MC68MH360AI25VL

The MC68MH360AI25VL is a CPU32+ microprocessor IC in the M683xx family featuring a single 32‑bit core running at 25 MHz in a 240‑FQFP (32×32) package. It is supplied by NXP Semiconductors and categorized for embedded microprocessor applications.

On‑chip integration includes communications co‑processors (CPM), DRAM controller support, serial channel interfaces (SCC) and a 10 Mbps Ethernet controller, making the device suitable for embedded designs that combine control and communications functions within a commercial temperature range of 0 °C to 70 °C.

Key Features

• Core — CPU32+ single 32‑bit core running at 25 MHz for deterministic embedded processing.
• Memory and Controllers — On‑chip DRAM controller support for system memory interfacing.
• Communications Co‑processors — Dedicated communications co‑processors (CPM) to handle protocol and serial offload tasks.
• Ethernet — Integrated 10 Mbps Ethernet controller (1) for network connectivity.
• Serial Interfaces — Serial Communication Controller (SCC) interfaces for serial device connectivity; datasheet documents QMC/serial routing and time‑slot assignment capabilities.
• Package and Mounting — 240‑lead FQFP package (240‑FQFP, 32×32) designed for surface‑mount assembly.
• Voltage — 3.3 V I/O voltage compatibility.
• Operating Range — Commercial operating temperature range of 0 °C to 70 °C.
• Compliance — RoHS compliant.

Typical Applications

• Embedded communications modules — Use the on‑chip CPM, SCC and 10 Mbps Ethernet controller to implement serial and networked interfaces in embedded devices.
• Control and protocol offload — The CPU32+ core together with communications co‑processors supports designs that separate control tasks from protocol handling.
• System controller designs — DRAM controller support and a compact 240‑FQFP package fit compact embedded board layouts requiring both processing and memory interfacing.

Unique Advantages

• Integrated communications support: Communications co‑processors (CPM), SCC and documented QMC serial routing features reduce external interface logic and simplify protocol implementation.
• Network connectivity on‑board: Built‑in 10 Mbps Ethernet controller enables basic networked functionality without additional PHY/controller chips.
• Compact, surface‑mount package: 240‑FQFP (32×32) delivers high pin count and routing density in a standard surface‑mount footprint for production assembly.
• 3.3 V I/O compatibility: Standard 3.3 V I/O simplifies interfacing with contemporary logic and peripheral devices.
• Commercial temperature suitability: Rated for 0 °C to 70 °C operation for standard embedded and industrial applications.
• RoHS compliant: Meets environmental regulations for lead‑free manufacturing and assembly processes.

Why Choose MC68MH360AI25VL?

The MC68MH360AI25VL combines a CPU32+ 32‑bit core with dedicated communications co‑processors, DRAM controller support and an integrated 10 Mbps Ethernet controller in a 240‑FQFP package. This combination provides a balanced, integrated solution for embedded designs that require both control processing and communications interfacing within the commercial temperature range.

As a member of NXP Semiconductors' MC68 series, the device is positioned for engineers and procurement teams seeking a single‑chip approach to embedded control and serial/network connectivity while maintaining standard 3.3 V I/O and RoHS compliance.

Request a quote or submit a procurement inquiry to receive pricing and availability for the MC68MH360AI25VL.