°C (TA) | Program Memory Size: 4.5KB (4.5K x 8) Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 28-SOIC Package / Case: 28-SOIC (0.295″”, 7.50mm Width) | 1,109 | |
 | | MC705P6ACPE | NXP Semiconductors | IC MCU 8BIT 4.5KB OTP 28DIP | Microcontrollers | 28-PDIP | N/A | -40°C ~ 85°C (TA) | Program Memory Size: 4.5KB (4.5K x 8) Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Through Hole Supplier Device Package: 28-PDIP Package / Case: 28-DIP (0.600″”, 15.24mm) | 1,391 | |
 | | MC705P6AMDWE | NXP Semiconductors | IC MCU 8BIT 4.5KB OTP 28SOIC | Microcontrollers | 28-SOIC | N/A | -40°C ~ 125°C (TA) | Program Memory Size: 4.5KB (4.5K x 8) Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 28-SOIC Package / Case: 28-SOIC (0.295″”, 7.50mm Width) | 1,273 | |
 | N/A | MC705P6AMDWER | NXP Semiconductors | IC MCU 8BIT 4.5KB OTP 28SOIC | Microcontrollers | 28-SOIC | N/A | -40°C ~ 125°C (TA) | Program Memory Size: 4.5KB (4.5K x 8) Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 28-SOIC Package / Case: 28-SOIC (0.295″”, 7.50mm Width) | 1,296 | |
 | | MC705P6ECPE | NXP Semiconductors | IC MCU 8BIT 4.5KB OTP 28DIP | Microcontrollers | 28-PDIP | N/A | -40°C ~ 85°C (TA) | Program Memory Size: 4.5KB (4.5K x 8) Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Through Hole Supplier Device Package: 28-PDIP Package / Case: 28-DIP (0.600″”, 15.24mm) | 1,227 | |
 | | MC705X32CFUE4 | NXP Semiconductors | IC MCU 8BIT 32KB OTP 64QFP | Microcontrollers | 64-QFP (14x14) | N/A | -40°C ~ 85°C (TA) | Program Memory Size: 32KB (32K x 8) Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.5V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-QFP (14×14) | 379 | |
 | | MC705X32MFUE4 | NXP Semiconductors | IC MCU 8BIT 32KB OTP 64QFP | Microcontrollers | 64-QFP (14x14) | N/A | -40°C ~ 125°C (TA) | Program Memory Size: 32KB (32K x 8) Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.5V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-QFP (14×14) | 1,201 | |
 | | MC705X32VFUE | NXP Semiconductors | IC MCU 8BIT 32KB OTP 64QFP | Microcontrollers | 64-QFP (14x14) | N/A | -40°C ~ 105°C (TA) | Program Memory Size: 32KB (32K x 8) Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.5V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-QFP (14×14) | 1,557 | |
 | | MC711E9CFNE2R | NXP Semiconductors | IC MCU 8BIT 12KB OTP 52PLCC | Microcontrollers | 52-PLCC (19.1x19.1) | N/A | -40°C ~ 85°C (TA) | Program Memory Size: 12KB (12K x 8) Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.5V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 52-PLCC (19.1×19.1) Package / Case: 52-LCC (J-Lead) | 527 | |
 | | MC711K4CFNE3 | NXP Semiconductors | IC MCU 8BIT 24KB OTP 84PLCC | Microcontrollers | 84-PLCC (29.29x29.29) | N/A | -40°C ~ 85°C (TA) | Peripherals: POR, PWM, WDT Program Memory Size: 24KB (24K x 8) Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.5V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 84-PLCC (29.29×29.29) Package / Case: 84-LCC (J-Lead) | 496 | |
 | | MC711K4CFNE4 | NXP Semiconductors | IC MCU 8BIT 24KB OTP 84PLCC | Microcontrollers | 84-PLCC (29.29x29.29) | N/A | -40°C ~ 85°C (TA) | Peripherals: POR, PWM, WDT Program Memory Size: 24KB (24K x 8) Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.5V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 84-PLCC (29.29×29.29) Package / Case: 84-LCC (J-Lead) | 532 | |
 | | MC711K4CFUE4 | NXP Semiconductors | IC MCU 8BIT 24KB OTP 80QFP | Microcontrollers | 80-QFP (14x14) | N/A | -40°C ~ 85°C (TA) | Peripherals: POR, PWM, WDT Program Memory Size: 24KB (24K x 8) Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.5V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 80-QFP (14×14) | 498 | |
 | | MC711K4VFNE4 | NXP Semiconductors | IC MCU 8BIT 24KB OTP 84PLCC | Microcontrollers | 84-PLCC (29.29x29.29) | N/A | -40°C ~ 105°C (TA) | Peripherals: POR, PWM, WDT Program Memory Size: 24KB (24K x 8) Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.5V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 84-PLCC (29.29×29.29) Package / Case: 84-LCC (J-Lead) | 1,147 | |
 | | MC711K4VFUE4 | NXP Semiconductors | IC MCU 8BIT 24KB OTP 80QFP | Microcontrollers | 80-QFP (14x14) | N/A | -40°C ~ 105°C (TA) | Peripherals: POR, PWM, WDT Program Memory Size: 24KB (24K x 8) Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.5V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 80-QFP (14×14) | 583 | |
 | N/A | MC711P2CFNE4 | NXP Semiconductors | IC MCU 8BIT 32KB OTP 84PLCC | Microcontrollers | 84-PLCC (29.29x29.29) | N/A | -40°C ~ 85°C (TA) | Connectivity: MI Bus, SCI, SPI Peripherals: POR, PWM, WDT Program Memory Size: 32KB (32K x 8) Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.5V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 84-PLCC (29.29×29.29) Package / Case: 84-LCC (J-Lead) | 1,254 | |
 | | MC7410TVU400LE | NXP Semiconductors | IC MPU MPC74XX 400MHZ 360CBGA | Microprocessors | 360-CBGA (25x25) | 1.8V, 2.5V, 3.3V | -40°C – 105°C | Core Processor: PowerPC G4 Number of Cores/Bus Width: 1 Core, 32-Bit Mounting Type: Surface Mount | 628 | |
 | | MC7410VU500LE | NXP Semiconductors | IC MPU MPC74XX 500MHZ 360CBGA | Microprocessors | 360-CBGA (25x25) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC G4 Number of Cores/Bus Width: 1 Core, 32-Bit Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 360-BCBGA, FCCBGA Supplier Device Package: 360-CBGA (25×25) | 1,777 | |
 | | MC7447AHX1000LB | NXP Semiconductors | IC MPU MPC74XX 1.0GHZ 360FCCBGA | Microprocessors | 360-FCCBGA (25x25) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC G4 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; SIMD Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 360-BCBGA, FCCBGA Supplier Device Package: 360-FCCBGA (25×25) | 1,259 | |
 | | MC7447AHX1000NB | NXP Semiconductors | IC MPU MPC74XX 1.0GHZ 360FCCBGA | Microprocessors | 360-FCCBGA (25x25) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC G4 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; SIMD Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 360-BCBGA, FCCBGA Supplier Device Package: 360-FCCBGA (25×25) | 373 | |
 | | MC7447AHX1167NB | NXP Semiconductors | IC MPU MPC74XX 1.167GHZ 360BGA | Microprocessors | 360-FCCBGA (25x25) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC G4 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; SIMD Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 360-BCBGA, FCCBGA Supplier Device Package: 360-FCCBGA (25×25) | 1,321 | |