Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,052
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
MCF5282CVM80JMCF5282CVM80JNXP SemiconductorsIC MCU 32B 512KB FLASH 256MAPBGAMicrocontrollers256-MAPBGA (17x17)N/A-40°C ~ 85°C (TA)
Core Processor:
Coldfire V2
Core Size:
32-Bit Single-Core
Speed:
80MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
150
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-MAPBGA (17×17)
Package / Case:
256-LBGA
1,683
MCF53011CQT240MCF53011CQT240NXP SemiconductorsIC MCU 32BIT ROMLESS 208TQFPMicrocontrollers208-TQFP (28x28)N/A-40°C ~ 85°C (TA)
Core Processor:
Coldfire V3
Core Size:
32-Bit Single-Core
Speed:
240MHz
Connectivity:
EBI/EMI, Ethernet, I2C, Memory Card, SPI, SSI, UART/USART, USB OTG
Peripherals:
DMA, PWM, WDT
Number of I/O:
61
Program Memory Type:
ROMless
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
1.08V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-TQFP (28×28)
Package / Case:
208-LQFP
807
MCF53014CMJ240JMCF53014CMJ240JNXP SemiconductorsIC MCU 32BIT ROMLESS 256MAPBGAMicrocontrollers256-MAPBGA (17x17)N/A-40°C ~ 85°C (TA)
Core Processor:
Coldfire V3
Core Size:
32-Bit Single-Core
Speed:
240MHz
Connectivity:
EBI/EMI, Ethernet, I2C, Memory Card, SPI, SSI, UART/USART, USB, USB OTG
Peripherals:
DMA, PWM, WDT
Number of I/O:
83
Program Memory Type:
ROMless
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
1.08V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-MAPBGA (17×17)
Package / Case:
256-LBGA
1,526
MCF53015CMJ240JMCF53015CMJ240JNXP SemiconductorsIC MCU 32BIT ROMLESS 256MAPBGAMicrocontrollers256-MAPBGA (17x17)N/A-40°C ~ 85°C (TA)
Core Processor:
Coldfire V3
Core Size:
32-Bit Single-Core
Speed:
240MHz
Connectivity:
EBI/EMI, Ethernet, I2C, Memory Card, SPI, SSI, UART/USART, USB, USB OTG
Peripherals:
DMA, PWM, WDT
Number of I/O:
83
Program Memory Type:
ROMless
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
1.08V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-MAPBGA (17×17)
Package / Case:
256-LBGA
349
MCF53016CMJ240JMCF53016CMJ240JNXP SemiconductorsIC MCU 32BIT ROMLESS 256MAPBGAMicrocontrollers256-MAPBGA (17x17)N/A-40°C ~ 85°C
Core Processor:
Coldfire V3
Core Size:
32-Bit Single-Core
Speed:
240MHz
Connectivity:
EBI/EMI, Ethernet, I2C, Memory Card, SPI, SSI, UART/USART, USB, USB OTG
Peripherals:
DMA, PWM, WDT
Number of I/O:
83
Program Memory Type:
ROMless
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
1.08V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C
Mounting Type:
Surface Mount
Supplier Device Package:
256-MAPBGA (17×17)
Package / Case:
256-LBGA
271
MCF53017CMJ240JMCF53017CMJ240JNXP SemiconductorsIC MCU 32BIT ROMLESS 256MAPBGAMicrocontrollers256-MAPBGA (17x17)N/A-40°C ~ 85°C (TA)
Core Processor:
Coldfire V3
Core Size:
32-Bit Single-Core
Speed:
240MHz
Connectivity:
EBI/EMI, Ethernet, I2C, Memory Card, SPI, SSI, UART/USART, USB, USB OTG
Peripherals:
DMA, PWM, WDT
Number of I/O:
83
Program Memory Type:
ROMless
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
1.08V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-MAPBGA (17×17)
Package / Case:
256-LBGA
488
MCF5307AI66BMCF5307AI66BNXP SemiconductorsIC MCU 32BIT ROMLESS 208FQFPMicrocontrollers208-FQFP (28x28)N/A0°C ~ 70°C (TA)
Core Processor:
Coldfire V3
Core Size:
32-Bit Single-Core
Speed:
66MHz
Connectivity:
EBI/EMI, I2C, UART/USART
Peripherals:
DMA, POR, WDT
Number of I/O:
16
Program Memory Type:
ROMless
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Oscillator Type:
External
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-FQFP (28×28)
Package / Case:
208-BFQFP
850
MCF5307AI90BMCF5307AI90BNXP SemiconductorsIC MCU 32BIT ROMLESS 208FQFPMicrocontrollers208-FQFP (28x28)N/A0°C ~ 70°C (TA)
Core Processor:
Coldfire V3
Core Size:
32-Bit Single-Core
Speed:
90MHz
Connectivity:
EBI/EMI, I2C, UART/USART
Peripherals:
DMA, POR, WDT
Number of I/O:
16
Program Memory Type:
ROMless
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Oscillator Type:
External
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-FQFP (28×28)
Package / Case:
208-BFQFP
875
MCF5307CAI66BMCF5307CAI66BNXP SemiconductorsIC MCU 32BIT ROMLESS 208FQFPMicrocontrollers208-FQFP (28x28)N/A-40°C ~ 85°C (TA)
Core Processor:
Coldfire V3
Core Size:
32-Bit Single-Core
Speed:
66MHz
Connectivity:
EBI/EMI, I2C, UART/USART
Peripherals:
DMA, POR, WDT
Number of I/O:
16
Program Memory Type:
ROMless
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-FQFP (28×28)
Package / Case:
208-BFQFP
656
MCF5307CAI90BMCF5307CAI90BNXP SemiconductorsIC MCU 32BIT ROMLESS 208FQFPMicrocontrollers208-FQFP (28x28)N/A-40°C ~ 85°C (TA)
Core Processor:
Coldfire V3
Core Size:
32-Bit Single-Core
Speed:
90MHz
Connectivity:
EBI/EMI, I2C, UART/USART
Peripherals:
DMA, POR, WDT
Number of I/O:
16
Program Memory Type:
ROMless
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-FQFP (28×28)
Package / Case:
208-BFQFP
1,016
MCF5307CFT66BMCF5307CFT66BNXP SemiconductorsIC MCU 32BIT ROMLESS 208FQFPMicrocontrollers208-FQFP (28x28)N/A-40°C ~ 85°C (TA)
Core Processor:
Coldfire V3
Core Size:
32-Bit Single-Core
Speed:
66MHz
Connectivity:
EBI/EMI, I2C, UART/USART
Peripherals:
DMA, POR, WDT
Number of I/O:
16
Program Memory Type:
ROMless
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-FQFP (28×28)
Package / Case:
208-BFQFP
614
MCF5307FT66BMCF5307FT66BNXP SemiconductorsIC MCU 32BIT ROMLESS 208FQFPMicrocontrollers208-FQFP (28x28)N/A0°C ~ 70°C (TA)
Core Processor:
Coldfire V3
Core Size:
32-Bit Single-Core
Speed:
66MHz
Connectivity:
EBI/EMI, I2C, UART/USART
Peripherals:
DMA, POR, WDT
Number of I/O:
16
Program Memory Type:
ROMless
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Oscillator Type:
External
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-FQFP (28×28)
Package / Case:
208-BFQFP
1,230
MCF5307FT90BMCF5307FT90BNXP SemiconductorsIC MCU 32BIT ROMLESS 208FQFPMicrocontrollers208-FQFP (28x28)N/A0°C ~ 70°C (TA)
Core Processor:
Coldfire V3
Core Size:
32-Bit Single-Core
Speed:
90MHz
Connectivity:
EBI/EMI, I2C, UART/USART
Peripherals:
DMA, POR, WDT
Number of I/O:
16
Program Memory Type:
ROMless
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Oscillator Type:
External
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-FQFP (28×28)
Package / Case:
208-BFQFP
613
MCF5327CVM240MCF5327CVM240NXP SemiconductorsIC MCU 32BIT ROMLESS 196MAPBGAMicrocontrollers196-LBGA (15x15)N/A-40°C ~ 85°C (TA)
Core Processor:
Coldfire V3
Core Size:
32-Bit Single-Core
Speed:
240MHz
Connectivity:
EBI/EMI, I2C, SPI, SSI, UART/USART, USB, USB OTG
Peripherals:
DMA, LCD, PWM, WDT
Number of I/O:
94
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.4V ~ 3.6V
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
196-LBGA (15×15)
Package / Case:
196-LBGA
830
MCF53281CVM240MCF53281CVM240NXP SemiconductorsIC MCU 32BIT ROMLESS 256MAPBGAMicrocontrollers256-MAPBGA (17x17)N/A-40°C ~ 85°C (TA)
Core Processor:
Coldfire V3
Core Size:
32-Bit Single-Core
Speed:
240MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, SPI, SSI, UART/USART, USB, USB OTG
Peripherals:
DMA, LCD, PWM, WDT
Number of I/O:
94
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.4V ~ 3.6V
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-MAPBGA (17×17)
Package / Case:
256-LBGA
461
MCF5328CVM240MCF5328CVM240NXP SemiconductorsIC MCU 32BIT ROMLESS 256MAPBGAMicrocontrollers256-MAPBGA (17x17)N/A-40°C ~ 85°C (TA)
Core Processor:
Coldfire V3
Core Size:
32-Bit Single-Core
Speed:
240MHz
Connectivity:
EBI/EMI, Ethernet, I2C, SPI, SSI, UART/USART, USB, USB OTG
Peripherals:
DMA, LCD, PWM, WDT
Number of I/O:
94
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.4V ~ 3.6V
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-MAPBGA (17×17)
Package / Case:
256-LBGA
1,603
MCF5328CVM240JMCF5328CVM240JNXP SemiconductorsIC MCU 32BIT ROMLESS 256MAPBGAMicrocontrollers256-MAPBGA (17x17)N/A-40°C ~ 85°C (TA)
Core Processor:
Coldfire V3
Core Size:
32-Bit Single-Core
Speed:
240MHz
Connectivity:
EBI/EMI, Ethernet, I2C, SPI, SSI, UART/USART, USB, USB OTG
Peripherals:
DMA, LCD, PWM, WDT
Number of I/O:
94
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.4V ~ 3.6V
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-MAPBGA (17×17)
Package / Case:
256-LBGA
314
MCF5329CVM240MCF5329CVM240NXP SemiconductorsIC MCU 32BIT ROMLESS 256MAPBGAMicrocontrollers256-MAPBGA (17x17)N/A-40°C ~ 85°C (TA)
Core Processor:
Coldfire V3
Core Size:
32-Bit Single-Core
Speed:
240MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, SPI, SSI, UART/USART, USB, USB OTG
Peripherals:
DMA, LCD, PWM, WDT
Number of I/O:
94
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.4V ~ 3.6V
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-MAPBGA (17×17)
Package / Case:
256-LBGA
1,432
MCF5329CVM240JMCF5329CVM240JNXP SemiconductorsIC MCU 32BIT ROMLESS 256MAPBGAMicrocontrollers256-MAPBGA (17x17)N/A-40°C ~ 85°C (TA)
Core Processor:
Coldfire V3
Core Size:
32-Bit Single-Core
Speed:
240MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, SPI, SSI, UART/USART, USB, USB OTG
Peripherals:
DMA, LCD, PWM, WDT
Number of I/O:
94
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.4V ~ 3.6V
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-MAPBGA (17×17)
Package / Case:
256-LBGA
2
MCF53721CVM240MCF53721CVM240NXP SemiconductorsIC MCU 32BIT ROMLESS 196MAPBGAMicrocontrollers196-LBGA (15x15)N/A-40°C ~ 85°C (TA)
Core Processor:
Coldfire V3
Core Size:
32-Bit Single-Core
Speed:
240MHz
Connectivity:
EBI/EMI, Ethernet, I2C, SPI, SSI, UART/USART, USB, USB OTG
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
62
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.4V ~ 3.6V
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
196-LBGA (15×15)
Package / Case:
196-LBGA
858

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