MC68VZ328CAG
| Part Description |
FLX68000 Microprocessor IC M683xx 1 Core, 32-Bit 33MHz 144-LQFP (20x20) |
|---|---|
| Quantity | 1,598 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | MC68VZ328 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Core Processor | FLX68000 | Device Package | 144-LQFP (20x20) | Mounting Type | Surface Mount | ||
|---|---|---|---|---|---|---|---|
| Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | -40°C – 85°C | Package / Case | Tray | ||
| Speed | 33MHz | Voltage | 3.0V |
Overview of MC68VZ328CAG – IC MPU M683XX 33MHZ 144LQFP
The MC68VZ328CAG is a FLX68000-based microprocessor in a 144‑LQFP (20×20) surface‑mount package. It implements a single 32‑bit core running at a 33 MHz clock and targets compact embedded and portable systems.
Designed to reduce board space and parts count, the device integrates memory controllers and peripheral interfaces while supporting SDRAM and DRAM. Typical market segments include portable consumer devices and other embedded applications that benefit from integrated system functions and low-voltage I/O.
Key Features
- Static FLX68000 core — FLX68000 CPU core with a static design that allows the processor clock to be stopped for power savings and deterministic control.
- 33 MHz clock and measured throughput — Device operates at 33 MHz clock; product documentation cites 5.4 MIPS at 33 MHz.
- 32‑bit internal bus — Single 32‑bit core and internal address bus for native 32‑bit operation.
- Memory controllers and glueless interfaces — On‑chip system integration module provides glueless interfaces and programmable address mapping for SRAM, DRAM, SDRAM, EPROM, and FLASH; product data lists SDRAM and DRAM controllers.
- Peripheral interfaces — Integrated serial and peripheral functions referenced in product documentation include UART (with IRDA), SPI (master/slave, FIFO), PWM, and timers for common embedded I/O and control tasks.
- External bus compatibility — External M68000 bus interface with selectable bus sizing for 8‑bit and 16‑bit data ports as documented.
- 3 V I/O — I/O voltage specified as 3 V to match low‑voltage system requirements.
- Compact package — 144‑LQFP (20×20) surface‑mount package supplied in tray for high‑density PCB layouts and production handling.
Typical Applications
- Personal Digital Assistants (PDAs) — Integrated processor and display/IO support for compact handheld systems.
- Portable consumer devices — Useful in devices that require reduced board space and integrated memory/peripheral controllers.
- Navigation systems — On‑chip peripherals and memory interfaces suited to embedded navigation control and user interfaces.
- Exercise monitors and wearable electronics — Low‑voltage I/O, static core power control, and compact packaging support portable monitoring applications.
- Smart phones (embedded features) — Integration of system functions and peripheral interfaces applicable to handheld communications devices.
Unique Advantages
- Highly integrated system module: Programmable address mapping and glueless memory interfaces reduce external glue logic and lower BOM.
- Power management via static core: Static FLX68000 design allows stopping the processor clock for power savings in portable applications.
- Direct SDRAM/DRAM support: On‑chip memory controllers simplify system memory design and layout.
- Flexible external bus sizing: Selectable 8‑bit/16‑bit bus sizing eases integration with a range of peripheral and memory devices.
- Compact surface‑mount package: 144‑LQFP (20×20) minimizes PCB footprint for space‑constrained designs.
- Low‑voltage I/O: 3 V I/O compatibility supports low‑voltage system architectures.
Why Choose MC68VZ328CAG?
The MC68VZ328CAG combines a static FLX68000 core with integrated memory controllers and peripheral interfaces to deliver a compact, system‑oriented microprocessor solution. Its architecture and on‑chip system integration module are intended to reduce board complexity, save PCB area, and streamline design effort for embedded and portable products.
This part is suited to designers building compact handhelds and embedded devices that require integrated SDRAM/DRAM support, flexible bus interfacing, and a small form‑factor package. Product documentation indicates the device is fully tested and documented to support development and deployment in such applications.
Request a quote or submit an RFQ to check pricing and availability for the MC68VZ328CAG.

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Headquarters: Eindhoven, North Brabant, Netherlands
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