 | | MCF54450VM240J | NXP Semiconductors | IC MCU 32BIT ROMLESS 256MAPBGA | Microcontrollers | 256-MAPBGA (17x17) | N/A | 0°C ~ 70°C (TA) | Core Processor: Coldfire V4 Core Size: 32-Bit Single-Core Connectivity: I2C, SPI, SSI, UART/USART, USB OTG Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.35V ~ 3.6V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-MAPBGA (17×17) | 509 | |
 | | MCF54451CVM180 | NXP Semiconductors | IC MCU 32BIT ROMLESS 256MAPBGA | Microcontrollers | 256-MAPBGA (17x17) | N/A | -40°C ~ 85°C (TA) | Core Processor: Coldfire V4 Core Size: 32-Bit Single-Core Connectivity: I2C, SPI, SSI, UART/USART, USB OTG Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.35V ~ 3.6V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-MAPBGA (17×17) | 225 | |
 | | MCF54451VM240 | NXP Semiconductors | IC MCU 32BIT ROMLESS 256MAPBGA | Microcontrollers | 256-MAPBGA (17x17) | N/A | 0°C ~ 70°C (TA) | Core Processor: Coldfire V4 Core Size: 32-Bit Single-Core Connectivity: I2C, SPI, SSI, UART/USART, USB OTG Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.35V ~ 3.6V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-MAPBGA (17×17) | 200 | |
 | | MCF54451VM240J | NXP Semiconductors | IC MCU 32BIT ROMLESS 256MAPBGA | Microcontrollers | 256-MAPBGA (17x17) | N/A | 0°C ~ 70°C (TA) | Core Processor: Coldfire V4 Core Size: 32-Bit Single-Core Connectivity: I2C, SPI, SSI, UART/USART, USB OTG Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.35V ~ 3.6V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-MAPBGA (17×17) | 1,212 | |
 | | MCF54452CVP200 | NXP Semiconductors | IC MCU 32BIT ROMLESS 360BGA | Microcontrollers | 360-BGA (23x23) | N/A | -40°C ~ 85°C (TA) | Core Processor: Coldfire V4 Core Size: 32-Bit Single-Core Connectivity: I2C, SPI, SSI, UART/USART, USB OTG Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.35V ~ 3.6V Oscillator Type: External, Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 360-BGA (23×23) | 1,322 | |
 | | MCF54452CVR200 | NXP Semiconductors | IC MCU 32BIT ROMLESS 360TEPBGA | Microcontrollers | 360-TEPBGA (23x23) | N/A | -40°C ~ 85°C (TA) | Core Processor: Coldfire V4 Core Size: 32-Bit Single-Core Connectivity: I2C, SPI, SSI, UART/USART, USB OTG Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.35V ~ 3.6V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 360-TEPBGA (23×23) | 175 | |
 | | MCF54452VP266 | NXP Semiconductors | IC MCU 32BIT ROMLESS 360BGA | Microcontrollers | 360-BGA (23x23) | N/A | 0°C ~ 70°C (TA) | Core Processor: Coldfire V4 Core Size: 32-Bit Single-Core Connectivity: I2C, SPI, SSI, UART/USART, USB OTG Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.35V ~ 3.6V Oscillator Type: External, Internal Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 360-BGA (23×23) | 812 | |
 | | MCF54452VP266R | NXP Semiconductors | IC MCU 32BIT ROMLESS 360BGA | Microcontrollers | 360-BGA (23x23) | N/A | 0°C ~ 70°C (TA) | Core Processor: Coldfire V4 Core Size: 32-Bit Single-Core Connectivity: I2C, SPI, SSI, UART/USART, USB OTG Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.35V ~ 3.6V Oscillator Type: External, Internal Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 360-BGA (23×23) | 5 | |
 | | MCF54452VR266 | NXP Semiconductors | IC MCU 32BIT ROMLESS 360TEPBGA | Microcontrollers | 360-TEPBGA (23x23) | N/A | 0°C ~ 70°C (TA) | Core Processor: Coldfire V4 Core Size: 32-Bit Single-Core Connectivity: I2C, SPI, SSI, UART/USART, USB OTG Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.35V ~ 3.6V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 360-TEPBGA (23×23) | 361 | |
 | | MCF54452VR266R | NXP Semiconductors | IC MCU 32BIT ROMLESS 360TEPBGA | Microcontrollers | 360-TEPBGA (23x23) | N/A | 0°C ~ 70°C (TA) | Core Processor: Coldfire V4 Core Size: 32-Bit Single-Core Connectivity: I2C, SPI, SSI, UART/USART, USB OTG Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.35V ~ 3.6V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 360-TEPBGA (23×23) | 957 | |
 | | MCF54453CVP200 | NXP Semiconductors | IC MCU 32BIT ROMLESS 360BGA | Microcontrollers | 360-BGA (23x23) | N/A | -40°C ~ 85°C (TA) | Core Processor: Coldfire V4 Core Size: 32-Bit Single-Core Connectivity: I2C, SPI, SSI, UART/USART, USB OTG Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.35V ~ 3.6V Oscillator Type: External, Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 360-BGA (23×23) | 511 | |
 | | MCF54453CVR200 | NXP Semiconductors | IC MCU 32BIT ROMLESS 360TEPBGA | Microcontrollers | 360-TEPBGA (23x23) | N/A | -40°C ~ 85°C (TA) | Core Processor: Coldfire V4 Core Size: 32-Bit Single-Core Connectivity: I2C, SPI, SSI, UART/USART, USB OTG Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.35V ~ 3.6V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 360-TEPBGA (23×23) | 367 | |
 | | MCF54453VP266 | NXP Semiconductors | IC MCU 32BIT ROMLESS 360BGA | Microcontrollers | 360-BGA (23x23) | N/A | 0°C ~ 70°C (TA) | Core Processor: Coldfire V4 Core Size: 32-Bit Single-Core Connectivity: I2C, SPI, SSI, UART/USART, USB OTG Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.35V ~ 3.6V Oscillator Type: External, Internal Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 360-BGA (23×23) | 1,409 | |
 | | MCF54453VR266 | NXP Semiconductors | IC MCU 32BIT ROMLESS 360TEPBGA | Microcontrollers | 360-TEPBGA (23x23) | N/A | 0°C ~ 70°C (TA) | Core Processor: Coldfire V4 Core Size: 32-Bit Single-Core Connectivity: I2C, SPI, SSI, UART/USART, USB OTG Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.35V ~ 3.6V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 360-TEPBGA (23×23) | 762 | |
 | | MCF54454CVP200 | NXP Semiconductors | IC MCU 32BIT ROMLESS 360BGA | Microcontrollers | 360-BGA (23x23) | N/A | -40°C ~ 85°C (TA) | Core Processor: Coldfire V4 Core Size: 32-Bit Single-Core Connectivity: I2C, SPI, SSI, UART/USART, USB OTG Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.35V ~ 3.6V Oscillator Type: External, Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 360-BGA (23×23) | 834 | |
 | | MCF54454CVR200 | NXP Semiconductors | IC MCU 32BIT ROMLESS 360TEPBGA | Microcontrollers | 360-TEPBGA (23x23) | N/A | -40°C ~ 85°C (TA) | Core Processor: Coldfire V4 Core Size: 32-Bit Single-Core Connectivity: I2C, SPI, SSI, UART/USART, USB OTG Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.35V ~ 3.6V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 360-TEPBGA (23×23) | 858 | |
 | | MCF54454VP266 | NXP Semiconductors | IC MCU 32BIT ROMLESS 360BGA | Microcontrollers | 360-BGA (23x23) | N/A | 0°C ~ 70°C (TA) | Core Processor: Coldfire V4 Core Size: 32-Bit Single-Core Connectivity: I2C, SPI, SSI, UART/USART, USB OTG Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.35V ~ 3.6V Oscillator Type: External, Internal Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 360-BGA (23×23) | 1,519 | |
 | | MCF54454VR266 | NXP Semiconductors | IC MCU 32BIT ROMLESS 360TEPBGA | Microcontrollers | 360-TEPBGA (23x23) | N/A | 0°C ~ 70°C (TA) | Core Processor: Coldfire V4 Core Size: 32-Bit Single-Core Connectivity: I2C, SPI, SSI, UART/USART, USB OTG Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.35V ~ 3.6V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 360-TEPBGA (23×23) | 1,886 | |
 | | MCF54455CVP200 | NXP Semiconductors | IC MCU 32BIT ROMLESS 360BGA | Microcontrollers | 360-BGA (23x23) | N/A | -40°C ~ 85°C (TA) | Core Processor: Coldfire V4 Core Size: 32-Bit Single-Core Connectivity: I2C, SPI, SSI, UART/USART, USB OTG Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.35V ~ 3.6V Oscillator Type: External, Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 360-BGA (23×23) | 286 | |
 | | MCF54455CVR200 | NXP Semiconductors | IC MCU 32BIT ROMLESS 360TEPBGA | Microcontrollers | 360-TEPBGA (23x23) | N/A | -40°C ~ 85°C (TA) | Core Processor: Coldfire V4 Core Size: 32-Bit Single-Core Connectivity: I2C, SPI, SSI, UART/USART, USB OTG Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.35V ~ 3.6V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 360-TEPBGA (23×23) | 198 | |