 | | MCF5372LCVM240 | NXP Semiconductors | IC MCU 32BIT ROMLESS 196MAPBGA | Microcontrollers | 196-LBGA (15x15) | N/A | -40°C ~ 85°C (TA) | Core Processor: Coldfire V3 Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, Ethernet, I2C, SPI, SSI, UART/USART, USB, USB OTG Peripherals: DMA, POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.4V ~ 3.6V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 196-LBGA (15×15) | 500 | |
 | | MCF5372LCVM240J | NXP Semiconductors | IC MCU 32BIT ROMLESS 196MAPBGA | Microcontrollers | 196-LBGA (15x15) | N/A | -40°C ~ 85°C (TA) | Core Processor: Coldfire V3 Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, Ethernet, I2C, SPI, SSI, UART/USART, USB, USB OTG Peripherals: DMA, POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.4V ~ 3.6V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 196-LBGA (15×15) | 521 | |
 | | MCF5373LCVM240 | NXP Semiconductors | IC MCU 32BIT ROMLESS 196MAPBGA | Microcontrollers | 196-LBGA (15x15) | N/A | -40°C ~ 85°C (TA) | Core Processor: Coldfire V3 Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, Ethernet, I2C, SPI, SSI, UART/USART, USB, USB OTG Peripherals: DMA, POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.4V ~ 3.6V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 196-LBGA (15×15) | 1,427 | |
 | | MCF5373LCVM240J | NXP Semiconductors | IC MCU 32BIT ROMLESS 196MAPBGA | Microcontrollers | 196-LBGA (15x15) | N/A | -40°C ~ 85°C (TA) | Core Processor: Coldfire V3 Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, Ethernet, I2C, SPI, SSI, UART/USART, USB, USB OTG Peripherals: DMA, POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.4V ~ 3.6V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 196-LBGA (15×15) | 1,139 | |
 | | MCF5407AI162 | NXP Semiconductors | IC MCU 32BIT ROMLESS 208FQFP | Microcontrollers | 208-FQFP (28x28) | N/A | 0°C ~ 70°C (TA) | Core Processor: Coldfire V4 Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, I2C, UART/USART Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.65V ~ 3.6V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-FQFP (28×28) | 238 | |
 | | MCF5407AI220 | NXP Semiconductors | IC MCU 32BIT ROMLESS 208FQFP | Microcontrollers | 208-FQFP (28x28) | N/A | 0°C ~ 70°C (TA) | Core Processor: Coldfire V4 Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, I2C, UART/USART Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.65V ~ 3.6V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-FQFP (28×28) | 879 | |
 | | MCF5407CAI162 | NXP Semiconductors | IC MCU 32BIT ROMLESS 208FQFP | Microcontrollers | 208-FQFP (28x28) | N/A | -40°C ~ 85°C (TA) | Core Processor: Coldfire V4 Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, I2C, UART/USART Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.65V ~ 3.6V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-FQFP (28×28) | 436 | |
 | | MCF5407CAI220 | NXP Semiconductors | IC MCU 32BIT ROMLESS 208FQFP | Microcontrollers | 208-FQFP (28x28) | N/A | -40°C ~ 85°C (TA) | Core Processor: Coldfire V4 Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, I2C, UART/USART Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.65V ~ 3.6V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-FQFP (28×28) | 560 | |
 | | MCF5407CFT162 | NXP Semiconductors | IC MCU 32BIT ROMLESS 208FQFP | Microcontrollers | 208-FQFP (28x28) | N/A | -40°C ~ 85°C (TA) | Core Processor: Coldfire V4 Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, I2C, UART/USART Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.65V ~ 3.6V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-FQFP (28×28) | 836 | |
 | | MCF5407FT162 | NXP Semiconductors | IC MCU 32BIT ROMLESS 208FQFP | Microcontrollers | 208-FQFP (28x28) | N/A | 0°C ~ 70°C (TA) | Core Processor: Coldfire V4 Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, I2C, UART/USART Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.65V ~ 3.6V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-FQFP (28×28) | 892 | |
 | | MCF5407FT220 | NXP Semiconductors | IC MCU 32BIT ROMLESS 208FQFP | Microcontrollers | 208-FQFP (28x28) | N/A | 0°C ~ 70°C (TA) | Core Processor: Coldfire V4 Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, I2C, UART/USART Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.65V ~ 3.6V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-FQFP (28×28) | 203 | |
 | | MCF54415CMJ250 | NXP Semiconductors | IC MCU 32BIT ROMLESS 256MAPBGA | Microcontrollers | 256-MAPBGA (17x17) | N/A | -40°C ~ 85°C (TA) | Core Processor: Coldfire V4 Core Size: 32-Bit Single-Core Connectivity: 1-Wire®, CANbus, EBI/EMI, Ethernet, I2C, SmartCard, SPI, SSI, UART/USART, USB, USB OTG Peripherals: DMA, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.14V ~ 1.32V Data Converters: A/D 8x12b; D/A 2x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-MAPBGA (17×17) | 616 | |
 | | MCF54416CMJ250 | NXP Semiconductors | IC MCU 32BIT ROMLESS 256MAPBGA | Microcontrollers | 256-MAPBGA (17x17) | N/A | -40°C ~ 85°C (TA) | Core Processor: Coldfire V4 Core Size: 32-Bit Single-Core Connectivity: 1-Wire®, CANbus, EBI/EMI, Ethernet, I2C, SmartCard, SPI, SSI, UART/USART, USB, USB OTG Peripherals: DMA, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.14V ~ 1.32V Data Converters: A/D 8x12b; D/A 2x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-MAPBGA (17×17) | 1,446 | |
 | | MCF54417CMJ250 | NXP Semiconductors | IC MCU 32BIT ROMLESS 256MAPBGA | Microcontrollers | 256-MAPBGA (17x17) | N/A | -40°C ~ 85°C (TA) | Core Processor: Coldfire V4 Core Size: 32-Bit Single-Core Connectivity: 1-Wire®, CANbus, EBI/EMI, Ethernet, I2C, SmartCard, SPI, SSI, UART/USART, USB, USB OTG Peripherals: DMA, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.14V ~ 1.32V Data Converters: A/D 8x12b; D/A 2x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-MAPBGA (17×17) | 960 | |
 | | MCF54418CMJ250 | NXP Semiconductors | IC MCU 32BIT ROMLESS 256MAPBGA | Microcontrollers | 256-MAPBGA (17x17) | N/A | -40°C ~ 85°C (TA) | Core Processor: Coldfire V4 Core Size: 32-Bit Single-Core Connectivity: 1-Wire®, CANbus, EBI/EMI, Ethernet, I2C, SmartCard, SPI, SSI, UART/USART, USB, USB OTG Peripherals: DMA, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.14V ~ 1.32V Data Converters: A/D 8x12b; D/A 2x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-MAPBGA (17×17) | 360 | |
 | | MCF54418CMJ250R | NXP Semiconductors | IC MCU 32BIT ROMLESS 256MAPBGA | Microcontrollers | 256-MAPBGA (17x17) | N/A | -40°C ~ 85°C (TA) | Core Processor: Coldfire V4 Core Size: 32-Bit Single-Core Connectivity: 1-Wire®, CANbus, EBI/EMI, Ethernet, I2C, SmartCard, SPI, SSI, UART/USART, USB, USB OTG Peripherals: DMA, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.14V ~ 1.32V Data Converters: A/D 8x12b; D/A 2x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-MAPBGA (17×17) | 269 | |
 | | MCF54450ACVM180 | NXP Semiconductors | MCF5445x - 32-bit MPU, ColdFire | Microcontrollers | 256-MAPBGA (17x17) | N/A | -40°C ~ 85°C (TA) | Core Processor: ColdFire V4 Connectivity: I2C, SPI, SSI, UART/USART, USB OTG Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.35V ~ 1.65V Oscillator Type: External, Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-MAPBGA (17×17) | 1,269 | |
 | | MCF54450AVM240 | NXP Semiconductors | IC MCU 32BIT ROMLESS 256MAPBGA | Microcontrollers | 256-MAPBGA (17x17) | N/A | 0°C ~ 70°C (TA) | Core Processor: Coldfire V4 Core Size: 32-Bit Single-Core Connectivity: I2C, SPI, SSI, UART/USART, USB OTG Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.35V ~ 3.6V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-MAPBGA (17×17) | 836 | |
 | | MCF54450CVM180 | NXP Semiconductors | IC MCU 32BIT ROMLESS 256MAPBGA | Microcontrollers | 256-MAPBGA (17x17) | N/A | -40°C ~ 85°C (TA) | Core Processor: Coldfire V4 Core Size: 32-Bit Single-Core Connectivity: I2C, SPI, SSI, UART/USART, USB OTG Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.35V ~ 3.6V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-MAPBGA (17×17) | 852 | |
 | | MCF54450VM240 | NXP Semiconductors | IC MCU 32BIT ROMLESS 256MAPBGA | Microcontrollers | 256-MAPBGA (17x17) | N/A | 0°C ~ 70°C (TA) | Core Processor: Coldfire V4 Core Size: 32-Bit Single-Core Connectivity: I2C, SPI, SSI, UART/USART, USB OTG Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.35V ~ 3.6V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-MAPBGA (17×17) | 638 | |