 | | MC9S08QE32CLC | NXP Semiconductors | IC MCU 8BIT 32KB FLASH 32LQFP | Microcontrollers | 32-LQFP (7x7) | N/A | -40°C ~ 85°C (TA) | Connectivity: I2C, LINbus, SCI, SPI Peripherals: LVD, PWM, WDT Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 10x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 32-LQFP (7×7) | 1,565 | |
 | | MC9S08QE32CLCR | NXP Semiconductors | IC MCU 8BIT 32KB FLASH 32LQFP | Microcontrollers | 32-LQFP (7x7) | N/A | -40°C ~ 85°C (TA) | Connectivity: I2C, LINbus, SCI, SPI Peripherals: LVD, PWM, WDT Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 10x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 32-LQFP (7×7) | 32 | |
 | | MC9S08QE32CLD | NXP Semiconductors | IC MCU 8BIT 32KB FLASH 44LQFP | Microcontrollers | 44-LQFP (10x10) | N/A | -40°C ~ 85°C (TA) | Connectivity: I2C, LINbus, SCI, SPI Peripherals: LVD, PWM, WDT Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 10x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 44-LQFP (10×10) | 518 | |
 | | MC9S08QE32CWL | NXP Semiconductors | IC MCU 8BIT 32KB FLASH 28SOIC | Microcontrollers | 28-SOIC | N/A | -40°C ~ 85°C (TA) | Connectivity: I2C, LINbus, SCI, SPI Peripherals: LVD, PWM, WDT Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 10x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 28-SOIC Package / Case: 28-SOIC (0.295″”, 7.50mm Width) | 1,581 | |
 | | MC9S08QE4CLC | NXP Semiconductors | IC MCU 8BIT 4KB FLASH 32LQFP | Microcontrollers | 32-LQFP (7x7) | N/A | -40°C ~ 85°C (TA) | Connectivity: I2C, LINbus, SCI, SPI Peripherals: LVD, PWM, WDT Program Memory Size: 4KB (4K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 10x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 32-LQFP (7×7) | 157 | |
 | | MC9S08QE4CLCR | NXP Semiconductors | IC MCU 8BIT 4KB FLASH 32LQFP | Microcontrollers | 32-LQFP (7x7) | N/A | -40°C ~ 85°C (TA) | Connectivity: I2C, LINbus, SCI, SPI Peripherals: LVD, PWM, WDT Program Memory Size: 4KB (4K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 10x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 32-LQFP (7×7) | 51 | |
 | | MC9S08QE4CPG | NXP Semiconductors | IC MCU 8BIT 4KB FLASH 16DIP | Microcontrollers | 16-PDIP | N/A | -40°C ~ 85°C (TA) | Connectivity: I2C, LINbus, SCI, SPI Peripherals: LVD, PWM, WDT Program Memory Size: 4KB (4K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 8x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Through Hole Supplier Device Package: 16-PDIP Package / Case: 16-DIP (0.300″”, 7.62mm) | 478 | |
 | | MC9S08QE4CTG | NXP Semiconductors | IC MCU 8BIT 4KB FLASH 16TSSOP | Microcontrollers | 16-TSSOP | N/A | -40°C ~ 85°C (TA) | Connectivity: I2C, LINbus, SCI, SPI Peripherals: LVD, PWM, WDT Program Memory Size: 4KB (4K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 8x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 16-TSSOP Package / Case: 16-TSSOP (0.173″”, 4.40mm Width) | 46 | |
 | | MC9S08QE4CTGR | NXP Semiconductors | IC MCU 8BIT 4KB FLASH 16TSSOP | Microcontrollers | 16-TSSOP | N/A | -40°C ~ 85°C (TA) | Connectivity: I2C, LINbus, SCI, SPI Peripherals: LVD, PWM, WDT Program Memory Size: 4KB (4K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 8x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 16-TSSOP Package / Case: 16-TSSOP (0.173″”, 4.40mm Width) | 1,338 | |
 | | MC9S08QE4CWJ | NXP Semiconductors | IC MCU 8BIT 4KB FLASH 20SOIC | Microcontrollers | 20-SOIC | N/A | -40°C ~ 85°C (TA) | Connectivity: I2C, LINbus, SCI, SPI Peripherals: LVD, PWM, WDT Program Memory Size: 4KB (4K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 8x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 20-SOIC Package / Case: 20-SOIC (0.295″”, 7.50mm Width) | 574 | |
 | | MC9S08QE4CWL | NXP Semiconductors | IC MCU 8BIT 4KB FLASH 28SOIC | Microcontrollers | 28-SOIC | N/A | -40°C ~ 85°C (TA) | Connectivity: I2C, LINbus, SCI, SPI Peripherals: LVD, PWM, WDT Program Memory Size: 4KB (4K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 10x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 28-SOIC Package / Case: 28-SOIC (0.295″”, 7.50mm Width) | 855 | |
 | | MC9S08QE64CFT | NXP Semiconductors | IC MCU 8BIT 64KB FLASH 48QFN | Microcontrollers | 48-QFN-EP (7x7) | N/A | -40°C ~ 85°C (TA) | Connectivity: I2C, LINbus, SCI, SPI Peripherals: LVD, PWM, WDT Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 10x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 48-QFN-EP (7×7) Package / Case: 48-VFQFN Exposed Pad | 339 | |
 | | MC9S08QE64CLC | NXP Semiconductors | IC MCU 8BIT 64KB FLASH 32LQFP | Microcontrollers | 32-LQFP (7x7) | N/A | -40°C ~ 85°C (TA) | Connectivity: I2C, LINbus, SCI, SPI Peripherals: LVD, PWM, WDT Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 10x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 32-LQFP (7×7) | 1,815 | |
 | | MC9S08QE64CLD | NXP Semiconductors | IC MCU 8BIT 64KB FLASH 44LQFP | Microcontrollers | 44-LQFP (10x10) | N/A | -40°C ~ 85°C (TA) | Connectivity: I2C, LINbus, SCI, SPI Peripherals: LVD, PWM, WDT Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 10x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 44-LQFP (10×10) | 1,108 | |
 | | MC9S08QE64CLH | NXP Semiconductors | IC MCU 8BIT 64KB FLASH 64LQFP | Microcontrollers | 64-LQFP (10x10) | N/A | -40°C ~ 85°C (TA) | Connectivity: I2C, LINbus, SCI, SPI Peripherals: LVD, PWM, WDT Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 22x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-LQFP (10×10) | 165 | |
 | | MC9S08QE8CFM | NXP Semiconductors | IC MCU 8BIT 8KB FLASH 32QFN | Microcontrollers | 32-QFN (4x4) | N/A | -40°C ~ 85°C (TA) | Connectivity: I2C, LINbus, SCI, SPI Peripherals: LVD, PWM, WDT Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 10x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 32-QFN (4×4) Package / Case: 32-VFQFN Exposed Pad | 665 | |
 | | MC9S08QE8CLC | NXP Semiconductors | IC MCU 8BIT 8KB FLASH 32LQFP | Microcontrollers | 32-LQFP (7x7) | N/A | -40°C ~ 85°C (TA) | Connectivity: I2C, LINbus, SCI, SPI Peripherals: LVD, PWM, WDT Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 10x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 32-LQFP (7×7) | 1,074 | |
 | | MC9S08QE8CPG | NXP Semiconductors | IC MCU 8BIT 8KB FLASH 16DIP | Microcontrollers | 16-PDIP | N/A | -40°C ~ 85°C (TA) | Connectivity: I2C, LINbus, SCI, SPI Peripherals: LVD, PWM, WDT Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 8x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Through Hole Supplier Device Package: 16-PDIP Package / Case: 16-DIP (0.300″”, 7.62mm) | 90 | |
 | | MC9S08QE8CTG | NXP Semiconductors | IC MCU 8BIT 8KB FLASH 16TSSOP | Microcontrollers | 16-TSSOP | N/A | -40°C ~ 85°C (TA) | Connectivity: I2C, LINbus, SCI, SPI Peripherals: LVD, PWM, WDT Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 8x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 16-TSSOP Package / Case: 16-TSSOP (0.173″”, 4.40mm Width) | 449 | |
 | | MC9S08QE8CTGR | NXP Semiconductors | IC MCU 8BIT 8KB FLASH 16TSSOP | Microcontrollers | 16-TSSOP | N/A | -40°C ~ 85°C (TA) | Connectivity: I2C, LINbus, SCI, SPI Peripherals: LVD, PWM, WDT Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 8x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 16-TSSOP Package / Case: 16-TSSOP (0.173″”, 4.40mm Width) | 779 | |