MC68LC302AF25CT

The MC68LC302AF25CT is a single-core microprocessor IC based on a static M68000 core, offering 8/16-bit system operation at a 25 MHz clock rate. It targets embedded applications that require an integrated multiprotocol processing architecture with on-chip system peripherals and low-profile packaging.

Designed for compact and low-power embedded systems, this device combines a static 68000 core, on-chip memory and peripheral controllers to simplify board design and accelerate system integration for communication and portable applications.

Key Features

• Core Static M68000 core providing 8- or 16-bit system bus operation at 25 MHz for deterministic embedded processing.
• Memory On-chip 1,152-byte dual-port RAM for fast internal data exchange and simplified shared-memory architectures.
• DMA and Peripheral Controllers Independent DMA controller (IDMA) and interrupt controller support system-level data movement and prioritized interrupt handling.
• Timers and Watchdog Three programmable timers including a watchdog timer and a periodic interrupt timer (PIT) for real-time timing, watchdog protection and scheduled wake-up.
• Communications and Co-Processing Integrated communications-oriented processing including a RISC CPM and serial communications controllers supporting common multiprotocol interfaces.
• System and Memory Interfaces Four programmable chip-select lines with wait-state logic, glueless interface to EPROM/SRAM/Flash/EEPROM, and a DRAM refresh controller for flexible memory configurations and boot options (8-bit boot with switch to 16-bit run).
• Clock and Power Management On-chip clock generator and PLL supporting operation with low-frequency crystals, plus low-power standby modes for reduced system power consumption.
• Package and Mounting Low-profile 100-LQFP (14 × 14 mm) surface-mount package suitable for height-restricted applications.
• I/O and Operating Conditions 5 V I/O signaling and an operating temperature range of 0 °C to 70 °C; RoHS compliant.

Typical Applications

• Portable and Low-Power Devices — Ideal for compact systems that require low-profile packaging and low-power standby modes, including height-restricted form factors.
• Embedded Communication Controllers — Suitable for multiprotocol communication tasks where integrated serial controllers and a communication processor simplify design.
• Bootable Embedded Systems — On-chip memory, glueless peripheral interfaces and selectable 8/16-bit boot modes support compact boot and system initialization designs.
• Memory-Managed Controllers — Built-in DMA, DRAM refresh controller and multiple chip-selects support systems requiring controlled memory access and external memory interfacing.

Unique Advantages

• Integrated System Peripherals: Reduces external component count by combining CPU, DMA, timers, dual-port RAM and serial controllers on-chip.
• Flexible Memory Interface: Four programmable chip-selects, DRAM refresh support and glueless external memory interfacing simplify board-level memory design.
• Compact Packaging: 100-LQFP (14×14 mm) surface-mount package enables deployment in height-restricted and space-constrained applications.
• Deterministic 68000 Core: Static M68000 core delivers predictable 8/16-bit operation at 25 MHz suitable for embedded control tasks.
• On-Chip Clocking and Low-Power Modes: Built-in clock generator and PLL plus standby modes enable flexible clock options and reduced power consumption.
• Development-Friendly Features: Dual-port RAM and programmable timers (including PIT and watchdog) facilitate debugging, real-time scheduling and robust system control.

Why Choose MC68LC302AF25CT?

The MC68LC302AF25CT positions itself as an integrated, compact microprocessor solution for embedded designs that require an M68000-class core combined with on-chip memory and peripheral controllers. Its combination of deterministic 8/16-bit processing at 25 MHz, integrated DMA/interrupt/timer subsystems and flexible memory interfacing makes it well suited to communication-oriented and portable embedded systems.

Engineers and designers benefit from reduced BOM complexity, simplified board layout in a low-profile 100-LQFP package, and a clear set of on-chip resources that accelerate time-to-market for systems needing reliable, compact processing and peripheral integration.

Request a quote or submit a pricing inquiry to receive lead-time and volume pricing details for the MC68LC302AF25CT. Our team can provide availability and support information to help you evaluate this device for your designs.