MC68MH360ZP25VL

The MC68MH360ZP25VL is a CPU32+ 32‑bit microprocessor in the MC68 series from NXP Semiconductors. It provides a single 32‑bit core running at 25 MHz with integrated communications and memory controller functions for embedded system designs.

Targeted at embedded and communications‑oriented applications, the device combines a communications processor module (CPM), serial channel controller (SCC) support and a DRAM controller with a compact 357‑PBGA (25×25) surface‑mount package, operating from 3.3 V I/O and across a commercial temperature range of 0 °C to 70 °C.

Key Features

• Core CPU32+ single core, 32‑bit architecture operating at 25 MHz for deterministic embedded processing.
• Communications & Co‑processing Integrated Communications Processor Module (CPM) and DSP co‑processor capabilities for communications tasks and protocol handling.
• Serial Interfaces Serial Channel Controller (SCC) support and QMC (QUICC Multichannel Controller) features referenced in MC68 series documentation for multi‑channel serial routing and time‑slot assignment.
• Memory & Bus On‑chip DRAM controller to interface with external DRAM, simplifying memory subsystem design.
• Ethernet Single 10 Mbps Ethernet interface for network connectivity.
• Power & I/O 3.3 V I/O signaling suitable for common embedded logic levels.
• Package & Mounting 357‑PBGA (25×25) package supplied in a surface‑mount form factor for compact PCB implementations.
• Operating Range & Compliance Commercial operating temperature range of 0 °C to 70 °C and RoHS compliant.

Typical Applications

• Embedded Communications Equipment Use the CPM, SCC support and 10 Mbps Ethernet to implement protocol handling, serial routing and network interfaces in communications systems.
• Network Peripheral Devices Suitable for controllers in networked peripherals that require a compact BGA package and integrated Ethernet connectivity.
• Industrial Embedded Control Single‑core CPU32+ processing with DRAM interface supports control and monitoring applications within the stated commercial temperature range.

Unique Advantages

• Integrated Communications Subsystem: CPM and SCC capabilities reduce external logic and simplify designs that require protocol processing and serial channel management.
• On‑board Memory Interface: DRAM controller integration streamlines memory subsystem design and board layout.
• Compact Surface‑Mount Package: 357‑PBGA (25×25) packaging enables high‑density PCB integration for space‑constrained applications.
• Standard I/O Voltage: 3.3 V I/O compatibility aligns with common embedded peripherals and interfaces.
• Regulatory Compliance: RoHS compliance supports modern manufacturing and environmental requirements.

Why Choose MC68MH360ZP25VL?

The MC68MH360ZP25VL positions itself as a practical choice for embedded designers who need a compact, communications‑capable 32‑bit microprocessor. With a CPU32+ core, integrated CPM and DRAM controller, and a 10 Mbps Ethernet interface, it addresses embedded and communications tasks while minimizing external component count.

Offered in a 357‑PBGA surface‑mount package and operating at 3.3 V I/O across a commercial temperature range, this device is suited to development of networked peripherals, communications modules and industrial embedded controllers where documented MC68 series features such as the QUICC multichannel controller and SCC support are required.

Request a quote or submit an inquiry to obtain pricing and availability for the MC68MH360ZP25VL for your next embedded design.