Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

Featured Brands

About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,052
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
MC9S08QD4MPCMC9S08QD4MPCNXP SemiconductorsIC MCU 8BIT 4KB FLASH 8DIPMicrocontrollers8-PDIPN/A-40°C ~ 125°C (TA)
Core Processor:
S08
Core Size:
8-Bit
Speed:
16MHz
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
4
Program Memory Size:
4KB (4K x 8)
Program Memory Type:
FLASH
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 4x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Through Hole
Supplier Device Package:
8-PDIP
Package / Case:
8-DIP (0.300″”, 7.62mm)
1,357
MC9S08QD4MSCMC9S08QD4MSCNXP SemiconductorsIC MCU 8BIT 4KB FLASH 8SOICMicrocontrollers8-SOICN/A-40°C ~ 125°C (TA)
Core Processor:
S08
Core Size:
8-Bit
Speed:
16MHz
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
4
Program Memory Size:
4KB (4K x 8)
Program Memory Type:
FLASH
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 4x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
8-SOIC
Package / Case:
8-SOIC (0.154″”, 3.90mm Width)
689
MC9S08QD4MSCRMC9S08QD4MSCRNXP SemiconductorsIC MCU 8BIT 4KB FLASH 8SOICMicrocontrollers8-SOICN/A-40°C ~ 125°C (TA)
Core Processor:
S08
Core Size:
8-Bit
Speed:
16MHz
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
4
Program Memory Size:
4KB (4K x 8)
Program Memory Type:
FLASH
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 4x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
8-SOIC
Package / Case:
8-SOIC (0.154″”, 3.90mm Width)
1,343
MC9S08QD4VPCMC9S08QD4VPCNXP SemiconductorsIC MCU 8BIT 4KB FLASH 8DIPMicrocontrollers8-PDIPN/A-40°C ~ 105°C (TA)
Core Processor:
S08
Core Size:
8-Bit
Speed:
10MHz
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
4
Program Memory Size:
4KB (4K x 8)
Program Memory Type:
FLASH
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 4x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Through Hole
Supplier Device Package:
8-PDIP
Package / Case:
8-DIP (0.300″”, 7.62mm)
558
MC9S08QD4VSCMC9S08QD4VSCNXP SemiconductorsIC MCU 8BIT 4KB FLASH 8SOICMicrocontrollers8-SOICN/A-40°C ~ 105°C (TA)
Core Processor:
S08
Core Size:
8-Bit
Speed:
10MHz
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
4
Program Memory Size:
4KB (4K x 8)
Program Memory Type:
FLASH
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 4x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
8-SOIC
Package / Case:
8-SOIC (0.154″”, 3.90mm Width)
5
MC9S08QE128CFTMC9S08QE128CFTNXP SemiconductorsIC MCU 8BIT 128KB FLASH 48QFNMicrocontrollers48-QFN-EP (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
S08
Core Size:
8-Bit
Speed:
50MHz
Connectivity:
I2C, LINbus, SCI, SPI
Peripherals:
LVD, PWM, WDT
Number of I/O:
38
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 10x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-QFN-EP (7×7)
Package / Case:
48-VFQFN Exposed Pad
568
MC9S08QE128CFTRMC9S08QE128CFTRNXP SemiconductorsIC MCU 8BIT 128KB FLASH 48QFNMicrocontrollers48-QFN-EP (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
S08
Core Size:
8-Bit
Speed:
50MHz
Connectivity:
I2C, LINbus, SCI, SPI
Peripherals:
LVD, PWM, WDT
Number of I/O:
38
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 10x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-QFN-EP (7×7)
Package / Case:
48-VFQFN Exposed Pad
1,165
MC9S08QE128CLDMC9S08QE128CLDNXP SemiconductorsIC MCU 8BIT 128KB FLASH 44LQFPMicrocontrollers44-LQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
S08
Core Size:
8-Bit
Speed:
50MHz
Connectivity:
I2C, LINbus, SCI, SPI
Peripherals:
LVD, PWM, WDT
Number of I/O:
34
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 10x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
44-LQFP (10×10)
Package / Case:
44-LQFP
393
MC9S08QE128CLHMC9S08QE128CLHNXP SemiconductorsIC MCU 8BIT 128KB FLASH 64LQFPMicrocontrollers64-LQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
S08
Core Size:
8-Bit
Speed:
50MHz
Connectivity:
I2C, LINbus, SCI, SPI
Peripherals:
LVD, PWM, WDT
Number of I/O:
54
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 22x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LQFP (10×10)
Package / Case:
64-LQFP
297
MC9S08QE128CLHRMC9S08QE128CLHRNXP SemiconductorsIC MCU 8BIT 128KB FLASH 64LQFPMicrocontrollers64-LQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
S08
Core Size:
8-Bit
Speed:
50MHz
Connectivity:
I2C, LINbus, SCI, SPI
Peripherals:
LVD, PWM, WDT
Number of I/O:
54
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 22x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LQFP (10×10)
Package / Case:
64-LQFP
12
MC9S08QE128CLKMC9S08QE128CLKNXP SemiconductorsIC MCU 8BIT 128KB FLASH 80LQFPMicrocontrollers80-LQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
S08
Core Size:
8-Bit
Speed:
50MHz
Connectivity:
I2C, LINbus, SCI, SPI
Peripherals:
LVD, PWM, WDT
Number of I/O:
70
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 24x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-LQFP (14×14)
Package / Case:
80-LQFP
47
N/AMC9S08QE128CLKRNXP SemiconductorsS08QE 8-BIT MCU, S08 CORE, 128KBMicrocontrollers80-LQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
HCS08
Core Size:
8-Bit
Speed:
50.33MHz
Connectivity:
I2C, LINbus, SCI, SPI
Peripherals:
LVD, PWM, WDT
Number of I/O:
70
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 24x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-LQFP (14×14)
Package / Case:
80-LQFP
319
MC9S08QE16CFMMC9S08QE16CFMNXP SemiconductorsIC MCU 8BIT 16KB FLASH 32QFNMicrocontrollers32-QFN-EP (5x5)N/A-40°C ~ 85°C (TA)
Core Processor:
S08
Core Size:
8-Bit
Speed:
50MHz
Connectivity:
I2C, LINbus, SCI, SPI
Peripherals:
LVD, PWM, WDT
Number of I/O:
26
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 10x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-QFN-EP (5×5)
Package / Case:
32-VFQFN Exposed Pad
1,086
MC9S08QE16CFTMC9S08QE16CFTNXP SemiconductorsIC MCU 8BIT 16KB FLASH 48QFNMicrocontrollers48-QFN-EP (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
S08
Core Size:
8-Bit
Speed:
50MHz
Connectivity:
I2C, LINbus, SCI, SPI
Peripherals:
LVD, PWM, WDT
Number of I/O:
38
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 10x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-QFN-EP (7×7)
Package / Case:
48-VFQFN Exposed Pad
1,190
MC9S08QE16CLCMC9S08QE16CLCNXP SemiconductorsIC MCU 8BIT 16KB FLASH 32LQFPMicrocontrollers32-LQFP (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
S08
Core Size:
8-Bit
Speed:
50MHz
Connectivity:
I2C, LINbus, SCI, SPI
Peripherals:
LVD, PWM, WDT
Number of I/O:
26
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 10x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-LQFP (7×7)
Package / Case:
32-LQFP
932
MC9S08QE16CLDMC9S08QE16CLDNXP SemiconductorsIC MCU 8BIT 16KB FLASH 44LQFPMicrocontrollers44-LQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
S08
Core Size:
8-Bit
Speed:
50MHz
Connectivity:
I2C, LINbus, SCI, SPI
Peripherals:
LVD, PWM, WDT
Number of I/O:
34
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 10x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
44-LQFP (10×10)
Package / Case:
44-LQFP
1,205
MC9S08QE16CWLMC9S08QE16CWLNXP SemiconductorsIC MCU 8BIT 16KB FLASH 28SOICMicrocontrollers28-SOICN/A-40°C ~ 85°C (TA)
Core Processor:
S08
Core Size:
8-Bit
Speed:
50MHz
Connectivity:
I2C, LINbus, SCI, SPI
Peripherals:
LVD, PWM, WDT
Number of I/O:
22
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 10x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
28-SOIC
Package / Case:
28-SOIC (0.295″”, 7.50mm Width)
565
MC9S08QE32CFMMC9S08QE32CFMNXP SemiconductorsS08QE 8-BIT MCU, S08 CORE, 32KBMicrocontrollers32-QFN (5x5)N/A-40°C ~ 85°C (TA)
Core Processor:
HCS08
Core Size:
8-Bit
Speed:
50.33MHz
Connectivity:
I2C, LINbus, SCI, SPI
Peripherals:
LVD, PWM, WDT
Number of I/O:
26
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 10x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount, Wettable Flank
Supplier Device Package:
32-QFN (5×5)
Package / Case:
32-VFQFN Exposed Pad
620
MC9S08QE32CFMRN/AMC9S08QE32CFMRNXP SemiconductorsIC MCU 8BIT 32KB FLASH 32QFNMicrocontrollers32-HVQFN (5x5)N/A-40°C ~ 85°C (TA)
Core Processor:
S08
Core Size:
8-Bit
Speed:
50MHz
Connectivity:
I2C, LINbus, SCI, SPI
Peripherals:
LVD, PWM, WDT
Number of I/O:
26
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 10x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount, Wettable Flank
Supplier Device Package:
32-HVQFN (5×5)
Package / Case:
32-VFQFN Exposed Pad
1,241
MC9S08QE32CFTMC9S08QE32CFTNXP SemiconductorsIC MCU 8BIT 32KB FLASH 48QFNMicrocontrollers48-QFN-EP (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
S08
Core Size:
8-Bit
Speed:
50MHz
Connectivity:
I2C, LINbus, SCI, SPI
Peripherals:
LVD, PWM, WDT
Number of I/O:
38
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 10x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-QFN-EP (7×7)
Package / Case:
48-VFQFN Exposed Pad
1,452

See What We Have to Offer!

See What We Have to Offer!

keyboard_arrow_up