MC68LC302CAF20CT

The MC68LC302CAF20CT is an integrated multiprotocol microprocessor built around a static M68000 core. It delivers a single 8/16-bit core running at 20 MHz with on-chip peripherals and memory, optimized for embedded and industrial applications that require compact, low-power system integration.

With on-chip DMA, dual-port RAM, timers (including a watchdog and periodic interrupt timer), and communications controllers, this device targets portable, height-restricted and communications-oriented embedded systems where board space, power efficiency and peripheral integration matter.

Key Features

• Core & Architecture  Static M68000 core supporting an 8- or 16-bit system bus; single-core design running at 20 MHz.
• Clocking  On-chip clock generator and PLL allowing operation with 32 kHz or 4 MHz crystals for flexible system clocking.
• Memory & DMA  On-chip 1152-byte dual-port RAM plus an Independent DMA (IDMA) controller; includes four SDMA channels and one general-purpose DMA channel for efficient data movement without heavy external RAM dependence.
• Timers & Watchdog  Three timers including a watchdog timer and a Periodic Interrupt Timer (PIT) for real-time control and system reliability.
• Communications & Co-Processor  Communications-focused co-processor (RISC CPM) with two full-duplex Serial Communications Controllers (SCCs) supporting common protocols such as HDLC/SDLC, UART and BISYNC.
• Memory Interface & Boot  Glueless interface to EPROM, SRAM, Flash EPROM and EEPROM; supports boot in 8-bit mode with the ability to switch to 16-bit operation. Four programmable chip-select lines with wait-state generator logic and programmable address mapping.
• System Control & I/O  Interrupt controller, parallel I/O ports (some with interrupt capability), system status/control logic and hardware watchdog support for robust system management.
• Power & Package  Low-power standby modes for reduced energy consumption; supplied in a low-profile 100-LQFP (14×14) surface-mount package. Operating range: −40 °C to 85 °C. I/O voltage: 5 V.
• Additional Interfaces  Includes GCI interface capability for system integration.

Typical Applications

• Portable and Height-Restricted Devices  Low-profile 100-LQFP package and low-power modes make the device suitable for PCMCIA-style and other height-restricted embedded modules.
• Multiprotocol Communications Equipment  On-chip communications co-processor and SCCs enable use in protocol converters, modem controllers and data-link devices that require HDLC/SDLC, UART or BISYNC support.
• Industrial Embedded Control  Industrial qualification and wide operating temperature range support controllers, instrumentation and automation modules with integrated I/O and timing functions.
• Embedded System Controllers  Integrated DMA, dual-port RAM and glueless memory interfaces simplify designs for controllers that need reliable boot, deterministic timing and peripheral integration.

Unique Advantages

• Highly Integrated Peripherals: On-chip DMA, dual-port RAM, timers and communications controllers reduce external component count and simplify board design.
• Flexible Memory & Boot Options: Glueless interface to common nonvolatile and volatile memories plus 8-bit boot with switchable 16-bit operation eases firmware deployment and upgrade strategies.
• Compact, Low-Profile Package: 100-LQFP (14×14) surface-mount package conserves board area and suits height-constrained assemblies.
• Industrial Temperature Range: −40 °C to 85 °C qualification supports deployment in demanding environmental conditions.
• Integrated Communications Capability: Built-in CPM and SCCs provide multiprotocol support to accelerate communications-focused designs without extensive external logic.
• Vendor Proven Family: Part of the MC68LC302 series from NXP Semiconductors, providing continuity within the MC68LC302 product family.

Why Choose MC68LC302CAF20CT?

The MC68LC302CAF20CT delivers a balanced combination of M68000-class processing, on-chip peripherals and industrial-grade robustness in a compact 100-LQFP package. Its integrated DMA, dual-port RAM, communications controllers and flexible memory interfaces let designers reduce BOM complexity while maintaining deterministic control and reliable communications in embedded and industrial systems.

This part is well suited for engineers developing portable, height-constrained, or communications-centric embedded products that require a proven M68000 architecture, low-power modes and wide-temperature operation. Manufactured by NXP Semiconductors and offered as part of the MC68LC302 series, it supports designs that prioritize integration, reliability and predictable performance.

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