 | | R7FA6T2BB3CFL#BA1 | Renesas | IC MCU 32BIT 256KB FLASH 48LFQFP | Microcontrollers | 48-LFQFP (7x7) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M33 Connectivity: CANbus, I2C, LINbus, SCI, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 3.6V Data Converters: A/D 10x12b SAR; D/A 2x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 48-LFQFP (7×7) | 621 | |
 | | R7FA6T2BB3CFM#AA0 | Renesas | MCU RA6T2 ARM CM33 240MHZ 256K/6 | Microcontrollers | 64-LFQFP (10x10) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M33 Connectivity: CANbus, I2C, LINbus, SCI, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 3.6V Data Converters: A/D 18x12b SAR; D/A 4x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-LFQFP (10×10) | 1,602 | |
 | | R7FA6T2BB3CFM#AA1 | Renesas | MCU RA6T2 ARM CM33 240MHZ 256K/6 | Microcontrollers | 64-LFQFP (10x10) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M33 Connectivity: CANbus, I2C, LINbus, SCI, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 3.6V Data Converters: A/D 18x12b SAR; D/A 4x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-LFQFP (10×10) | 1,645 | |
 | | R7FA6T2BB3CFM#BA0 | Renesas | MCU RA6T2 ARM CM33 240MHZ 256K/6 | Microcontrollers | 64-LFQFP (10x10) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M33 Connectivity: CANbus, I2C, LINbus, SCI, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 3.6V Data Converters: A/D 18x12b SAR; D/A 4x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-LFQFP (10×10) | 464 | |
 | | R7FA6T2BB3CFM#BA1 | Renesas | IC MCU 32BIT 256KB FLASH 64LFQFP | Microcontrollers | 64-LFQFP (10x10) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M33 Connectivity: CANbus, I2C, LINbus, SCI, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 3.6V Data Converters: A/D 18x12b SAR; D/A 4x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-LFQFP (10×10) | 1,093 | |
 | | R7FA6T2BB3CFP#AA0 | Renesas | RA_FAMILY-2 | Microcontrollers | 100-LFQFP (14x14) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M33 Connectivity: CANbus, I2C, LINbus, SCI, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 3.6V Data Converters: A/D 38x12b SAR; D/A 4x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LFQFP (14×14) | 181 | |
 | | R7FA6T2BB3CFP#AA1 | Renesas | MCU RA6T2 ARM CM33 240MHZ 256/64 | Microcontrollers | 100-LFQFP (14x14) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M33 Connectivity: CANbus, I2C, LINbus, SCI, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 3.6V Data Converters: A/D 38x12b SAR; D/A 4x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LFQFP (14×14) | 1,287 | |
 | | R7FA6T2BB3CFP#BA0 | Renesas | MCU RA6T2 ARM CM33 240MHZ 256/64 | Microcontrollers | 100-LFQFP (14x14) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M33 Connectivity: CANbus, I2C, LINbus, SCI, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 3.6V Data Converters: A/D 38x12b SAR; D/A 4x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LFQFP (14×14) | 41 | |
 | | R7FA6T2BB3CFP#BA1 | Renesas | IC MCU 32BIT 256KB FLSH 100LFQFP | Microcontrollers | 100-LFQFP (14x14) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M33 Connectivity: CANbus, I2C, LINbus, SCI, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 3.6V Data Converters: A/D 38x12b SAR; D/A 4x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LFQFP (14×14) | 499 | |
 | | R7FA6T2BB3CNB#AA0 | Renesas | MCU RA6T2 ARM CM33 240MHZ 256K/6 | Microcontrollers | 64-HWQFN (8x8) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M33 Connectivity: CANbus, I2C, LINbus, SCI, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 3.6V Data Converters: A/D 18x12b SAR; D/A 4x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-HWQFN (8×8) Package / Case: 64-WFQFN Exposed Pad | 1,936 | |
 | | R7FA6T2BB3CNB#AA1 | Renesas | MCU RA6T2 ARM CM33 240MHZ 256K/6 | Microcontrollers | 64-HWQFN (8x8) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M33 Connectivity: CANbus, I2C, LINbus, SCI, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 3.6V Data Converters: A/D 18x12b SAR; D/A 4x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-HWQFN (8×8) Package / Case: 64-WFQFN Exposed Pad | 319 | |
 | | R7FA6T2BB3CNB#BA1 | Renesas | MCU RA6T2 ARM CM33 240MHZ 256K/6 | Microcontrollers | 64-HWQFN (8x8) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M33 Connectivity: CANbus, I2C, LINbus, SCI, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 3.6V Data Converters: A/D 18x12b SAR; D/A 4x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-HWQFN (8×8) Package / Case: 64-WFQFN Exposed Pad | 50 | |
 | | R7FA6T2BB3CNE#AA0 | Renesas | MCU RA6T2 ARM CM33 240MHZ 256K/6 | Microcontrollers | 48-HWQFN (7x7) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M33 Connectivity: CANbus, I2C, LINbus, SCI, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 3.6V Data Converters: A/D 10x12b SAR; D/A 2x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 48-HWQFN (7×7) Package / Case: 48-WFQFN Exposed Pad | 431 | |
 | | R7FA6T2BB3CNE#AA1 | Renesas | MCU RA6T2 ARM CM33 240MHZ 256K/6 | Microcontrollers | 48-HWQFN (7x7) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M33 Connectivity: CANbus, I2C, LINbus, SCI, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 3.6V Data Converters: A/D 10x12b SAR; D/A 2x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 48-HWQFN (7×7) Package / Case: 48-WFQFN Exposed Pad | 1,951 | |
 | | R7FA6T2BB3CNE#BA1 | Renesas | MCU RA6T2 ARM CM33 240MHZ 256K/6 | Microcontrollers | 48-HWQFN (7x7) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M33 Connectivity: CANbus, I2C, LINbus, SCI, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 3.6V Data Converters: A/D 10x12b SAR; D/A 2x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 48-HWQFN (7×7) Package / Case: 48-WFQFN Exposed Pad | 257 | |
 | | R7FA6T2BD3CFL#AA0 | Renesas | MCU RA6T2 ARM CM33 240MHZ 512K/6 | Microcontrollers | 48-LFQFP (7x7) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M33 Connectivity: CANbus, I2C, LINbus, SCI, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 3.6V Data Converters: A/D 10x12b SAR; D/A 2x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 48-LFQFP (7×7) | 1,051 | |
 | | R7FA6T2BD3CFL#AA1 | Renesas | MCU RA6T2 ARM CM33 240MHZ 512K/6 | Microcontrollers | 48-LFQFP (7x7) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M33 Connectivity: CANbus, I2C, LINbus, SCI, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 3.6V Data Converters: A/D 10x12b SAR; D/A 2x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 48-LFQFP (7×7) | 714 | |
 | | R7FA6T2BD3CFL#BA0 | Renesas | MCU RA6T2 ARM CM33 240MHZ 512K/6 | Microcontrollers | 48-LFQFP (7x7) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M33 Connectivity: CANbus, I2C, LINbus, SCI, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 3.6V Data Converters: A/D 10x12b SAR; D/A 2x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 48-LFQFP (7×7) | 39 | |
 | | R7FA6T2BD3CFL#BA1 | Renesas | IC MCU 32BIT 512KB FLASH 48LFQFP | Microcontrollers | 48-LFQFP (7x7) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M33 Connectivity: CANbus, I2C, LINbus, SCI, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 3.6V Data Converters: A/D 10x12b SAR; D/A 2x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 48-LFQFP (7×7) | 319 | |
 | | R7FA6T2BD3CFM#AA0 | Renesas | MCU:RA | Microcontrollers | 64-LFQFP (10x10) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M33 Connectivity: CANbus, I2C, LINbus, SCI, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 3.6V Data Converters: A/D 18x12b SAR; D/A 4x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-LFQFP (10×10) | 321 | |