Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

Featured Brands

About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,052
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
MCF54450VM240JMCF54450VM240JNXP SemiconductorsIC MCU 32BIT ROMLESS 256MAPBGAMicrocontrollers256-MAPBGA (17x17)N/A0°C ~ 70°C (TA)
Core Processor:
Coldfire V4
Core Size:
32-Bit Single-Core
Speed:
240MHz
Connectivity:
I2C, SPI, SSI, UART/USART, USB OTG
Peripherals:
DMA, WDT
Number of I/O:
132
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-MAPBGA (17×17)
Package / Case:
256-LBGA
509
MCF54451CVM180MCF54451CVM180NXP SemiconductorsIC MCU 32BIT ROMLESS 256MAPBGAMicrocontrollers256-MAPBGA (17x17)N/A-40°C ~ 85°C (TA)
Core Processor:
Coldfire V4
Core Size:
32-Bit Single-Core
Speed:
180MHz
Connectivity:
I2C, SPI, SSI, UART/USART, USB OTG
Peripherals:
DMA, WDT
Number of I/O:
132
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-MAPBGA (17×17)
Package / Case:
256-LBGA
225
MCF54451VM240MCF54451VM240NXP SemiconductorsIC MCU 32BIT ROMLESS 256MAPBGAMicrocontrollers256-MAPBGA (17x17)N/A0°C ~ 70°C (TA)
Core Processor:
Coldfire V4
Core Size:
32-Bit Single-Core
Speed:
240MHz
Connectivity:
I2C, SPI, SSI, UART/USART, USB OTG
Peripherals:
DMA, WDT
Number of I/O:
132
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-MAPBGA (17×17)
Package / Case:
256-LBGA
200
MCF54451VM240JMCF54451VM240JNXP SemiconductorsIC MCU 32BIT ROMLESS 256MAPBGAMicrocontrollers256-MAPBGA (17x17)N/A0°C ~ 70°C (TA)
Core Processor:
Coldfire V4
Core Size:
32-Bit Single-Core
Speed:
240MHz
Connectivity:
I2C, SPI, SSI, UART/USART, USB OTG
Peripherals:
DMA, WDT
Number of I/O:
132
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-MAPBGA (17×17)
Package / Case:
256-LBGA
1,212
MCF54452CVP200MCF54452CVP200NXP SemiconductorsIC MCU 32BIT ROMLESS 360BGAMicrocontrollers360-BGA (23x23)N/A-40°C ~ 85°C (TA)
Core Processor:
Coldfire V4
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
I2C, SPI, SSI, UART/USART, USB OTG
Peripherals:
DMA, WDT
Number of I/O:
132
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 3.6V
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
360-BGA (23×23)
Package / Case:
360-BBGA
1,322
MCF54452CVR200MCF54452CVR200NXP SemiconductorsIC MCU 32BIT ROMLESS 360TEPBGAMicrocontrollers360-TEPBGA (23x23)N/A-40°C ~ 85°C (TA)
Core Processor:
Coldfire V4
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
I2C, SPI, SSI, UART/USART, USB OTG
Peripherals:
DMA, WDT
Number of I/O:
132
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
360-TEPBGA (23×23)
Package / Case:
360-BBGA
175
MCF54452VP266MCF54452VP266NXP SemiconductorsIC MCU 32BIT ROMLESS 360BGAMicrocontrollers360-BGA (23x23)N/A0°C ~ 70°C (TA)
Core Processor:
Coldfire V4
Core Size:
32-Bit Single-Core
Speed:
266MHz
Connectivity:
I2C, SPI, SSI, UART/USART, USB OTG
Peripherals:
DMA, WDT
Number of I/O:
132
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 3.6V
Oscillator Type:
External, Internal
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
360-BGA (23×23)
Package / Case:
360-BBGA
812
MCF54452VP266RMCF54452VP266RNXP SemiconductorsIC MCU 32BIT ROMLESS 360BGAMicrocontrollers360-BGA (23x23)N/A0°C ~ 70°C (TA)
Core Processor:
Coldfire V4
Core Size:
32-Bit Single-Core
Speed:
266MHz
Connectivity:
I2C, SPI, SSI, UART/USART, USB OTG
Peripherals:
DMA, WDT
Number of I/O:
132
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 3.6V
Oscillator Type:
External, Internal
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
360-BGA (23×23)
Package / Case:
360-BBGA
5
MCF54452VR266MCF54452VR266NXP SemiconductorsIC MCU 32BIT ROMLESS 360TEPBGAMicrocontrollers360-TEPBGA (23x23)N/A0°C ~ 70°C (TA)
Core Processor:
Coldfire V4
Core Size:
32-Bit Single-Core
Speed:
266MHz
Connectivity:
I2C, SPI, SSI, UART/USART, USB OTG
Peripherals:
DMA, WDT
Number of I/O:
132
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
360-TEPBGA (23×23)
Package / Case:
360-BBGA
361
MCF54452VR266RMCF54452VR266RNXP SemiconductorsIC MCU 32BIT ROMLESS 360TEPBGAMicrocontrollers360-TEPBGA (23x23)N/A0°C ~ 70°C (TA)
Core Processor:
Coldfire V4
Core Size:
32-Bit Single-Core
Speed:
266MHz
Connectivity:
I2C, SPI, SSI, UART/USART, USB OTG
Peripherals:
DMA, WDT
Number of I/O:
132
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
360-TEPBGA (23×23)
Package / Case:
360-BBGA
957
MCF54453CVP200MCF54453CVP200NXP SemiconductorsIC MCU 32BIT ROMLESS 360BGAMicrocontrollers360-BGA (23x23)N/A-40°C ~ 85°C (TA)
Core Processor:
Coldfire V4
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
I2C, SPI, SSI, UART/USART, USB OTG
Peripherals:
DMA, WDT
Number of I/O:
132
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 3.6V
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
360-BGA (23×23)
Package / Case:
360-BBGA
511
MCF54453CVR200MCF54453CVR200NXP SemiconductorsIC MCU 32BIT ROMLESS 360TEPBGAMicrocontrollers360-TEPBGA (23x23)N/A-40°C ~ 85°C (TA)
Core Processor:
Coldfire V4
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
I2C, SPI, SSI, UART/USART, USB OTG
Peripherals:
DMA, WDT
Number of I/O:
132
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
360-TEPBGA (23×23)
Package / Case:
360-BBGA
367
MCF54453VP266MCF54453VP266NXP SemiconductorsIC MCU 32BIT ROMLESS 360BGAMicrocontrollers360-BGA (23x23)N/A0°C ~ 70°C (TA)
Core Processor:
Coldfire V4
Core Size:
32-Bit Single-Core
Speed:
266MHz
Connectivity:
I2C, SPI, SSI, UART/USART, USB OTG
Peripherals:
DMA, WDT
Number of I/O:
132
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 3.6V
Oscillator Type:
External, Internal
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
360-BGA (23×23)
Package / Case:
360-BBGA
1,409
MCF54453VR266MCF54453VR266NXP SemiconductorsIC MCU 32BIT ROMLESS 360TEPBGAMicrocontrollers360-TEPBGA (23x23)N/A0°C ~ 70°C (TA)
Core Processor:
Coldfire V4
Core Size:
32-Bit Single-Core
Speed:
266MHz
Connectivity:
I2C, SPI, SSI, UART/USART, USB OTG
Peripherals:
DMA, WDT
Number of I/O:
132
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
360-TEPBGA (23×23)
Package / Case:
360-BBGA
762
MCF54454CVP200MCF54454CVP200NXP SemiconductorsIC MCU 32BIT ROMLESS 360BGAMicrocontrollers360-BGA (23x23)N/A-40°C ~ 85°C (TA)
Core Processor:
Coldfire V4
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
I2C, SPI, SSI, UART/USART, USB OTG
Peripherals:
DMA, WDT
Number of I/O:
132
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 3.6V
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
360-BGA (23×23)
Package / Case:
360-BBGA
834
MCF54454CVR200MCF54454CVR200NXP SemiconductorsIC MCU 32BIT ROMLESS 360TEPBGAMicrocontrollers360-TEPBGA (23x23)N/A-40°C ~ 85°C (TA)
Core Processor:
Coldfire V4
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
I2C, SPI, SSI, UART/USART, USB OTG
Peripherals:
DMA, WDT
Number of I/O:
132
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
360-TEPBGA (23×23)
Package / Case:
360-BBGA
858
MCF54454VP266MCF54454VP266NXP SemiconductorsIC MCU 32BIT ROMLESS 360BGAMicrocontrollers360-BGA (23x23)N/A0°C ~ 70°C (TA)
Core Processor:
Coldfire V4
Core Size:
32-Bit Single-Core
Speed:
266MHz
Connectivity:
I2C, SPI, SSI, UART/USART, USB OTG
Peripherals:
DMA, WDT
Number of I/O:
132
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 3.6V
Oscillator Type:
External, Internal
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
360-BGA (23×23)
Package / Case:
360-BBGA
1,519
MCF54454VR266MCF54454VR266NXP SemiconductorsIC MCU 32BIT ROMLESS 360TEPBGAMicrocontrollers360-TEPBGA (23x23)N/A0°C ~ 70°C (TA)
Core Processor:
Coldfire V4
Core Size:
32-Bit Single-Core
Speed:
266MHz
Connectivity:
I2C, SPI, SSI, UART/USART, USB OTG
Peripherals:
DMA, WDT
Number of I/O:
132
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
360-TEPBGA (23×23)
Package / Case:
360-BBGA
1,886
MCF54455CVP200MCF54455CVP200NXP SemiconductorsIC MCU 32BIT ROMLESS 360BGAMicrocontrollers360-BGA (23x23)N/A-40°C ~ 85°C (TA)
Core Processor:
Coldfire V4
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
I2C, SPI, SSI, UART/USART, USB OTG
Peripherals:
DMA, WDT
Number of I/O:
132
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 3.6V
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
360-BGA (23×23)
Package / Case:
360-BBGA
286
MCF54455CVR200MCF54455CVR200NXP SemiconductorsIC MCU 32BIT ROMLESS 360TEPBGAMicrocontrollers360-TEPBGA (23x23)N/A-40°C ~ 85°C (TA)
Core Processor:
Coldfire V4
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
I2C, SPI, SSI, UART/USART, USB OTG
Peripherals:
DMA, WDT
Number of I/O:
132
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
360-TEPBGA (23×23)
Package / Case:
360-BBGA
198

See What We Have to Offer!

See What We Have to Offer!

keyboard_arrow_up