Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

Featured Brands

About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,052
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
MCF5271CVM150MCF5271CVM150NXP SemiconductorsIC MCU 32BIT ROMLESS 196MAPBGAMicrocontrollers196-LBGA (15x15)N/A-40°C ~ 85°C (TA)
Core Processor:
Coldfire V2
Core Size:
32-Bit Single-Core
Speed:
150MHz
Connectivity:
EBI/EMI, Ethernet, I2C, SPI, UART/USART
Peripherals:
DMA, WDT
Number of I/O:
97
Program Memory Type:
ROMless
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
1.4V ~ 3.6V
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
196-LBGA (15×15)
Package / Case:
196-LBGA
240
MCF5271CVM150JMCF5271CVM150JNXP SemiconductorsIC MCU 32BIT ROMLESS 196MAPBGAMicrocontrollers196-LBGA (15x15)N/A-40°C ~ 85°C (TA)
Core Processor:
Coldfire V2
Core Size:
32-Bit Single-Core
Speed:
150MHz
Connectivity:
EBI/EMI, Ethernet, I2C, SPI, UART/USART
Peripherals:
DMA, WDT
Number of I/O:
97
Program Memory Type:
ROMless
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
1.4V ~ 3.6V
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
196-LBGA (15×15)
Package / Case:
196-LBGA
959
MCF5272CVF66MCF5272CVF66NXP SemiconductorsIC MCU 32BIT 16KB ROM 196MAPBGAMicrocontrollers196-LBGA (15x15)N/A-40°C ~ 85°C (TA)
Core Processor:
Coldfire V2
Core Size:
32-Bit Single-Core
Speed:
66MHz
Connectivity:
EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals:
DMA, WDT
Number of I/O:
32
Program Memory Size:
16KB (4K x 32)
Program Memory Type:
ROM
RAM Size:
1K x 32
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
196-LBGA (15×15)
Package / Case:
196-LBGA
127
MCF5272CVF66JMCF5272CVF66JNXP SemiconductorsIC MCU 32BIT 16KB ROM 196MAPBGAMicrocontrollers196-LBGA (15x15)N/A-40°C ~ 85°C (TA)
Core Processor:
Coldfire V2
Core Size:
32-Bit Single-Core
Speed:
66MHz
Connectivity:
EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals:
DMA, WDT
Number of I/O:
32
Program Memory Size:
16KB (4K x 32)
Program Memory Type:
ROM
RAM Size:
1K x 32
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
196-LBGA (15×15)
Package / Case:
196-LBGA
1,423
MCF5272CVM66MCF5272CVM66NXP SemiconductorsIC MCU 32BIT 16KB ROM 196MAPBGAMicrocontrollers196-LBGA (15x15)N/A-40°C ~ 85°C (TA)
Core Processor:
Coldfire V2
Core Size:
32-Bit Single-Core
Speed:
66MHz
Connectivity:
EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals:
DMA, WDT
Number of I/O:
32
Program Memory Size:
16KB (4K x 32)
Program Memory Type:
ROM
RAM Size:
1K x 32
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
196-LBGA (15×15)
Package / Case:
196-LBGA
1,584
MCF5272CVM66JMCF5272CVM66JNXP SemiconductorsIC MCU 32BIT 16KB ROM 196MAPBGAMicrocontrollers196-LBGA (15x15)N/A-40°C ~ 85°C (TA)
Core Processor:
Coldfire V2
Core Size:
32-Bit Single-Core
Speed:
66MHz
Connectivity:
EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals:
DMA, WDT
Number of I/O:
32
Program Memory Size:
16KB (4K x 32)
Program Memory Type:
ROM
RAM Size:
1K x 32
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
196-LBGA (15×15)
Package / Case:
196-LBGA
584
MCF5272CVM66R2N/AMCF5272CVM66R2NXP SemiconductorsIC MCU 32BIT 16KB ROM 196PBGAMicrocontrollers196-LBGA (15x15)N/A-40°C ~ 85°C (TA)
Core Processor:
Coldfire V2
Core Size:
32-Bit Single-Core
Speed:
66MHz
Connectivity:
EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals:
DMA, WDT
Number of I/O:
32
Program Memory Size:
16KB (4K x 32)
Program Memory Type:
ROM
RAM Size:
1K x 32
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
196-LBGA (15×15)
Package / Case:
196-LBGA
1,386
MCF5272VF66MCF5272VF66NXP SemiconductorsIC MCU 32BIT 16KB ROM 196MAPBGAMicrocontrollers196-LBGA (15x15)N/A0°C ~ 70°C (TA)
Core Processor:
Coldfire V2
Core Size:
32-Bit Single-Core
Speed:
66MHz
Connectivity:
EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals:
DMA, WDT
Number of I/O:
32
Program Memory Size:
16KB (4K x 32)
Program Memory Type:
ROM
RAM Size:
1K x 32
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Oscillator Type:
External
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
196-LBGA (15×15)
Package / Case:
196-LBGA
47
MCF5272VF66R2MCF5272VF66R2NXP SemiconductorsIC MCU 32BIT 16KB ROM 196MAPBGAMicrocontrollers196-LBGA (15x15)N/A0°C ~ 70°C (TA)
Core Processor:
Coldfire V2
Core Size:
32-Bit Single-Core
Speed:
66MHz
Connectivity:
EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals:
DMA, WDT
Number of I/O:
32
Program Memory Size:
16KB (4K x 32)
Program Memory Type:
ROM
RAM Size:
1K x 32
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Oscillator Type:
External
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
196-LBGA (15×15)
Package / Case:
196-LBGA
616
MCF5272VF66R2JMCF5272VF66R2JNXP SemiconductorsIC MCU 32BIT 16KB ROM 196MAPBGAMicrocontrollers196-LBGA (15x15)N/A0°C ~ 70°C (TA)
Core Processor:
Coldfire V2
Core Size:
32-Bit Single-Core
Speed:
66MHz
Connectivity:
EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals:
DMA, WDT
Number of I/O:
32
Program Memory Size:
16KB (4K x 32)
Program Memory Type:
ROM
RAM Size:
1K x 32
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Oscillator Type:
External
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
196-LBGA (15×15)
Package / Case:
196-LBGA
49
MCF5272VM66MCF5272VM66NXP SemiconductorsIC MCU 32BIT 16KB ROM 196MAPBGAMicrocontrollers196-LBGA (15x15)N/A0°C ~ 70°C (TA)
Core Processor:
Coldfire V2
Core Size:
32-Bit Single-Core
Speed:
66MHz
Connectivity:
EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals:
DMA, WDT
Number of I/O:
32
Program Memory Size:
16KB (4K x 32)
Program Memory Type:
ROM
RAM Size:
1K x 32
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Oscillator Type:
External
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
196-LBGA (15×15)
Package / Case:
196-LBGA
1,626
MCF5272VM66R2MCF5272VM66R2NXP SemiconductorsIC MCU 32BIT 16KB ROM 196MAPBGAMicrocontrollers196-LBGA (15x15)N/A0°C ~ 70°C (TA)
Core Processor:
Coldfire V2
Core Size:
32-Bit Single-Core
Speed:
66MHz
Connectivity:
EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals:
DMA, WDT
Number of I/O:
32
Program Memory Size:
16KB (4K x 32)
Program Memory Type:
ROM
RAM Size:
1K x 32
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Oscillator Type:
External
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
196-LBGA (15×15)
Package / Case:
196-LBGA
1,070
MCF5274CVM166MCF5274CVM166NXP SemiconductorsIC MCU 32BIT ROMLESS 256MAPBGAMicrocontrollers256-MAPBGA (17x17)N/A-40°C ~ 85°C (TA)
Core Processor:
Coldfire V2
Core Size:
32-Bit Single-Core
Speed:
166MHz
Connectivity:
EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals:
DMA, WDT
Number of I/O:
69
Program Memory Type:
ROMless
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
1.4V ~ 1.6V
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-MAPBGA (17×17)
Package / Case:
256-LBGA
168
MCF5274LCVM166MCF5274LCVM166NXP SemiconductorsIC MCU 32BIT ROMLESS 196MAPBGAMicrocontrollers196-LBGA (15x15)N/A-40°C ~ 85°C (TA)
Core Processor:
Coldfire V2
Core Size:
32-Bit Single-Core
Speed:
166MHz
Connectivity:
EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals:
DMA, WDT
Number of I/O:
69
Program Memory Type:
ROMless
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
1.4V ~ 1.6V
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
196-LBGA (15×15)
Package / Case:
196-LBGA
1,844
MCF5274LVF166MCF5274LVF166NXP SemiconductorsIC MCU 32BIT ROMLESS 196MAPBGAMicrocontrollers196-LBGA (15x15)N/A0°C ~ 70°C
Core Processor:
Coldfire V2
Core Size:
32-Bit Single-Core
Speed:
166MHz
Connectivity:
EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals:
DMA, WDT
Number of I/O:
61
Program Memory Type:
ROMless
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
1.4V ~ 1.6V
Oscillator Type:
External
Operating Temperature:
0°C ~ 70°C
Mounting Type:
Surface Mount
Supplier Device Package:
196-LBGA (15×15)
Package / Case:
196-LBGA
271
MCF5274LVM166MCF5274LVM166NXP SemiconductorsIC MCU 32BIT ROMLESS 196MAPBGAMicrocontrollers196-LBGA (15x15)N/A0°C ~ 70°C (TA)
Core Processor:
Coldfire V2
Core Size:
32-Bit Single-Core
Speed:
166MHz
Connectivity:
EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals:
DMA, WDT
Number of I/O:
61
Program Memory Type:
ROMless
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
1.4V ~ 1.6V
Oscillator Type:
External
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
196-LBGA (15×15)
Package / Case:
196-LBGA
511
MCF5274VM166MCF5274VM166NXP SemiconductorsIC MCU 32BIT ROMLESS 256MAPBGAMicrocontrollers256-MAPBGA (17x17)N/A0°C ~ 70°C (TA)
Core Processor:
Coldfire V2
Core Size:
32-Bit Single-Core
Speed:
166MHz
Connectivity:
EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals:
DMA, WDT
Number of I/O:
69
Program Memory Type:
ROMless
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
1.4V ~ 1.6V
Oscillator Type:
External
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-MAPBGA (17×17)
Package / Case:
256-LBGA
221
MCF5275CVM166MCF5275CVM166NXP SemiconductorsIC MCU 32BIT ROMLESS 256MAPBGAMicrocontrollers256-MAPBGA (17x17)N/A-40°C ~ 85°C (TA)
Core Processor:
Coldfire V2
Core Size:
32-Bit Single-Core
Speed:
166MHz
Connectivity:
EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals:
DMA, WDT
Number of I/O:
69
Program Memory Type:
ROMless
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
1.4V ~ 1.6V
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-MAPBGA (17×17)
Package / Case:
256-LBGA
373
MCF5275CVM166JMCF5275CVM166JNXP SemiconductorsIC MCU 32BIT ROMLESS 256MAPBGAMicrocontrollers256-MAPBGA (17x17)N/A-40°C ~ 85°C (TA)
Core Processor:
Coldfire V2
Core Size:
32-Bit Single-Core
Speed:
166MHz
Connectivity:
EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals:
DMA, WDT
Number of I/O:
69
Program Memory Type:
ROMless
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
1.4V ~ 1.6V
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-MAPBGA (17×17)
Package / Case:
256-LBGA
607
MCF5275LCVM133MCF5275LCVM133NXP SemiconductorsIC MCU 32BIT ROMLESS 196MAPBGAMicrocontrollers196-LBGA (15x15)N/A-40°C ~ 85°C (TA)
Core Processor:
Coldfire V2
Core Size:
32-Bit Single-Core
Speed:
133MHz
Connectivity:
EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals:
DMA, WDT
Number of I/O:
61
Program Memory Type:
ROMless
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
1.4V ~ 1.6V
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
196-LBGA (15×15)
Package / Case:
196-LBGA
1,656

See What We Have to Offer!

See What We Have to Offer!

keyboard_arrow_up