 | | R7FA6T2BD3CFM#AA1 | Renesas | MCU RA6T2 ARM CM33 240MHZ 512K/6 | Microcontrollers | 64-LFQFP (10x10) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M33 Connectivity: CANbus, I2C, LINbus, SCI, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 3.6V Data Converters: A/D 18x12b SAR; D/A 4x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-LFQFP (10×10) | 277 | |
 | | R7FA6T2BD3CFM#BA0 | Renesas | MCU RA6T2 ARM CM33 240MHZ 512K/6 | Microcontrollers | 64-LFQFP (10x10) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M33 Connectivity: CANbus, I2C, LINbus, SCI, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 3.6V Data Converters: A/D 18x12b SAR; D/A 4x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-LFQFP (10×10) | 193 | |
 | | R7FA6T2BD3CFM#BA1 | Renesas | IC MCU 32BIT 512KB FLASH 64LFQFP | Microcontrollers | 64-LFQFP (10x10) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M33 Connectivity: CANbus, I2C, LINbus, SCI, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 3.6V Data Converters: A/D 18x12b SAR; D/A 4x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-LFQFP (10×10) | 1,129 | |
 | | R7FA6T2BD3CFP#AA0 | Renesas | IC MCU 32BIT 512KB FLSH 100LFQFP | Microcontrollers | 100-LFQFP (14x14) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M33 Core Size: 32-Bit Single-Core Connectivity: CANbus, I2C, LINbus, SCI, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 3.6V Data Converters: A/D 38x12b SAR; D/A 4x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LFQFP (14×14) | 1,784 | |
 | | R7FA6T2BD3CFP#AA1 | Renesas | MCU RA6T2 ARM CM33 240MHZ 512/64 | Microcontrollers | 100-LFQFP (14x14) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M33 Connectivity: CANbus, I2C, LINbus, SCI, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 3.6V Data Converters: A/D 38x12b SAR; D/A 4x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LFQFP (14×14) | 1,244 | |
 | | R7FA6T2BD3CFP#BA0 | Renesas | IC MCU 32BIT 512KB FLSH 100LFQFP | Microcontrollers | 100-LFQFP (14x14) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M33 Core Size: 32-Bit Single-Core Connectivity: CANbus, I2C, LINbus, SCI, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 3.6V Data Converters: A/D 38x12b SAR; D/A 4x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LFQFP (14×14) | 571 | |
 | | R7FA6T2BD3CFP#BA1 | Renesas | IC MCU 32BIT 512KB FLSH 100LFQFP | Microcontrollers | 100-LFQFP (14x14) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M33 Connectivity: CANbus, I2C, LINbus, SCI, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 3.6V Data Converters: A/D 38x12b SAR; D/A 4x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LFQFP (14×14) | 1,320 | |
 | | R7FA6T2BD3CNB#AA0 | Renesas | MCU RA6T2 ARM CM33 240MHZ 512K/6 | Microcontrollers | 64-HWQFN (8x8) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M33 Connectivity: CANbus, I2C, LINbus, SCI, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 3.6V Data Converters: A/D 18x12b SAR; D/A 4x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-HWQFN (8×8) Package / Case: 64-WFQFN Exposed Pad | 186 | |
 | | R7FA6T2BD3CNB#AA1 | Renesas | MCU RA6T2 ARM CM33 240MHZ 512K/6 | Microcontrollers | 64-HWQFN (8x8) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M33 Connectivity: CANbus, I2C, LINbus, SCI, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 3.6V Data Converters: A/D 18x12b SAR; D/A 4x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-HWQFN (8×8) Package / Case: 64-WFQFN Exposed Pad | 372 | |
 | | R7FA6T2BD3CNB#BA1 | Renesas | MCU RA6T2 ARM CM33 240MHZ 512K/6 | Microcontrollers | 64-HWQFN (8x8) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M33 Connectivity: CANbus, I2C, LINbus, SCI, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 3.6V Data Converters: A/D 18x12b SAR; D/A 4x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-HWQFN (8×8) Package / Case: 64-WFQFN Exposed Pad | 1 | |
 | | R7FA6T2BD3CNE#AA0 | Renesas | MCU RA6T2 ARM CM33 240MHZ 512K/6 | Microcontrollers | 48-HWQFN (7x7) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M33 Connectivity: CANbus, I2C, LINbus, SCI, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 3.6V Data Converters: A/D 10x12b SAR; D/A 2x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 48-HWQFN (7×7) Package / Case: 48-WFQFN Exposed Pad | 287 | |
 | | R7FA6T2BD3CNE#AA1 | Renesas | MCU RA6T2 ARM CM33 240MHZ 512K/6 | Microcontrollers | 48-HWQFN (7x7) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M33 Connectivity: CANbus, I2C, LINbus, SCI, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 3.6V Data Converters: A/D 10x12b SAR; D/A 2x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 48-HWQFN (7×7) Package / Case: 48-WFQFN Exposed Pad | 938 | |
 | | R7FA6T2BD3CNE#BA1 | Renesas | MCU RA6T2 ARM CM33 240MHZ 512K/6 | Microcontrollers | 48-HWQFN (7x7) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M33 Connectivity: CANbus, I2C, LINbus, SCI, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 3.6V Data Converters: A/D 10x12b SAR; D/A 2x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 48-HWQFN (7×7) Package / Case: 48-WFQFN Exposed Pad | 1,218 | |
 | | R7FA6T3BB3CFJ#AA0 | Renesas | MCU RA6T3 ARM CM33 200MHZ 256K/4 | Microcontrollers | 32-LQFP (7x7) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M33 Connectivity: CANbus, EBI/EMI, I2C, I3C, IrDA, MMC/SD, SCI, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 3.6V Data Converters: A/D 5x12b SAR; D/A 1x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 32-LQFP (7×7) | 475 | |
 | | R7FA6T3BB3CFJ#BA0 | Renesas | MCU:RA | Microcontrollers | 32-LQFP (7x7) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M33 Connectivity: CANbus, EBI/EMI, I2C, I3C, IrDA, MMC/SD, SCI, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 3.6V Data Converters: A/D 5x12b SAR; D/A 1x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 32-LQFP (7×7) | 719 | |
 | | R7FA6T3BB3CFL#AA0 | Renesas | MCU RA6 ARM CM33 200MHZ 256KB/40 | Microcontrollers | 48-LFQFP (7x7) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M33 Connectivity: CANbus, EBI/EMI, I2C, I3C, IrDA, MMC/SD, SCI, SPI, UART/USART, USB Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 3.6V Data Converters: A/D 8x12b SAR; D/A 2x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 48-LFQFP (7×7) | 780 | |
 | | R7FA6T3BB3CFL#BA0 | Renesas | MCU:RA | Microcontrollers | 48-LFQFP (7x7) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M33 Connectivity: CANbus, EBI/EMI, I2C, I3C, IrDA, MMC/SD, SCI, SPI, UART/USART, USB Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 3.6V Data Converters: A/D 8x12b SAR; D/A 2x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 48-LFQFP (7×7) | 1,568 | |
 | | R7FA6T3BB3CFM#AA0 | Renesas | MCU RA6 ARM CM33 200MHZ 256KB/40 | Microcontrollers | N/A | N/A | N/A | N/A | 1,765 | |
 | | R7FA6T3BB3CFM#BA0 | Renesas | MCU RA6 ARM CM33 200MHZ 256KB/40 | Microcontrollers | 64-LFQFP (10x10) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M33 Connectivity: CANbus, EBI/EMI, I2C, I3C, IrDA, MMC/SD, SCI, SPI, UART/USART, USB Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 3.6V Data Converters: A/D 12x12b SAR; D/A 2x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-LFQFP (10×10) | 970 | |
| N/A | | R7FA6T3BB3CNE#BA0 | Renesas | MCU:RA | Microcontrollers | 48-HWQFN (7x7) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M33 Connectivity: CANbus, EBI/EMI, I2C, I3C, IrDA, MMC/SD, SCI, SPI, UART/USART, USB Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 3.6V Data Converters: A/D 8x12b SAR; D/A 2x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 48-HWQFN (7×7) Package / Case: 48-WFQFN Exposed Pad | 277 | |