Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,052
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
MCF5249LAG120MCF5249LAG120NXP SemiconductorsIC MCU 32BIT ROMLESS 144LQFPMicrocontrollers144-LQFP (20x20)N/A0°C ~ 70°C (TA)
Core Processor:
Coldfire V2
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
I2C, IDE, Memory Card, SPI, UART/USART
Peripherals:
DMA, I2S, POR, Serial Audio, WDT
Number of I/O:
34
Program Memory Type:
ROMless
RAM Size:
96K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 4x12b
Oscillator Type:
External
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
846
MCF5249LCAG120MCF5249LCAG120NXP SemiconductorsIC MCU 32BIT ROMLESS 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
Coldfire V2
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
I2C, IDE, Memory Card, SPI, UART/USART
Peripherals:
DMA, I2S, POR, Serial Audio, WDT
Number of I/O:
34
Program Memory Type:
ROMless
RAM Size:
96K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 4x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
861
MCF5249LPV120MCF5249LPV120NXP SemiconductorsIC MCU 32BIT ROMLESS 144LQFPMicrocontrollers144-LQFP (20x20)N/A0°C ~ 70°C (TA)
Core Processor:
Coldfire V2
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
I2C, IDE, Memory Card, SPI, UART/USART
Peripherals:
DMA, I2S, POR, Serial Audio, WDT
Number of I/O:
34
Program Memory Type:
ROMless
RAM Size:
96K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 4x12b
Oscillator Type:
External
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
217
MCF5249VF140MCF5249VF140NXP SemiconductorsIC MCU 32BIT ROMLESS 160MAPBGAMicrocontrollers160-MAPBGA (15x15)N/A0°C ~ 70°C (TA)
Core Processor:
Coldfire V2
Core Size:
32-Bit Single-Core
Speed:
140MHz
Connectivity:
I2C, IDE, Memory Card, SPI, UART/USART
Peripherals:
DMA, I2S, POR, Serial Audio, WDT
Number of I/O:
47
Program Memory Type:
ROMless
RAM Size:
96K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 4x12b
Oscillator Type:
External
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
160-MAPBGA (15×15)
Package / Case:
160-BGA
396
MCF5251CVM140MCF5251CVM140NXP SemiconductorsIC MCU 32BIT ROMLESS 225MAPBGAMicrocontrollers225-MAPBGA (13x13)N/A-40°C ~ 85°C (TA)
Core Processor:
Coldfire V2
Core Size:
32-Bit Single-Core
Speed:
140MHz
Connectivity:
ATA, Audio, CANbus, EBI/EMI, I2C, IDE, SD, SPI, UART/USART, USB OTG
Peripherals:
DMA
Program Memory Type:
ROMless
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
1.08V ~ 3.6V
Data Converters:
A/D 6x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
225-MAPBGA (13×13)
Package / Case:
225-LFBGA
274
MCF5251CVM140R2MCF5251CVM140R2NXP SemiconductorsIC MCU 32BIT ROMLESS 225MAPBGAMicrocontrollers225-MAPBGA (13x13)N/A-40°C ~ 85°C (TA)
Core Processor:
Coldfire V2
Core Size:
32-Bit Single-Core
Speed:
140MHz
Connectivity:
ATA, Audio, CANbus, EBI/EMI, I2C, IDE, SD, SPI, UART/USART, USB OTG
Peripherals:
DMA
Program Memory Type:
ROMless
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
1.08V ~ 3.6V
Data Converters:
A/D 6x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
225-MAPBGA (13×13)
Package / Case:
225-LFBGA
576
MCF5251VM140MCF5251VM140NXP SemiconductorsIC MCU 32BIT ROMLESS 225MAPBGAMicrocontrollers225-MAPBGA (13x13)N/A-20°C ~ 70°C (TA)
Core Processor:
Coldfire V2
Core Size:
32-Bit Single-Core
Speed:
140MHz
Connectivity:
ATA, Audio, CANbus, EBI/EMI, I2C, IDE, SD, SPI, UART/USART, USB OTG
Peripherals:
DMA
Program Memory Type:
ROMless
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
1.08V ~ 3.6V
Data Converters:
A/D 6x12b
Oscillator Type:
External
Operating Temperature:
-20°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
225-MAPBGA (13×13)
Package / Case:
225-LFBGA
578
MCF5253CVM140MCF5253CVM140NXP SemiconductorsIC MCU 32BIT ROMLESS 225MAPBGAMicrocontrollers225-MAPBGA (13x13)N/A-40°C ~ 85°C (TA)
Core Processor:
Coldfire V2
Core Size:
32-Bit Single-Core
Speed:
140MHz
Connectivity:
CANbus, EBI/EMI, I2C, QSPI, UART/USART, USB OTG
Peripherals:
DMA, WDT
Program Memory Type:
ROMless
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
1.08V ~ 1.32V
Data Converters:
A/D 6x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
225-MAPBGA (13×13)
Package / Case:
225-LFBGA
424
MCF5253CVM140JMCF5253CVM140JNXP SemiconductorsIC MCU 32BIT ROMLESS 225MAPBGAMicrocontrollers225-MAPBGA (13x13)N/A-40°C ~ 85°C (TA)
Core Processor:
Coldfire V2
Core Size:
32-Bit Single-Core
Speed:
140MHz
Connectivity:
CANbus, EBI/EMI, I2C, QSPI, UART/USART, USB OTG
Peripherals:
DMA, WDT
Program Memory Type:
ROMless
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
1.08V ~ 1.32V
Data Converters:
A/D 6x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
225-MAPBGA (13×13)
Package / Case:
225-LFBGA
1,335
MCF5253VM140MCF5253VM140NXP SemiconductorsIC MCU 32BIT ROMLESS 225MAPBGAMicrocontrollers225-MAPBGA (13x13)N/A-20°C ~ 70°C (TA)
Core Processor:
Coldfire V2
Core Size:
32-Bit Single-Core
Speed:
140MHz
Connectivity:
CANbus, EBI/EMI, I2C, QSPI, UART/USART, USB OTG
Peripherals:
DMA, WDT
Program Memory Type:
ROMless
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
1.08V ~ 1.32V
Data Converters:
A/D 6x12b
Oscillator Type:
External
Operating Temperature:
-20°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
225-MAPBGA (13×13)
Package / Case:
225-LFBGA
1,291
MCF5253VM140JMCF5253VM140JNXP SemiconductorsIC MCU 32BIT ROMLESS 225MAPBGAMicrocontrollers225-MAPBGA (13x13)N/A-20°C ~ 70°C (TA)
Core Processor:
Coldfire V2
Core Size:
32-Bit Single-Core
Speed:
140MHz
Connectivity:
CANbus, EBI/EMI, I2C, QSPI, UART/USART, USB OTG
Peripherals:
DMA, WDT
Program Memory Type:
ROMless
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
1.08V ~ 1.32V
Data Converters:
A/D 6x12b
Oscillator Type:
External
Operating Temperature:
-20°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
225-MAPBGA (13×13)
Package / Case:
225-LFBGA
495
MCF5270AB100MCF5270AB100NXP SemiconductorsIC MCU 32BIT ROMLESS 160QFPMicrocontrollers160-QFP (28x28)N/A0°C ~ 70°C (TA)
Core Processor:
Coldfire V2
Core Size:
32-Bit Single-Core
Speed:
100MHz
Connectivity:
EBI/EMI, Ethernet, I2C, SPI, UART/USART
Peripherals:
DMA, WDT
Number of I/O:
39
Program Memory Type:
ROMless
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
1.4V ~ 1.6V
Oscillator Type:
External
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
160-QFP (28×28)
Package / Case:
160-BQFP
908
MCF5270CAB100MCF5270CAB100NXP SemiconductorsIC MCU 32BIT ROMLESS 160QFPMicrocontrollers160-QFP (28x28)N/A-40°C ~ 85°C (TA)
Core Processor:
Coldfire V2
Core Size:
32-Bit Single-Core
Speed:
100MHz
Connectivity:
EBI/EMI, Ethernet, I2C, SPI, UART/USART
Peripherals:
DMA, WDT
Number of I/O:
39
Program Memory Type:
ROMless
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
1.4V ~ 1.6V
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
160-QFP (28×28)
Package / Case:
160-BQFP
439
MCF5270CVM150MCF5270CVM150NXP SemiconductorsIC MCU 32BIT ROMLESS 196MAPBGAMicrocontrollers196-LBGA (15x15)N/A-40°C ~ 85°C (TA)
Core Processor:
Coldfire V2
Core Size:
32-Bit Single-Core
Speed:
150MHz
Connectivity:
EBI/EMI, Ethernet, I2C, SPI, UART/USART
Peripherals:
DMA, WDT
Number of I/O:
97
Program Memory Type:
ROMless
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
1.4V ~ 1.6V
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
196-LBGA (15×15)
Package / Case:
196-LBGA
1,030
MCF5270CVM150R2MCF5270CVM150R2NXP SemiconductorsIC MCU 32BIT ROMLESS 196MAPBGAMicrocontrollers196-LBGA (15x15)N/A-40°C ~ 85°C (TA)
Core Processor:
Coldfire V2
Core Size:
32-Bit Single-Core
Speed:
150MHz
Connectivity:
EBI/EMI, Ethernet, I2C, SPI, UART/USART
Peripherals:
DMA, WDT
Number of I/O:
97
Program Memory Type:
ROMless
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
1.4V ~ 1.6V
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
196-LBGA (15×15)
Package / Case:
196-LBGA
1,043
MCF5270VM100MCF5270VM100NXP SemiconductorsIC MCU 32BIT ROMLESS 196MAPBGAMicrocontrollers196-LBGA (15x15)N/A0°C ~ 70°C (TA)
Core Processor:
Coldfire V2
Core Size:
32-Bit Single-Core
Speed:
100MHz
Connectivity:
EBI/EMI, Ethernet, I2C, SPI, UART/USART
Peripherals:
DMA, WDT
Number of I/O:
61
Program Memory Type:
ROMless
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
1.4V ~ 1.6V
Oscillator Type:
External
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
196-LBGA (15×15)
Package / Case:
196-LBGA
1,572
MCF5270VM100JMCF5270VM100JNXP SemiconductorsIC MCU 32BIT ROMLESS 196MAPBGAMicrocontrollers196-LBGA (15x15)N/A0°C ~ 70°C (TA)
Core Processor:
Coldfire V2
Core Size:
32-Bit Single-Core
Speed:
100MHz
Connectivity:
EBI/EMI, Ethernet, I2C, SPI, UART/USART
Peripherals:
DMA, WDT
Number of I/O:
61
Program Memory Type:
ROMless
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
1.4V ~ 1.6V
Oscillator Type:
External
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
196-LBGA (15×15)
Package / Case:
196-LBGA
496
MCF5271CAB100MCF5271CAB100NXP SemiconductorsIC MCU 32BIT ROMLESS 160QFPMicrocontrollers160-QFP (28x28)N/A-40°C ~ 85°C (TA)
Core Processor:
Coldfire V2
Core Size:
32-Bit Single-Core
Speed:
100MHz
Connectivity:
EBI/EMI, Ethernet, I2C, SPI, UART/USART
Peripherals:
DMA, WDT
Number of I/O:
39
Program Memory Type:
ROMless
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
1.4V ~ 3.6V
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
160-QFP (28×28)
Package / Case:
160-BQFP
248
MCF5271CVM100MCF5271CVM100NXP SemiconductorsIC MCU 32BIT ROMLESS 196MAPBGAMicrocontrollers196-LBGA (15x15)N/A-40°C ~ 85°C (TA)
Core Processor:
Coldfire V2
Core Size:
32-Bit Single-Core
Speed:
100MHz
Connectivity:
EBI/EMI, Ethernet, I2C, SPI, UART/USART
Peripherals:
DMA, WDT
Number of I/O:
61
Program Memory Type:
ROMless
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
1.4V ~ 3.6V
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
196-LBGA (15×15)
Package / Case:
196-LBGA
585
MCF5271CVM100JMCF5271CVM100JNXP SemiconductorsIC MCU 32BIT ROMLESS 196MAPBGAMicrocontrollers196-LBGA (15x15)N/A-40°C ~ 85°C (TA)
Core Processor:
Coldfire V2
Core Size:
32-Bit Single-Core
Speed:
100MHz
Connectivity:
EBI/EMI, Ethernet, I2C, SPI, UART/USART
Peripherals:
DMA, WDT
Number of I/O:
61
Program Memory Type:
ROMless
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
1.4V ~ 3.6V
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
196-LBGA (15×15)
Package / Case:
196-LBGA
1,995

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