MC68VZ328CAGR2

The MC68VZ328CAGR2 from NXP Semiconductors is a FLX68000-based microprocessor in the MC68VZ328 series, delivered in a 144-LQFP (20×20) surface-mount package. It integrates a single 32‑bit core running at 33 MHz and is targeted at embedded portable-system designs that benefit from high integration and flexible memory interfaces.

Built for compact, low‑component-count systems, the device combines core CPU functionality with system integration modules and memory controller support for DRAM and SDRAM, enabling streamlined designs for handheld and embedded applications.

Key Features

• Core – Static FLX68000 core (single 32‑bit core) providing the MC68VZ328 architecture.
• Clock Speed & Performance – 33 MHz processor clock; documented operation at 5.4 MIPS at 33 MHz as specified for the MC68VZ328 series.
• Memory Controllers – Integrated support for SDRAM and DRAM with a glueless interface to SRAM, DRAM, SDRAM, EPROM, and FLASH memory as described for the series.
• I/O Voltage – 3 V I/O voltage specification.
• Interfaces – On‑chip serial interfaces including UART and SPI (series documentation), plus PWM functionality indicated in device specifications.
• Bus & Compatibility – External M68000 bus interface with selectable bus sizing for 8‑bit and 16‑bit data ports (series capability).
• System Integration Module (SIM) – Integrated SIM reduces external array logic by consolidating system configuration and programmable address mapping (series feature).
• Package & Mounting – 144‑lead LQFP (20×20) surface‑mount package; supplied in Tape & Reel (TR) format for automated assembly.

Typical Applications

• Handheld Devices – Use in PDAs and similar portable systems that require compact, integrated processing and memory interfacing.
• Consumer Portable Electronics – Suitable for devices such as exercise monitors and personal navigation units where low board space and integrated peripherals reduce BOM.
• Mobile Communication Devices – Applicable to smart phones and other mobile platforms that leverage on‑chip UART/SPI and power‑saving static core features.

Unique Advantages

• Highly integrated system functions: The System Integration Module consolidates configuration and address mapping, reducing external glue logic and overall component count.
• Flexible memory support: Built‑in controllers for SDRAM and DRAM with glueless interfacing simplify memory subsystem design and speed time to market.
• Static core for power management: The FLX68000 static design allows the processor clock to be stopped for power savings in duty‑cycled and battery‑powered applications.
• Compact, production‑ready package: 144‑LQFP (20×20) surface‑mount footprint in Tape & Reel packaging supports high‑volume automated assembly.
• Mixed serial and control interfaces: On‑chip UART, SPI, and PWM capabilities provide common peripheral interconnects without requiring large external controller counts.

Why Choose MC68VZ328CAGR2?

The MC68VZ328CAGR2 positions itself as a compact, integrated microprocessor solution for embedded portable systems that need a 32‑bit FLX68000 core, flexible memory interfacing, and on‑chip peripheral support. Its combination of static core behavior, SDRAM/DRAM controllers, and system integration features helps reduce board area and component count while supporting common serial and control interfaces.

Engineers designing handheld and embedded products will find the MC68VZ328CAGR2 suitable for applications where integration, predictable 33 MHz performance, and automated assembly readiness (144‑LQFP, Tape & Reel) are priorities, backed by NXP Semiconductors as the device manufacturer.

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