 | | MCF54455VP266 | NXP Semiconductors | IC MCU 32BIT ROMLESS 360BGA | Microcontrollers | 360-BGA (23x23) | N/A | 0°C ~ 70°C (TA) | Core Processor: Coldfire V4 Core Size: 32-Bit Single-Core Connectivity: I2C, SPI, SSI, UART/USART, USB OTG Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.35V ~ 3.6V Oscillator Type: External, Internal Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 360-BGA (23×23) | 694 | |
 | | MCF54455VR266 | NXP Semiconductors | IC MCU 32BIT ROMLESS 360TEPBGA | Microcontrollers | 360-TEPBGA (23x23) | N/A | 0°C ~ 70°C (TA) | Core Processor: Coldfire V4 Core Size: 32-Bit Single-Core Connectivity: I2C, SPI, SSI, UART/USART, USB OTG Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.35V ~ 3.6V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 360-TEPBGA (23×23) | 322 | |
 | | MCF5470VR200 | NXP Semiconductors | IC MCU 32BIT ROMLESS 388PBGA | Microcontrollers | 388-PBGA (27x27) | N/A | 0°C ~ 70°C (TA) | Core Processor: Coldfire V4E Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB Peripherals: DMA, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.43V ~ 1.58V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 388-PBGA (27×27) | 1,493 | |
 | | MCF5471VR200 | NXP Semiconductors | IC MCU 32BIT ROMLESS 388PBGA | Microcontrollers | 388-PBGA (27x27) | N/A | 0°C ~ 70°C (TA) | Core Processor: Coldfire V4E Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB Peripherals: DMA, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.43V ~ 1.58V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 388-PBGA (27×27) | 11 | |
 | | MCF5471ZP200 | NXP Semiconductors | IC MCU 32BIT ROMLESS 388PBGA | Microcontrollers | 388-PBGA (27x27) | N/A | 0°C ~ 70°C (TA) | Core Processor: Coldfire V4E Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB Peripherals: DMA, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.43V ~ 1.58V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 388-PBGA (27×27) | 611 | |
 | | MCF5472VR200 | NXP Semiconductors | IC MCU 32BIT ROMLESS 388PBGA | Microcontrollers | 388-PBGA (27x27) | N/A | 0°C ~ 70°C (TA) | Core Processor: Coldfire V4E Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB Peripherals: DMA, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.43V ~ 1.58V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 388-PBGA (27×27) | 261 | |
 | | MCF5473ZP200 | NXP Semiconductors | IC MCU 32BIT ROMLESS 388PBGA | Microcontrollers | 388-PBGA (27x27) | N/A | 0°C ~ 70°C (TA) | Core Processor: Coldfire V4E Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB Peripherals: DMA, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.43V ~ 1.58V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 388-PBGA (27×27) | 30 | |
 | | MCF5474VR200 | NXP Semiconductors | IC MCU 32BIT ROMLESS 388PBGA | Microcontrollers | 388-PBGA (27x27) | N/A | 0°C ~ 70°C (TA) | Core Processor: Coldfire V4E Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB Peripherals: DMA, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.43V ~ 1.58V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 388-PBGA (27×27) | 420 | |
 | | MCF5474VR266 | NXP Semiconductors | IC MCU 32BIT ROMLESS 388PBGA | Microcontrollers | 388-PBGA (27x27) | N/A | 0°C ~ 70°C (TA) | Core Processor: Coldfire V4E Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB Peripherals: DMA, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.43V ~ 1.58V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 388-PBGA (27×27) | 253 | |
 | | MCF5474ZP200 | NXP Semiconductors | IC MCU 32BIT ROMLESS 388PBGA | Microcontrollers | 388-PBGA (27x27) | N/A | 0°C ~ 70°C (TA) | Core Processor: Coldfire V4E Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB Peripherals: DMA, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.43V ~ 1.58V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 388-PBGA (27×27) | 197 | |
 | | MCF5474ZP266 | NXP Semiconductors | IC MCU 32BIT ROMLESS 388PBGA | Microcontrollers | 388-PBGA (27x27) | N/A | 0°C ~ 70°C (TA) | Core Processor: Coldfire V4E Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB Peripherals: DMA, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.43V ~ 1.58V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 388-PBGA (27×27) | 945 | |
 | | MCF5475VR200 | NXP Semiconductors | IC MCU 32BIT ROMLESS 388PBGA | Microcontrollers | 388-PBGA (27x27) | N/A | 0°C ~ 70°C (TA) | Core Processor: Coldfire V4E Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB Peripherals: DMA, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.43V ~ 1.58V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 388-PBGA (27×27) | 539 | |
 | | MCF5475VR266 | NXP Semiconductors | IC MCU 32BIT ROMLESS 388PBGA | Microcontrollers | 388-PBGA (27x27) | N/A | 0°C ~ 70°C (TA) | Core Processor: Coldfire V4E Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB Peripherals: DMA, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.43V ~ 1.58V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 388-PBGA (27×27) | 209 | |
 | | MCF5475ZP200 | NXP Semiconductors | IC MCU 32BIT ROMLESS 388PBGA | Microcontrollers | 388-PBGA (27x27) | N/A | 0°C ~ 70°C (TA) | Core Processor: Coldfire V4E Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB Peripherals: DMA, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.43V ~ 1.58V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 388-PBGA (27×27) | 1,071 | |
 | | MCF5475ZP266 | NXP Semiconductors | IC MCU 32BIT ROMLESS 388PBGA | Microcontrollers | 388-PBGA (27x27) | N/A | 0°C ~ 70°C (TA) | Core Processor: Coldfire V4E Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB Peripherals: DMA, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.43V ~ 1.58V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 388-PBGA (27×27) | 414 | |
 | | MCF5480CVR166 | NXP Semiconductors | IC MCU 32BIT ROMLESS 388PBGA | Microcontrollers | 388-PBGA (27x27) | N/A | -40°C ~ 85°C (TA) | Core Processor: Coldfire V4E Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB Peripherals: DMA, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.43V ~ 1.58V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 388-PBGA (27×27) | 807 | |
 | | MCF5480CZP166 | NXP Semiconductors | IC MCU 32BIT ROMLESS 388PBGA | Microcontrollers | 388-PBGA (27x27) | N/A | -40°C ~ 85°C (TA) | Core Processor: Coldfire V4E Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB Peripherals: DMA, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.43V ~ 1.58V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 388-PBGA (27×27) | 160 | |
 | | MCF5481CVR166 | NXP Semiconductors | IC MCU 32BIT ROMLESS 388PBGA | Microcontrollers | 388-PBGA (27x27) | N/A | -40°C ~ 85°C (TA) | Core Processor: Coldfire V4E Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB Peripherals: DMA, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.43V ~ 1.58V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 388-PBGA (27×27) | 820 | |
 | | MCF5482CVR166 | NXP Semiconductors | IC MCU 32BIT ROMLESS 388PBGA | Microcontrollers | 388-PBGA (27x27) | N/A | -40°C ~ 85°C (TA) | Core Processor: Coldfire V4E Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB Peripherals: DMA, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.43V ~ 1.58V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 388-PBGA (27×27) | 64 | |
 | | MCF5482CZP166 | NXP Semiconductors | IC MCU 32BIT ROMLESS 388PBGA | Microcontrollers | 388-PBGA (27x27) | N/A | -40°C ~ 85°C (TA) | Core Processor: Coldfire V4E Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB Peripherals: DMA, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.43V ~ 1.58V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 388-PBGA (27×27) | 1,066 | |