Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,052
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
MC705P6ACDWERMC705P6ACDWERNXP SemiconductorsIC MCU 8BIT 4.5KB OTP 28SOICMicrocontrollers28-SOICN/A-40°C ~ 85°C (TA)
Core Processor:
HC05
Core Size:
8-Bit
Speed:
2.1MHz
Connectivity:
SIO
Peripherals:
POR, WDT
Number of I/O:
21
Program Memory Size:
4.5KB (4.5K x 8)
Program Memory Type:
OTP
RAM Size:
176 x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 4x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
28-SOIC
Package / Case:
28-SOIC (0.295″”, 7.50mm Width)
1,109
MC705P6ACPEMC705P6ACPENXP SemiconductorsIC MCU 8BIT 4.5KB OTP 28DIPMicrocontrollers28-PDIPN/A-40°C ~ 85°C (TA)
Core Processor:
HC05
Core Size:
8-Bit
Speed:
2.1MHz
Connectivity:
SIO
Peripherals:
POR, WDT
Number of I/O:
21
Program Memory Size:
4.5KB (4.5K x 8)
Program Memory Type:
OTP
RAM Size:
176 x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 4x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Through Hole
Supplier Device Package:
28-PDIP
Package / Case:
28-DIP (0.600″”, 15.24mm)
1,391
MC705P6AMDWEMC705P6AMDWENXP SemiconductorsIC MCU 8BIT 4.5KB OTP 28SOICMicrocontrollers28-SOICN/A-40°C ~ 125°C (TA)
Core Processor:
HC05
Core Size:
8-Bit
Speed:
2.1MHz
Connectivity:
SIO
Peripherals:
POR, WDT
Number of I/O:
21
Program Memory Size:
4.5KB (4.5K x 8)
Program Memory Type:
OTP
RAM Size:
176 x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 4x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
28-SOIC
Package / Case:
28-SOIC (0.295″”, 7.50mm Width)
1,273
MC705P6AMDWERN/AMC705P6AMDWERNXP SemiconductorsIC MCU 8BIT 4.5KB OTP 28SOICMicrocontrollers28-SOICN/A-40°C ~ 125°C (TA)
Core Processor:
HC05
Core Size:
8-Bit
Speed:
2.1MHz
Connectivity:
SIO
Peripherals:
POR, WDT
Number of I/O:
21
Program Memory Size:
4.5KB (4.5K x 8)
Program Memory Type:
OTP
RAM Size:
176 x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 4x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
28-SOIC
Package / Case:
28-SOIC (0.295″”, 7.50mm Width)
1,296
MC705P6ECPEMC705P6ECPENXP SemiconductorsIC MCU 8BIT 4.5KB OTP 28DIPMicrocontrollers28-PDIPN/A-40°C ~ 85°C (TA)
Core Processor:
HC05
Core Size:
8-Bit
Speed:
2.1MHz
Connectivity:
SIO
Peripherals:
POR, WDT
Number of I/O:
21
Program Memory Size:
4.5KB (4.5K x 8)
Program Memory Type:
OTP
RAM Size:
176 x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 4x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Through Hole
Supplier Device Package:
28-PDIP
Package / Case:
28-DIP (0.600″”, 15.24mm)
1,227
MC705X32CFUE4MC705X32CFUE4NXP SemiconductorsIC MCU 8BIT 32KB OTP 64QFPMicrocontrollers64-QFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
HC05
Core Size:
8-Bit
Speed:
4MHz
Connectivity:
CANbus, SCI
Peripherals:
POR, WDT
Number of I/O:
24
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
OTP
EEPROM Size:
256 x 8
RAM Size:
528 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-QFP (14×14)
Package / Case:
64-QFP
379
MC705X32MFUE4MC705X32MFUE4NXP SemiconductorsIC MCU 8BIT 32KB OTP 64QFPMicrocontrollers64-QFP (14x14)N/A-40°C ~ 125°C (TA)
Core Processor:
HC05
Core Size:
8-Bit
Speed:
4MHz
Connectivity:
CANbus, SCI
Peripherals:
POR, WDT
Number of I/O:
24
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
OTP
EEPROM Size:
256 x 8
RAM Size:
528 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-QFP (14×14)
Package / Case:
64-QFP
1,201
MC705X32VFUEMC705X32VFUENXP SemiconductorsIC MCU 8BIT 32KB OTP 64QFPMicrocontrollers64-QFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
HC05
Core Size:
8-Bit
Speed:
4MHz
Connectivity:
CANbus, SCI
Peripherals:
POR, WDT
Number of I/O:
24
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
OTP
EEPROM Size:
256 x 8
RAM Size:
528 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-QFP (14×14)
Package / Case:
64-QFP
1,557
MC711E9CFNE2RMC711E9CFNE2RNXP SemiconductorsIC MCU 8BIT 12KB OTP 52PLCCMicrocontrollers52-PLCC (19.1x19.1)N/A-40°C ~ 85°C (TA)
Core Processor:
HC11
Core Size:
8-Bit
Speed:
2MHz
Connectivity:
SCI, SPI
Peripherals:
POR, WDT
Number of I/O:
38
Program Memory Size:
12KB (12K x 8)
Program Memory Type:
OTP
EEPROM Size:
512 x 8
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
52-PLCC (19.1×19.1)
Package / Case:
52-LCC (J-Lead)
527
MC711K4CFNE3MC711K4CFNE3NXP SemiconductorsIC MCU 8BIT 24KB OTP 84PLCCMicrocontrollers84-PLCC (29.29x29.29)N/A-40°C ~ 85°C (TA)
Core Processor:
HC11
Core Size:
8-Bit
Speed:
3MHz
Connectivity:
SCI, SPI
Peripherals:
POR, PWM, WDT
Number of I/O:
62
Program Memory Size:
24KB (24K x 8)
Program Memory Type:
OTP
EEPROM Size:
640 x 8
RAM Size:
768 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
84-PLCC (29.29×29.29)
Package / Case:
84-LCC (J-Lead)
496
MC711K4CFNE4MC711K4CFNE4NXP SemiconductorsIC MCU 8BIT 24KB OTP 84PLCCMicrocontrollers84-PLCC (29.29x29.29)N/A-40°C ~ 85°C (TA)
Core Processor:
HC11
Core Size:
8-Bit
Speed:
4MHz
Connectivity:
SCI, SPI
Peripherals:
POR, PWM, WDT
Number of I/O:
62
Program Memory Size:
24KB (24K x 8)
Program Memory Type:
OTP
EEPROM Size:
640 x 8
RAM Size:
768 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
84-PLCC (29.29×29.29)
Package / Case:
84-LCC (J-Lead)
532
MC711K4CFUE4MC711K4CFUE4NXP SemiconductorsIC MCU 8BIT 24KB OTP 80QFPMicrocontrollers80-QFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
HC11
Core Size:
8-Bit
Speed:
4MHz
Connectivity:
SCI, SPI
Peripherals:
POR, PWM, WDT
Number of I/O:
62
Program Memory Size:
24KB (24K x 8)
Program Memory Type:
OTP
EEPROM Size:
640 x 8
RAM Size:
768 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-QFP (14×14)
Package / Case:
80-QFP
498
MC711K4VFNE4MC711K4VFNE4NXP SemiconductorsIC MCU 8BIT 24KB OTP 84PLCCMicrocontrollers84-PLCC (29.29x29.29)N/A-40°C ~ 105°C (TA)
Core Processor:
HC11
Core Size:
8-Bit
Speed:
4MHz
Connectivity:
SCI, SPI
Peripherals:
POR, PWM, WDT
Number of I/O:
62
Program Memory Size:
24KB (24K x 8)
Program Memory Type:
OTP
EEPROM Size:
640 x 8
RAM Size:
768 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
84-PLCC (29.29×29.29)
Package / Case:
84-LCC (J-Lead)
1,147
MC711K4VFUE4MC711K4VFUE4NXP SemiconductorsIC MCU 8BIT 24KB OTP 80QFPMicrocontrollers80-QFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
HC11
Core Size:
8-Bit
Speed:
4MHz
Connectivity:
SCI, SPI
Peripherals:
POR, PWM, WDT
Number of I/O:
62
Program Memory Size:
24KB (24K x 8)
Program Memory Type:
OTP
EEPROM Size:
640 x 8
RAM Size:
768 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-QFP (14×14)
Package / Case:
80-QFP
583
MC711P2CFNE4N/AMC711P2CFNE4NXP SemiconductorsIC MCU 8BIT 32KB OTP 84PLCCMicrocontrollers84-PLCC (29.29x29.29)N/A-40°C ~ 85°C (TA)
Core Processor:
HC11
Core Size:
8-Bit
Speed:
4MHz
Connectivity:
MI Bus, SCI, SPI
Peripherals:
POR, PWM, WDT
Number of I/O:
50
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
OTP
EEPROM Size:
640 x 8
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
84-PLCC (29.29×29.29)
Package / Case:
84-LCC (J-Lead)
1,254
MC7410TVU400LEMC7410TVU400LENXP SemiconductorsIC MPU MPC74XX 400MHZ 360CBGAMicroprocessors360-CBGA (25x25)1.8V, 2.5V, 3.3V-40°C – 105°C
Core Processor:
PowerPC G4
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Mounting Type:
Surface Mount
628
MC7410VU500LEMC7410VU500LENXP SemiconductorsIC MPU MPC74XX 500MHZ 360CBGAMicroprocessors360-CBGA (25x25)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC G4
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
500MHz
Graphics Acceleration:
No
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
360-BCBGA, FCCBGA
Supplier Device Package:
360-CBGA (25×25)
1,777
MC7447AHX1000LBMC7447AHX1000LBNXP SemiconductorsIC MPU MPC74XX 1.0GHZ 360FCCBGAMicroprocessors360-FCCBGA (25x25)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC G4
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Multimedia; SIMD
Graphics Acceleration:
No
Voltage – I/O:
1.8V, 2.5V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
360-BCBGA, FCCBGA
Supplier Device Package:
360-FCCBGA (25×25)
1,259
MC7447AHX1000NBMC7447AHX1000NBNXP SemiconductorsIC MPU MPC74XX 1.0GHZ 360FCCBGAMicroprocessors360-FCCBGA (25x25)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC G4
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Multimedia; SIMD
Graphics Acceleration:
No
Voltage – I/O:
1.8V, 2.5V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
360-BCBGA, FCCBGA
Supplier Device Package:
360-FCCBGA (25×25)
373
MC7447AHX1167NBMC7447AHX1167NBNXP SemiconductorsIC MPU MPC74XX 1.167GHZ 360BGAMicroprocessors360-FCCBGA (25x25)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC G4
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.167GHZ
Co-Processors/DSP:
Multimedia; SIMD
Graphics Acceleration:
No
Voltage – I/O:
1.8V, 2.5V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
360-BCBGA, FCCBGA
Supplier Device Package:
360-FCCBGA (25×25)
1,321

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