 | | MCF5282CVM80J | NXP Semiconductors | IC MCU 32B 512KB FLASH 256MAPBGA | Microcontrollers | 256-MAPBGA (17x17) | N/A | -40°C ~ 85°C (TA) | Core Processor: Coldfire V2 Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 3.6V Data Converters: A/D 8x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-MAPBGA (17×17) | 1,683 | |
 | | MCF53011CQT240 | NXP Semiconductors | IC MCU 32BIT ROMLESS 208TQFP | Microcontrollers | 208-TQFP (28x28) | N/A | -40°C ~ 85°C (TA) | Core Processor: Coldfire V3 Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, Ethernet, I2C, Memory Card, SPI, SSI, UART/USART, USB OTG Peripherals: DMA, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.08V ~ 3.6V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-TQFP (28×28) | 807 | |
 | | MCF53014CMJ240J | NXP Semiconductors | IC MCU 32BIT ROMLESS 256MAPBGA | Microcontrollers | 256-MAPBGA (17x17) | N/A | -40°C ~ 85°C (TA) | Core Processor: Coldfire V3 Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, Ethernet, I2C, Memory Card, SPI, SSI, UART/USART, USB, USB OTG Peripherals: DMA, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.08V ~ 3.6V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-MAPBGA (17×17) | 1,526 | |
 | | MCF53015CMJ240J | NXP Semiconductors | IC MCU 32BIT ROMLESS 256MAPBGA | Microcontrollers | 256-MAPBGA (17x17) | N/A | -40°C ~ 85°C (TA) | Core Processor: Coldfire V3 Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, Ethernet, I2C, Memory Card, SPI, SSI, UART/USART, USB, USB OTG Peripherals: DMA, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.08V ~ 3.6V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-MAPBGA (17×17) | 349 | |
 | | MCF53016CMJ240J | NXP Semiconductors | IC MCU 32BIT ROMLESS 256MAPBGA | Microcontrollers | 256-MAPBGA (17x17) | N/A | -40°C ~ 85°C | Core Processor: Coldfire V3 Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, Ethernet, I2C, Memory Card, SPI, SSI, UART/USART, USB, USB OTG Peripherals: DMA, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.08V ~ 3.6V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Supplier Device Package: 256-MAPBGA (17×17) | 271 | |
 | | MCF53017CMJ240J | NXP Semiconductors | IC MCU 32BIT ROMLESS 256MAPBGA | Microcontrollers | 256-MAPBGA (17x17) | N/A | -40°C ~ 85°C (TA) | Core Processor: Coldfire V3 Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, Ethernet, I2C, Memory Card, SPI, SSI, UART/USART, USB, USB OTG Peripherals: DMA, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.08V ~ 3.6V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-MAPBGA (17×17) | 488 | |
 | | MCF5307AI66B | NXP Semiconductors | IC MCU 32BIT ROMLESS 208FQFP | Microcontrollers | 208-FQFP (28x28) | N/A | 0°C ~ 70°C (TA) | Core Processor: Coldfire V3 Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, I2C, UART/USART Peripherals: DMA, POR, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-FQFP (28×28) | 850 | |
 | | MCF5307AI90B | NXP Semiconductors | IC MCU 32BIT ROMLESS 208FQFP | Microcontrollers | 208-FQFP (28x28) | N/A | 0°C ~ 70°C (TA) | Core Processor: Coldfire V3 Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, I2C, UART/USART Peripherals: DMA, POR, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-FQFP (28×28) | 875 | |
 | | MCF5307CAI66B | NXP Semiconductors | IC MCU 32BIT ROMLESS 208FQFP | Microcontrollers | 208-FQFP (28x28) | N/A | -40°C ~ 85°C (TA) | Core Processor: Coldfire V3 Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, I2C, UART/USART Peripherals: DMA, POR, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-FQFP (28×28) | 656 | |
 | | MCF5307CAI90B | NXP Semiconductors | IC MCU 32BIT ROMLESS 208FQFP | Microcontrollers | 208-FQFP (28x28) | N/A | -40°C ~ 85°C (TA) | Core Processor: Coldfire V3 Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, I2C, UART/USART Peripherals: DMA, POR, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-FQFP (28×28) | 1,016 | |
 | | MCF5307CFT66B | NXP Semiconductors | IC MCU 32BIT ROMLESS 208FQFP | Microcontrollers | 208-FQFP (28x28) | N/A | -40°C ~ 85°C (TA) | Core Processor: Coldfire V3 Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, I2C, UART/USART Peripherals: DMA, POR, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-FQFP (28×28) | 614 | |
 | | MCF5307FT66B | NXP Semiconductors | IC MCU 32BIT ROMLESS 208FQFP | Microcontrollers | 208-FQFP (28x28) | N/A | 0°C ~ 70°C (TA) | Core Processor: Coldfire V3 Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, I2C, UART/USART Peripherals: DMA, POR, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-FQFP (28×28) | 1,230 | |
 | | MCF5307FT90B | NXP Semiconductors | IC MCU 32BIT ROMLESS 208FQFP | Microcontrollers | 208-FQFP (28x28) | N/A | 0°C ~ 70°C (TA) | Core Processor: Coldfire V3 Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, I2C, UART/USART Peripherals: DMA, POR, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-FQFP (28×28) | 613 | |
 | | MCF5327CVM240 | NXP Semiconductors | IC MCU 32BIT ROMLESS 196MAPBGA | Microcontrollers | 196-LBGA (15x15) | N/A | -40°C ~ 85°C (TA) | Core Processor: Coldfire V3 Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, I2C, SPI, SSI, UART/USART, USB, USB OTG Peripherals: DMA, LCD, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.4V ~ 3.6V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 196-LBGA (15×15) | 830 | |
 | | MCF53281CVM240 | NXP Semiconductors | IC MCU 32BIT ROMLESS 256MAPBGA | Microcontrollers | 256-MAPBGA (17x17) | N/A | -40°C ~ 85°C (TA) | Core Processor: Coldfire V3 Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, SSI, UART/USART, USB, USB OTG Peripherals: DMA, LCD, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.4V ~ 3.6V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-MAPBGA (17×17) | 461 | |
 | | MCF5328CVM240 | NXP Semiconductors | IC MCU 32BIT ROMLESS 256MAPBGA | Microcontrollers | 256-MAPBGA (17x17) | N/A | -40°C ~ 85°C (TA) | Core Processor: Coldfire V3 Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, Ethernet, I2C, SPI, SSI, UART/USART, USB, USB OTG Peripherals: DMA, LCD, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.4V ~ 3.6V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-MAPBGA (17×17) | 1,603 | |
 | | MCF5328CVM240J | NXP Semiconductors | IC MCU 32BIT ROMLESS 256MAPBGA | Microcontrollers | 256-MAPBGA (17x17) | N/A | -40°C ~ 85°C (TA) | Core Processor: Coldfire V3 Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, Ethernet, I2C, SPI, SSI, UART/USART, USB, USB OTG Peripherals: DMA, LCD, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.4V ~ 3.6V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-MAPBGA (17×17) | 314 | |
 | | MCF5329CVM240 | NXP Semiconductors | IC MCU 32BIT ROMLESS 256MAPBGA | Microcontrollers | 256-MAPBGA (17x17) | N/A | -40°C ~ 85°C (TA) | Core Processor: Coldfire V3 Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, SSI, UART/USART, USB, USB OTG Peripherals: DMA, LCD, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.4V ~ 3.6V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-MAPBGA (17×17) | 1,432 | |
 | | MCF5329CVM240J | NXP Semiconductors | IC MCU 32BIT ROMLESS 256MAPBGA | Microcontrollers | 256-MAPBGA (17x17) | N/A | -40°C ~ 85°C (TA) | Core Processor: Coldfire V3 Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, SSI, UART/USART, USB, USB OTG Peripherals: DMA, LCD, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.4V ~ 3.6V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-MAPBGA (17×17) | 2 | |
 | | MCF53721CVM240 | NXP Semiconductors | IC MCU 32BIT ROMLESS 196MAPBGA | Microcontrollers | 196-LBGA (15x15) | N/A | -40°C ~ 85°C (TA) | Core Processor: Coldfire V3 Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, Ethernet, I2C, SPI, SSI, UART/USART, USB, USB OTG Peripherals: DMA, POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.4V ~ 3.6V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 196-LBGA (15×15) | 858 | |