 | | MC9S08QE8CWJ | NXP Semiconductors | IC MCU 8BIT 8KB FLASH 20SOIC | Microcontrollers | 20-SOIC | N/A | -40°C ~ 85°C (TA) | Connectivity: I2C, LINbus, SCI, SPI Peripherals: LVD, PWM, WDT Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 8x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 20-SOIC Package / Case: 20-SOIC (0.295″”, 7.50mm Width) | 1,007 | |
 | | MC9S08QE8CWL | NXP Semiconductors | IC MCU 8BIT 8KB FLASH 28SOIC | Microcontrollers | 28-SOIC | N/A | -40°C ~ 85°C (TA) | Connectivity: I2C, LINbus, SCI, SPI Peripherals: LVD, PWM, WDT Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 10x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 28-SOIC Package / Case: 28-SOIC (0.295″”, 7.50mm Width) | 626 | |
 | | MC9S08QE96CFT | NXP Semiconductors | IC MCU 8BIT 96KB FLASH 48QFN | Microcontrollers | 48-QFN-EP (7x7) | N/A | -40°C ~ 85°C (TA) | Connectivity: I2C, LINbus, SCI, SPI Peripherals: LVD, PWM, WDT Program Memory Size: 96KB (96K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 10x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 48-QFN-EP (7×7) Package / Case: 48-VFQFN Exposed Pad | 1,179 | |
 | N/A | MC9S08QE96CFTR | NXP Semiconductors | IC MCU 8BIT 96KB FLASH 48QFN | Microcontrollers | 48-QFN (7x7) | N/A | -40°C ~ 85°C (TA) | Connectivity: I2C, LINbus, SCI, SPI Peripherals: LVD, PWM, WDT Program Memory Size: 96KB (96K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 10x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 48-QFN (7×7) Package / Case: 48-VFQFN Exposed Pad | 538 | |
 | | MC9S08QE96CLD | NXP Semiconductors | IC MCU 8BIT 96KB FLASH 44LQFP | Microcontrollers | 44-LQFP (10x10) | N/A | -40°C ~ 85°C (TA) | Connectivity: I2C, LINbus, SCI, SPI Peripherals: LVD, PWM, WDT Program Memory Size: 96KB (96K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 10x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 44-LQFP (10×10) | 1,393 | |
 | | MC9S08QE96CLH | NXP Semiconductors | IC MCU 8BIT 96KB FLASH 64LQFP | Microcontrollers | 64-LQFP (10x10) | N/A | -40°C ~ 85°C (TA) | Connectivity: I2C, LINbus, SCI, SPI Peripherals: LVD, PWM, WDT Program Memory Size: 96KB (96K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 22x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-LQFP (10×10) | 1,005 | |
 | | MC9S08QE96CLK | NXP Semiconductors | IC MCU 8BIT 96KB FLASH 80LQFP | Microcontrollers | 80-LQFP (14x14) | N/A | -40°C ~ 85°C (TA) | Connectivity: I2C, LINbus, SCI, SPI Peripherals: LVD, PWM, WDT Program Memory Size: 96KB (96K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 80-LQFP (14×14) | 523 | |
 | | MC9S08QG4CDNE | NXP Semiconductors | IC MCU 8BIT 4KB FLASH 8SOIC | Microcontrollers | 8-SOIC | N/A | -40°C ~ 85°C (TA) | Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Program Memory Size: 4KB (4K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 4x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 8-SOIC Package / Case: 8-SOIC (0.154″”, 3.90mm Width) | 612 | |
 | N/A | MC9S08QG4CDNER | NXP Semiconductors | IC MCU 8BIT 4KB FLASH 8SOIC | Microcontrollers | 8-SOIC | N/A | -40°C ~ 85°C (TA) | Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Program Memory Size: 4KB (4K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 4x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 8-SOIC Package / Case: 8-SOIC (0.154″”, 3.90mm Width) | 941 | |
 | | MC9S08QG4CDTE | NXP Semiconductors | IC MCU 8BIT 4KB FLASH 16TSSOP | Microcontrollers | 16-TSSOP | N/A | -40°C ~ 85°C (TA) | Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Program Memory Size: 4KB (4K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 8x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 16-TSSOP Package / Case: 16-TSSOP (0.173″”, 4.40mm Width) | 369 | |
 | | MC9S08QG4CDTER | NXP Semiconductors | IC MCU 8BIT 4KB FLASH 16TSSOP | Microcontrollers | 16-TSSOP | N/A | -40°C ~ 85°C (TA) | Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Program Memory Size: 4KB (4K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 8x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 16-TSSOP Package / Case: 16-TSSOP (0.173″”, 4.40mm Width) | 220 | |
 | | MC9S08QG4CFFE | NXP Semiconductors | IC MCU 8BIT 4KB FLASH 16QFN | Microcontrollers | 16-QFN-EP (5x5) | N/A | -40°C ~ 85°C (TA) | Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Program Memory Size: 4KB (4K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 8x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 16-QFN-EP (5×5) Package / Case: 16-VQFN Exposed Pad | 153 | |
 | | MC9S08QG4CFFER | NXP Semiconductors | IC MCU 8BIT 4KB FLASH 16QFN | Microcontrollers | 16-QFN-EP (5x5) | N/A | -40°C ~ 85°C (TA) | Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Program Memory Size: 4KB (4K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 8x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 16-QFN-EP (5×5) Package / Case: 16-VQFN Exposed Pad | 1,622 | |
 | | MC9S08QG4CFKE | NXP Semiconductors | IC MCU 8BIT 4KB FLASH 24QFN | Microcontrollers | 24-QFN-EP (4x4) | N/A | -40°C ~ 85°C (TA) | Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Program Memory Size: 4KB (4K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 8x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 24-QFN-EP (4×4) Package / Case: 24-VFQFN Exposed Pad | 899 | |
 | | MC9S08QG4CFQE | NXP Semiconductors | IC MCU 8BIT 4KB FLASH 8DFN | Microcontrollers | 8-DFN-EP (4x4) | N/A | -40°C ~ 85°C (TA) | Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Program Memory Size: 4KB (4K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 4x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 8-DFN-EP (4×4) Package / Case: 8-VDFN Exposed Pad | 1,360 | |
 | | MC9S08QG4CPAE | NXP Semiconductors | IC MCU 8BIT 4KB FLASH 8DIP | Microcontrollers | 8-PDIP | N/A | -40°C ~ 85°C (TA) | Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Program Memory Size: 4KB (4K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 4x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Through Hole Supplier Device Package: 8-PDIP Package / Case: 8-DIP (0.300″”, 7.62mm) | 209 | |
 | | MC9S08QG4CPBE | NXP Semiconductors | IC MCU 8BIT 4KB FLASH 16DIP | Microcontrollers | 16-PDIP | N/A | -40°C ~ 85°C (TA) | Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Program Memory Size: 4KB (4K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 8x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Through Hole Supplier Device Package: 16-PDIP Package / Case: 16-DIP (0.300″”, 7.62mm) | 515 | |
 | | MC9S08QG4MDTE | NXP Semiconductors | IC MCU 8BIT 4KB FLASH 16TSSOP | Microcontrollers | 16-TSSOP | N/A | -40°C ~ 125°C (TA) | Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Program Memory Size: 4KB (4K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 8x10b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 16-TSSOP Package / Case: 16-TSSOP (0.173″”, 4.40mm Width) | 526 | |
 | | MC9S08QG4MPAE | NXP Semiconductors | IC MCU 8BIT 4KB FLASH 8DIP | Microcontrollers | 8-PDIP | N/A | -40°C ~ 125°C (TA) | Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Program Memory Size: 4KB (4K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 4x10b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Through Hole Supplier Device Package: 8-PDIP Package / Case: 8-DIP (0.300″”, 7.62mm) | 62 | |
 | | MC9S08QG84CDTE | NXP Semiconductors | IC MCU 8BIT 8KB FLASH 16TSSOP | Microcontrollers | 16-TSSOP | N/A | -40°C ~ 85°C | Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 8x10b Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Supplier Device Package: 16-TSSOP Package / Case: 16-TSSOP (0.173″”, 4.40mm Width) | 112 | |