Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,622
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
R7FA6T2BB3CFL#BA1R7FA6T2BB3CFL#BA1RenesasIC MCU 32BIT 256KB FLASH 48LFQFPMicrocontrollers48-LFQFP (7x7)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit
Speed:
240MHz
Connectivity:
CANbus, I2C, LINbus, SCI, SPI, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
35
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
16K x 8
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 10x12b SAR; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-LFQFP (7×7)
Package / Case:
48-LQFP
621
R7FA6T2BB3CFM#AA0R7FA6T2BB3CFM#AA0RenesasMCU RA6T2 ARM CM33 240MHZ 256K/6Microcontrollers64-LFQFP (10x10)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit
Speed:
240MHz
Connectivity:
CANbus, I2C, LINbus, SCI, SPI, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
51
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
16K x 8
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 18x12b SAR; D/A 4x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
1,602
R7FA6T2BB3CFM#AA1R7FA6T2BB3CFM#AA1RenesasMCU RA6T2 ARM CM33 240MHZ 256K/6Microcontrollers64-LFQFP (10x10)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit
Speed:
240MHz
Connectivity:
CANbus, I2C, LINbus, SCI, SPI, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
51
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
16K x 8
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 18x12b SAR; D/A 4x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
1,645
R7FA6T2BB3CFM#BA0R7FA6T2BB3CFM#BA0RenesasMCU RA6T2 ARM CM33 240MHZ 256K/6Microcontrollers64-LFQFP (10x10)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit
Speed:
240MHz
Connectivity:
CANbus, I2C, LINbus, SCI, SPI, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
51
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
16K x 8
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 18x12b SAR; D/A 4x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
464
R7FA6T2BB3CFM#BA1R7FA6T2BB3CFM#BA1RenesasIC MCU 32BIT 256KB FLASH 64LFQFPMicrocontrollers64-LFQFP (10x10)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit
Speed:
240MHz
Connectivity:
CANbus, I2C, LINbus, SCI, SPI, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
51
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
16K x 8
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 18x12b SAR; D/A 4x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
1,093
R7FA6T2BB3CFP#AA0R7FA6T2BB3CFP#AA0RenesasRA_FAMILY-2Microcontrollers100-LFQFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit
Speed:
240MHz
Connectivity:
CANbus, I2C, LINbus, SCI, SPI, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
84
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
16K x 8
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 38x12b SAR; D/A 4x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LFQFP (14×14)
Package / Case:
100-LQFP
181
R7FA6T2BB3CFP#AA1R7FA6T2BB3CFP#AA1RenesasMCU RA6T2 ARM CM33 240MHZ 256/64Microcontrollers100-LFQFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit
Speed:
240MHz
Connectivity:
CANbus, I2C, LINbus, SCI, SPI, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
84
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
16K x 8
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 38x12b SAR; D/A 4x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LFQFP (14×14)
Package / Case:
100-LQFP
1,287
R7FA6T2BB3CFP#BA0R7FA6T2BB3CFP#BA0RenesasMCU RA6T2 ARM CM33 240MHZ 256/64Microcontrollers100-LFQFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit
Speed:
240MHz
Connectivity:
CANbus, I2C, LINbus, SCI, SPI, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
84
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
16K x 8
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 38x12b SAR; D/A 4x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LFQFP (14×14)
Package / Case:
100-LQFP
41
R7FA6T2BB3CFP#BA1R7FA6T2BB3CFP#BA1RenesasIC MCU 32BIT 256KB FLSH 100LFQFPMicrocontrollers100-LFQFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit
Speed:
240MHz
Connectivity:
CANbus, I2C, LINbus, SCI, SPI, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
84
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
16K x 8
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 38x12b SAR; D/A 4x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LFQFP (14×14)
Package / Case:
100-LQFP
499
R7FA6T2BB3CNB#AA0R7FA6T2BB3CNB#AA0RenesasMCU RA6T2 ARM CM33 240MHZ 256K/6Microcontrollers64-HWQFN (8x8)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit
Speed:
240MHz
Connectivity:
CANbus, I2C, LINbus, SCI, SPI, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
51
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
16K x 8
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 18x12b SAR; D/A 4x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-HWQFN (8×8)
Package / Case:
64-WFQFN Exposed Pad
1,936
R7FA6T2BB3CNB#AA1R7FA6T2BB3CNB#AA1RenesasMCU RA6T2 ARM CM33 240MHZ 256K/6Microcontrollers64-HWQFN (8x8)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit
Speed:
240MHz
Connectivity:
CANbus, I2C, LINbus, SCI, SPI, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
51
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
16K x 8
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 18x12b SAR; D/A 4x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-HWQFN (8×8)
Package / Case:
64-WFQFN Exposed Pad
319
R7FA6T2BB3CNB#BA1R7FA6T2BB3CNB#BA1RenesasMCU RA6T2 ARM CM33 240MHZ 256K/6Microcontrollers64-HWQFN (8x8)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit
Speed:
240MHz
Connectivity:
CANbus, I2C, LINbus, SCI, SPI, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
51
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
16K x 8
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 18x12b SAR; D/A 4x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-HWQFN (8×8)
Package / Case:
64-WFQFN Exposed Pad
50
R7FA6T2BB3CNE#AA0R7FA6T2BB3CNE#AA0RenesasMCU RA6T2 ARM CM33 240MHZ 256K/6Microcontrollers48-HWQFN (7x7)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit
Speed:
240MHz
Connectivity:
CANbus, I2C, LINbus, SCI, SPI, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
35
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
16K x 8
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 10x12b SAR; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-HWQFN (7×7)
Package / Case:
48-WFQFN Exposed Pad
431
R7FA6T2BB3CNE#AA1R7FA6T2BB3CNE#AA1RenesasMCU RA6T2 ARM CM33 240MHZ 256K/6Microcontrollers48-HWQFN (7x7)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit
Speed:
240MHz
Connectivity:
CANbus, I2C, LINbus, SCI, SPI, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
35
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
16K x 8
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 10x12b SAR; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-HWQFN (7×7)
Package / Case:
48-WFQFN Exposed Pad
1,951
R7FA6T2BB3CNE#BA1R7FA6T2BB3CNE#BA1RenesasMCU RA6T2 ARM CM33 240MHZ 256K/6Microcontrollers48-HWQFN (7x7)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit
Speed:
240MHz
Connectivity:
CANbus, I2C, LINbus, SCI, SPI, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
35
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
16K x 8
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 10x12b SAR; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-HWQFN (7×7)
Package / Case:
48-WFQFN Exposed Pad
257
R7FA6T2BD3CFL#AA0R7FA6T2BD3CFL#AA0RenesasMCU RA6T2 ARM CM33 240MHZ 512K/6Microcontrollers48-LFQFP (7x7)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit
Speed:
240MHz
Connectivity:
CANbus, I2C, LINbus, SCI, SPI, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
35
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
16K x 8
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 10x12b SAR; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-LFQFP (7×7)
Package / Case:
48-LQFP
1,051
R7FA6T2BD3CFL#AA1R7FA6T2BD3CFL#AA1RenesasMCU RA6T2 ARM CM33 240MHZ 512K/6Microcontrollers48-LFQFP (7x7)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit
Speed:
240MHz
Connectivity:
CANbus, I2C, LINbus, SCI, SPI, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
35
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
16K x 8
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 10x12b SAR; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-LFQFP (7×7)
Package / Case:
48-LQFP
714
R7FA6T2BD3CFL#BA0R7FA6T2BD3CFL#BA0RenesasMCU RA6T2 ARM CM33 240MHZ 512K/6Microcontrollers48-LFQFP (7x7)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit
Speed:
240MHz
Connectivity:
CANbus, I2C, LINbus, SCI, SPI, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
35
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
16K x 8
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 10x12b SAR; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-LFQFP (7×7)
Package / Case:
48-LQFP
39
R7FA6T2BD3CFL#BA1R7FA6T2BD3CFL#BA1RenesasIC MCU 32BIT 512KB FLASH 48LFQFPMicrocontrollers48-LFQFP (7x7)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit
Speed:
240MHz
Connectivity:
CANbus, I2C, LINbus, SCI, SPI, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
35
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
16K x 8
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 10x12b SAR; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-LFQFP (7×7)
Package / Case:
48-LQFP
319
R7FA6T2BD3CFM#AA0R7FA6T2BD3CFM#AA0RenesasMCU:RAMicrocontrollers64-LFQFP (10x10)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit
Speed:
240MHz
Connectivity:
CANbus, I2C, LINbus, SCI, SPI, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
51
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
16K x 8
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 18x12b SAR; D/A 4x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
321

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