 | | MCF5483CVR166 | NXP Semiconductors | IC MCU 32BIT ROMLESS 388PBGA | Microcontrollers | 388-PBGA (27x27) | N/A | -40°C ~ 85°C (TA) | Core Processor: Coldfire V4E Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB Peripherals: DMA, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.43V ~ 1.58V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 388-PBGA (27×27) | 666 | |
 | | MCF5484CVR200 | NXP Semiconductors | IC MCU 32BIT ROMLESS 388PBGA | Microcontrollers | 388-PBGA (27x27) | N/A | -40°C ~ 85°C (TA) | Core Processor: Coldfire V4E Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB Peripherals: DMA, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.43V ~ 1.58V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 388-PBGA (27×27) | 1,286 | |
 | | MCF5484CZP200 | NXP Semiconductors | IC MCU 32BIT ROMLESS 388PBGA | Microcontrollers | 388-PBGA (27x27) | N/A | -40°C ~ 85°C (TA) | Core Processor: Coldfire V4E Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB Peripherals: DMA, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.43V ~ 1.58V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 388-PBGA (27×27) | 179 | |
 | | MCF5485CVR200 | NXP Semiconductors | IC MCU 32BIT ROMLESS 388PBGA | Microcontrollers | 388-PBGA (27x27) | N/A | -40°C ~ 85°C (TA) | Core Processor: Coldfire V4E Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB Peripherals: DMA, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.43V ~ 1.58V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 388-PBGA (27×27) | 445 | |
 | | MCF5485CZP200 | NXP Semiconductors | IC MCU 32BIT ROMLESS 388PBGA | Microcontrollers | 388-PBGA (27x27) | N/A | -40°C ~ 85°C (TA) | Core Processor: Coldfire V4E Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB Peripherals: DMA, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.43V ~ 1.58V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 388-PBGA (27×27) | 1,262 | |
 | | MCHC11F1CFNE2 | NXP Semiconductors | IC MCU 8BIT ROMLESS 68PLCC | Microcontrollers | 68-PLCC (24.21x24.21) | N/A | -40°C ~ 85°C (TA) | Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 4.75V ~ 5.25V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 68-PLCC (24.21×24.21) Package / Case: 68-LCC (J-Lead) | 543 | |
 | | MCHC11F1CFNE2R | NXP Semiconductors | IC MCU 8BIT ROMLESS 68PLCC | Microcontrollers | 68-PLCC (24.21x24.21) | N/A | -40°C ~ 85°C (TA) | Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 4.75V ~ 5.25V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 68-PLCC (24.21×24.21) Package / Case: 68-LCC (J-Lead) | 1,025 | |
 | | MCHC11F1CFNE3 | NXP Semiconductors | IC MCU 8BIT ROMLESS 68PLCC | Microcontrollers | 68-PLCC (24.21x24.21) | N/A | -40°C ~ 85°C (TA) | Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 4.75V ~ 5.25V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 68-PLCC (24.21×24.21) Package / Case: 68-LCC (J-Lead) | 1,192 | |
 | | MCHC11F1CFNE3R | NXP Semiconductors | IC MCU 8BIT ROMLESS 68PLCC | Microcontrollers | 68-PLCC (24.21x24.21) | N/A | -40°C ~ 85°C (TA) | Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 4.75V ~ 5.25V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 68-PLCC (24.21×24.21) Package / Case: 68-LCC (J-Lead) | 1,287 | |
 | | MCHC11F1CFNE4 | NXP Semiconductors | IC MCU 8BIT ROMLESS 68PLCC | Microcontrollers | 68-PLCC (24.21x24.21) | N/A | -40°C ~ 85°C (TA) | Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 4.75V ~ 5.25V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 68-PLCC (24.21×24.21) Package / Case: 68-LCC (J-Lead) | 881 | |
 | | MCHC11F1CFNE4R | NXP Semiconductors | IC MCU 8BIT ROMLESS 68PLCC | Microcontrollers | 68-PLCC (24.21x24.21) | N/A | -40°C ~ 85°C (TA) | Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 4.75V ~ 5.25V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 68-PLCC (24.21×24.21) Package / Case: 68-LCC (J-Lead) | 650 | |
 | | MCHC11F1CFNE5 | NXP Semiconductors | IC MCU 8BIT ROMLESS 68PLCC | Microcontrollers | 68-PLCC (24.21x24.21) | N/A | -40°C ~ 85°C (TA) | Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 4.75V ~ 5.25V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 68-PLCC (24.21×24.21) Package / Case: 68-LCC (J-Lead) | 1,247 | |
 | | MCHC11F1VFNE3 | NXP Semiconductors | IC MCU 8BIT ROMLESS 68PLCC | Microcontrollers | 68-PLCC (24.21x24.21) | N/A | -40°C ~ 105°C (TA) | Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 4.75V ~ 5.25V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 68-PLCC (24.21×24.21) Package / Case: 68-LCC (J-Lead) | 359 | |
 | N/A | MCHC11F1VFNE4 | NXP Semiconductors | IC MCU 8BIT ROMLESS 68PLCC | Microcontrollers | 68-PLCC (24.21x24.21) | N/A | -40°C ~ 105°C (TA) | Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 4.75V ~ 5.25V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 68-PLCC (24.21×24.21) Package / Case: 68-LCC (J-Lead) | 3 | |
 | N/A | MCHC11F1VFNE4R | NXP Semiconductors | IC MCU 8BIT ROMLESS 68PLCC | Microcontrollers | 68-PLCC (24.21x24.21) | N/A | -40°C ~ 105°C (TA) | Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 4.75V ~ 5.25V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 68-PLCC (24.21×24.21) Package / Case: 68-LCC (J-Lead) | 381 | |
 | | MCHC705B16NCFNE | NXP Semiconductors | IC MCU 8BIT 15KB OTP 52PLCC | Microcontrollers | 52-PLCC (19.1x19.1) | N/A | -40°C ~ 85°C (TA) | Program Memory Size: 15KB (15K x 8) Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.5V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 52-PLCC (19.1×19.1) Package / Case: 52-LCC (J-Lead) | 889 | |
 | | MCHC705B16NVFNE | NXP Semiconductors | IC MCU 8BIT 15KB OTP 52PLCC | Microcontrollers | 52-PLCC (19.1x19.1) | N/A | -40°C ~ 105°C (TA) | Program Memory Size: 15KB (15K x 8) Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.5V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 52-PLCC (19.1×19.1) Package / Case: 52-LCC (J-Lead) | 540 | |
 | | MCHC705JJ7CPE | NXP Semiconductors | IC MCU 8BIT 6KB OTP 20DIP | Microcontrollers | 20-DIP | N/A | -40°C ~ 85°C (TA) | Peripherals: POR, Temp Sensor, WDT Program Memory Size: 6KB (6K x 8) Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 4x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Through Hole Supplier Device Package: 20-DIP Package / Case: 20-DIP (0.300″”, 7.62mm) | 1,117 | |
 | | MCHC705JP7CDWE | NXP Semiconductors | IC MCU 8BIT 6KB OTP 28SOIC | Microcontrollers | 28-SOIC | N/A | -40°C ~ 85°C (TA) | Peripherals: POR, Temp Sensor, WDT Program Memory Size: 6KB (6K x 8) Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 4x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 28-SOIC Package / Case: 28-SOIC (0.295″”, 7.50mm Width) | 393 | |
 | | MCHC705KJ1CDWE | NXP Semiconductors | IC MCU 8BIT 1.2KB OTP 16SOIC | Microcontrollers | 16-SOIC | N/A | -40°C ~ 85°C (TA) | Program Memory Size: 1.2KB (1.2K x 8) Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 16-SOIC Package / Case: 16-SOIC (0.295″”, 7.50mm Width) | 1,938 | |