 | | MCF5275LCVM166 | NXP Semiconductors | IC MCU 32BIT ROMLESS 196MAPBGA | Microcontrollers | 196-LBGA (15x15) | N/A | -40°C ~ 85°C (TA) | Core Processor: Coldfire V2 Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.4V ~ 1.6V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 196-LBGA (15×15) | 7 | |
 | | MCF5275LCVM166J | NXP Semiconductors | IC MCU 32BIT ROMLESS 196MAPBGA | Microcontrollers | 196-LBGA (15x15) | N/A | -40°C ~ 85°C (TA) | Core Processor: Coldfire V2 Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.4V ~ 1.6V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 196-LBGA (15×15) | 77 | |
 | | MCF5280CVF66 | NXP Semiconductors | IC MCU 32BIT ROMLESS 256MAPBGA | Microcontrollers | 256-MAPBGA (17x17) | N/A | -40°C ~ 85°C (TA) | Core Processor: Coldfire V2 Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 2.7V ~ 3.6V Data Converters: A/D 8x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-MAPBGA (17×17) | 1,116 | |
 | | MCF5280CVF66J | NXP Semiconductors | IC MCU 32BIT ROMLESS 256MAPBGA | Microcontrollers | 256-MAPBGA (17x17) | N/A | -40°C ~ 85°C (TA) | Core Processor: Coldfire V2 Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 2.7V ~ 3.6V Data Converters: A/D 8x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-MAPBGA (17×17) | 452 | |
 | | MCF5280CVF80 | NXP Semiconductors | IC MCU 32BIT ROMLESS 256MAPBGA | Microcontrollers | 256-MAPBGA (17x17) | N/A | -40°C ~ 85°C (TA) | Core Processor: Coldfire V2 Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 2.7V ~ 3.6V Data Converters: A/D 8x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-MAPBGA (17×17) | 1,288 | |
 | | MCF5280CVM66 | NXP Semiconductors | IC MCU 32BIT ROMLESS 256MAPBGA | Microcontrollers | 256-MAPBGA (17x17) | N/A | -40°C ~ 85°C (TA) | Core Processor: Coldfire V2 Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 2.7V ~ 3.6V Data Converters: A/D 8x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-MAPBGA (17×17) | 690 | |
 | | MCF5280CVM66J | NXP Semiconductors | IC MCU 32BIT ROMLESS 256MAPBGA | Microcontrollers | 256-MAPBGA (17x17) | N/A | -40°C ~ 85°C (TA) | Core Processor: Coldfire V2 Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 2.7V ~ 3.6V Data Converters: A/D 8x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-MAPBGA (17×17) | 1,651 | |
 | | MCF5280CVM80 | NXP Semiconductors | IC MCU 32BIT ROMLESS 256MAPBGA | Microcontrollers | 256-MAPBGA (17x17) | N/A | -40°C ~ 85°C (TA) | Core Processor: Coldfire V2 Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 2.7V ~ 3.6V Data Converters: A/D 8x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-MAPBGA (17×17) | 636 | |
 | | MCF5281CVF66 | NXP Semiconductors | IC MCU 32B 256KB FLASH 256MAPBGA | Microcontrollers | 256-MAPBGA (17x17) | N/A | -40°C ~ 85°C (TA) | Core Processor: Coldfire V2 Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 3.6V Data Converters: A/D 8x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-MAPBGA (17×17) | 1,043 | |
 | | MCF5281CVF80 | NXP Semiconductors | IC MCU 32B 256KB FLASH 256MAPBGA | Microcontrollers | 256-MAPBGA (17x17) | N/A | -40°C ~ 85°C (TA) | Core Processor: Coldfire V2 Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 3.6V Data Converters: A/D 8x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-MAPBGA (17×17) | 176 | |
 | | MCF5281CVM66 | NXP Semiconductors | IC MCU 32B 256KB FLASH 256MAPBGA | Microcontrollers | 256-MAPBGA (17x17) | N/A | -40°C ~ 85°C (TA) | Core Processor: Coldfire V2 Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 3.6V Data Converters: A/D 8x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-MAPBGA (17×17) | 1,598 | |
 | | MCF5281CVM66J | NXP Semiconductors | IC MCU 32B 256KB FLASH 256MAPBGA | Microcontrollers | 256-MAPBGA (17x17) | N/A | -40°C ~ 85°C (TA) | Core Processor: Coldfire V2 Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 3.6V Data Converters: A/D 8x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-MAPBGA (17×17) | 1,773 | |
 | | MCF5281CVM80 | NXP Semiconductors | IC MCU 32B 256KB FLASH 256MAPBGA | Microcontrollers | 256-MAPBGA (17x17) | N/A | -40°C ~ 85°C (TA) | Core Processor: Coldfire V2 Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 3.6V Data Converters: A/D 8x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-MAPBGA (17×17) | 1,220 | |
 | | MCF5282CVF66 | NXP Semiconductors | IC MCU 32B 512KB FLASH 256MAPBGA | Microcontrollers | 256-MAPBGA (17x17) | N/A | -40°C ~ 85°C (TA) | Core Processor: Coldfire V2 Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 3.6V Data Converters: A/D 8x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-MAPBGA (17×17) | 532 | |
 | | MCF5282CVF66J | NXP Semiconductors | IC MCU 32B 512KB FLASH 256MAPBGA | Microcontrollers | 256-MAPBGA (17x17) | N/A | -40°C ~ 85°C (TA) | Core Processor: Coldfire V2 Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 3.6V Data Converters: A/D 8x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-MAPBGA (17×17) | 162 | |
 | | MCF5282CVF80 | NXP Semiconductors | IC MCU 32B 512KB FLASH 256MAPBGA | Microcontrollers | 256-MAPBGA (17x17) | N/A | -40°C ~ 85°C (TA) | Core Processor: Coldfire V2 Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 3.6V Data Converters: A/D 8x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-MAPBGA (17×17) | 15 | |
 | | MCF5282CVF80J | NXP Semiconductors | IC MCU 32B 512KB FLASH 256MAPBGA | Microcontrollers | 256-MAPBGA (17x17) | N/A | -40°C ~ 85°C (TA) | Core Processor: Coldfire V2 Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 3.6V Data Converters: A/D 8x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-MAPBGA (17×17) | 306 | |
 | | MCF5282CVM66 | NXP Semiconductors | IC MCU 32B 512KB FLASH 256MAPBGA | Microcontrollers | 256-MAPBGA (17x17) | N/A | -40°C ~ 85°C (TA) | Core Processor: Coldfire V2 Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 3.6V Data Converters: A/D 8x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-MAPBGA (17×17) | 729 | |
 | | MCF5282CVM66J | NXP Semiconductors | IC MCU 32B 512KB FLASH 256MAPBGA | Microcontrollers | 256-MAPBGA (17x17) | N/A | -40°C ~ 85°C (TA) | Core Processor: Coldfire V2 Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 3.6V Data Converters: A/D 8x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-MAPBGA (17×17) | 20 | |
 | | MCF5282CVM80 | NXP Semiconductors | IC MCU 32B 512KB FLASH 256MAPBGA | Microcontrollers | 256-MAPBGA (17x17) | N/A | -40°C ~ 85°C (TA) | Core Processor: Coldfire V2 Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 3.6V Data Converters: A/D 8x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-MAPBGA (17×17) | 493 | |