Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,622
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
R7FS1JA783A01CFJ#BA0R7FS1JA783A01CFJ#BA0RenesasIC MCU 32BIT 256KB FLASH 32LQFPMicrocontrollers32-LQFP (7x7)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M23
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
CANbus, I2C, SCI, SPI
Peripherals:
DMA, PWM, WDT
Number of I/O:
20
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.6V ~ 5.5V
Data Converters:
A/D 5x16b, 2x24b Sigma-Delta; D/A 2x8b, 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-LQFP (7×7)
Package / Case:
32-LQFP
485
R7FS1JA783A01CFM#AA0R7FS1JA783A01CFM#AA0RenesasIC MCU 64LQFPMicrocontrollers64-LFQFP (10x10)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M23
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
CANbus, I2C, SCI, SPI, USB
Peripherals:
DMA, PWM, WDT
Number of I/O:
49
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.6V ~ 5.5V
Data Converters:
A/D 17x16b, 8x24b Sigma-Delta; D/A 1x8b, 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
1,191
R7FS1JA783A01CFM#BA0R7FS1JA783A01CFM#BA0RenesasIC MCU 32BIT 256KB FLASH 64LFQFPMicrocontrollers64-LFQFP (10x10)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M23
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
CANbus, I2C, SCI, SPI, USB
Peripherals:
DMA, PWM, WDT
Number of I/O:
49
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.6V ~ 5.5V
Data Converters:
A/D 17x16b, 8x24b Sigma-Delta; D/A 1x8b, 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
340
R7FS1JA783A01CNE#AA0R7FS1JA783A01CNE#AA0RenesasIC MCU 32BIT 256KB FLASH 48HWQFNMicrocontrollers48-HWQFN (7x7)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M23
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
CANbus, I2C, SCI, SPI, USB
Peripherals:
DMA, PWM, WDT
Number of I/O:
33
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.6V ~ 5.5V
Data Converters:
A/D 12x16b, 6x24b Sigma-Delta; D/A 2x8b, 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-HWQFN (7×7)
Package / Case:
48-WFQFN Exposed Pad
500
R7FS1JA783A01CNE#AC0R7FS1JA783A01CNE#AC0RenesasIC MCU 32BIT 256KB FLASH 48HWQFNMicrocontrollers48-HWQFN (7x7)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M23
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
CANbus, I2C, SCI, SPI, USB
Peripherals:
DMA, PWM, WDT
Number of I/O:
33
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.6V ~ 5.5V
Data Converters:
A/D 12x16b, 6x24b Sigma-Delta; D/A 2x8b, 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-HWQFN (7×7)
Package / Case:
48-WFQFN Exposed Pad
497
R7FS1JA783A01CNE#BA0R7FS1JA783A01CNE#BA0RenesasSYNERGY MCU PLATFORM S1JA 128K 4Microcontrollers48-HWQFN (7x7)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M23
Core Size:
32-Bit
Speed:
48MHz
Connectivity:
CANbus, I2C, SCI, SPI, USB
Peripherals:
DMA, PWM, WDT
Number of I/O:
33
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.6V ~ 5.5V
Data Converters:
A/D 12x16b, 6x24b Sigma-Delta; D/A 2x8b, 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-HWQFN (7×7)
Package / Case:
48-WFQFN Exposed Pad
720
R7FS1JA783A01CNF#AA0R7FS1JA783A01CNF#AA0RenesasSYNERGY MCU PLATFORM S1JA 256K 4Microcontrollers40-HWQFN (6x6)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M23
Core Size:
32-Bit
Speed:
48MHz
Connectivity:
CANbus, I2C, SCI, SPI, USB
Peripherals:
DMA, PWM, WDT
Number of I/O:
25
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.6V ~ 5.5V
Data Converters:
A/D 8x16b, 4x24b Sigma-Delta; D/A 2x8b, 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
40-HWQFN (6×6)
Package / Case:
40-WFQFN Exposed Pad
136
R7FS1JA783A01CNF#AC0R7FS1JA783A01CNF#AC0RenesasIC MCU 32BIT 256KB FLASH 40HWQFNMicrocontrollers40-HWQFN (6x6)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M23
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
CANbus, I2C, SCI, SPI, USB
Peripherals:
DMA, PWM, WDT
Number of I/O:
25
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.6V ~ 5.5V
Data Converters:
A/D 8x16b, 4x24b Sigma-Delta; D/A 2x8b, 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
40-HWQFN (6×6)
Package / Case:
40-WFQFN Exposed Pad
180
R7FS1JA783A01CNF#BA0R7FS1JA783A01CNF#BA0RenesasSYNERGY MCU PLATFORM S1JA 256K 4Microcontrollers40-HWQFN (6x6)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M23
Core Size:
32-Bit
Speed:
48MHz
Connectivity:
CANbus, I2C, SCI, SPI, USB
Peripherals:
DMA, PWM, WDT
Number of I/O:
25
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.6V ~ 5.5V
Data Converters:
A/D 8x16b, 4x24b Sigma-Delta; D/A 2x8b, 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
40-HWQFN (6×6)
Package / Case:
40-WFQFN Exposed Pad
821
R7FS3A17C2A01CBJ#AC0R7FS3A17C2A01CBJ#AC0RenesasIC MCU 32BIT 1MB FLASH 121LFBGAMicrocontrollers121-LFBGA (8x8)N/A-40°C ~ 85°C
Core Processor:
ARM® Cortex®-M4
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
CANbus, EBI/EMI, I2C, MMC/SD, QSPI, SCI, SSIE, SPI, UART/USART, USB
Peripherals:
DMA, LCD, LVD, POR, PWM, WDT
Number of I/O:
104
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
192K x 8
Voltage – Supply (Vcc/Vdd):
1.6V ~ 5.5V
Data Converters:
A/D 26x14b; D/A 2x8b, 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C
Mounting Type:
Surface Mount
Supplier Device Package:
121-LFBGA (8×8)
Package / Case:
121-LFBGA
748
R7FS3A17C2A01CLJ#AC0R7FS3A17C2A01CLJ#AC0RenesasIC MCU 32BIT 1MB FLASH 100TFLGAMicrocontrollers100-TFLGA (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M4
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
CANbus, EBI/EMI, I2C, MMC/SD, QSPI, SCI, SSIE, SPI, UART/USART, USB
Peripherals:
DMA, LCD, LVD, POR, PWM, WDT
Number of I/O:
84
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
192K x 8
Voltage – Supply (Vcc/Vdd):
1.6V ~ 5.5V
Data Converters:
A/D 25x14b; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-TFLGA (7×7)
Package / Case:
100-TFLGA
148
N/AR7FS3A17C2A01CLJ#BC0RenesasSYNERGY MCU PLATFORM S3A1 1MB 10Microcontrollers100-TFLGA (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M4F
Core Size:
32-Bit
Speed:
48MHz
Connectivity:
CANbus, EBI/EMI, I2C, MMC/SD, QSPI, SCI, SSIE, SPI, UART/USART, USB
Peripherals:
DMA, LCD, LVD, POR, PWM, WDT
Number of I/O:
84
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
192K x 8
Voltage – Supply (Vcc/Vdd):
1.6V ~ 5.5V
Data Converters:
A/D 25x14b SAR; D/A 2x12b, 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-TFLGA (7×7)
Package / Case:
100-TFLGA
1,116
R7FS3A17C2A01CLK#AC0R7FS3A17C2A01CLK#AC0RenesasIC MCU 32BIT 1MB FLASH 145TFLGAMicrocontrollers145-TFLGA (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M4
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
CANbus, EBI/EMI, I2C, MMC/SD, QSPI, SCI, SSIE, SPI, UART/USART, USB
Peripherals:
DMA, LCD, LVD, POR, PWM, WDT
Number of I/O:
126
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
192K x 8
Voltage – Supply (Vcc/Vdd):
1.6V ~ 5.5V
Data Converters:
A/D 28x14b; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
145-TFLGA (7×7)
Package / Case:
145-TFLGA
871
R7FS3A17C2A01CLK#BC0R7FS3A17C2A01CLK#BC0RenesasSYNERGY MCU PLATFORM S3A1 1MB 14Microcontrollers145-TFLGA (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M4F
Core Size:
32-Bit
Speed:
48MHz
Connectivity:
CANbus, EBI/EMI, I2C, MMC/SD, QSPI, SCI, SSIE, SPI, UART/USART, USB
Peripherals:
DMA, LCD, LVD, POR, PWM, WDT
Number of I/O:
126
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
192K x 8
Voltage – Supply (Vcc/Vdd):
1.6V ~ 5.5V
Data Converters:
A/D 28x14b SAR; D/A 2x12b, 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
145-TFLGA (7×7)
Package / Case:
145-TFLGA
1,129
R7FS3A17C3A01CFB#AA0R7FS3A17C3A01CFB#AA0RenesasIC MCU 32BIT 1MB FLASH 144LFQFPMicrocontrollers144-LFQFP (20x20)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M4
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
CANbus, EBI/EMI, I2C, MMC/SD, QSPI, SCI, SSIE, SPI, UART/USART, USB
Peripherals:
DMA, LCD, LVD, POR, PWM, WDT
Number of I/O:
126
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
192K x 8
Voltage – Supply (Vcc/Vdd):
1.6V ~ 5.5V
Data Converters:
A/D 28x14b; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LFQFP (20×20)
Package / Case:
144-LQFP
1,904
R7FS3A17C3A01CFB#BA0R7FS3A17C3A01CFB#BA0RenesasIC MCU 32BIT 1MB FLASH 144LFQFPMicrocontrollers144-LFQFP (20x20)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M4
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
CANbus, EBI/EMI, I2C, MMC/SD, QSPI, SCI, SSIE, SPI, UART/USART, USB
Peripherals:
DMA, LCD, LVD, POR, PWM, WDT
Number of I/O:
126
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
192K x 8
Voltage – Supply (Vcc/Vdd):
1.6V ~ 5.5V
Data Converters:
A/D 28x14b SAR; D/A 1x8b, 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LFQFP (20×20)
Package / Case:
144-LQFP
584
R7FS3A17C3A01CFM#AA0R7FS3A17C3A01CFM#AA0RenesasIC MCU 32BIT 1MB FLASH 64LFQFPMicrocontrollers64-LFQFP (10x10)N/A-40°C ~ 105°C
Core Processor:
ARM® Cortex®-M4
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
CANbus, EBI/EMI, I2C, MMC/SD, QSPI, SCI, SSIE, SPI, UART/USART, USB
Peripherals:
DMA, LCD, LVD, POR, PWM, WDT
Number of I/O:
52
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
192K x 8
Voltage – Supply (Vcc/Vdd):
1.6V ~ 5.5V
Data Converters:
A/D 18x14b; D/A 2x8b, 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
51
R7FS3A17C3A01CFM#BA0R7FS3A17C3A01CFM#BA0RenesasIC MCU 32BIT 1MB FLASH 64LFQFPMicrocontrollers64-LFQFP (10x10)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M4
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
CANbus, EBI/EMI, I2C, MMC/SD, QSPI, SCI, SSIE, SPI, UART/USART, USB
Peripherals:
DMA, LCD, LVD, POR, PWM, WDT
Number of I/O:
52
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
192K x 8
Voltage – Supply (Vcc/Vdd):
1.6V ~ 5.5V
Data Converters:
A/D 18x14b SAR; D/A 2x8b, 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
100
R7FS3A17C3A01CFP#AA0R7FS3A17C3A01CFP#AA0RenesasIC MCU 32BIT 1MB FLASH 100LFQFPMicrocontrollers100-LFQFP (14x14)N/A-40°C ~ 105°C
Core Processor:
ARM® Cortex®-M4
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
CANbus, EBI/EMI, I2C, MMC/SD, QSPI, SCI, SSIE, SPI, UART/USART, USB
Peripherals:
DMA, LCD, LVD, POR, PWM, WDT
Number of I/O:
84
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
192K x 8
Voltage – Supply (Vcc/Vdd):
1.6V ~ 5.5V
Data Converters:
A/D 25x14b; D/A 2x8b, 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C
Mounting Type:
Surface Mount
Supplier Device Package:
100-LFQFP (14×14)
Package / Case:
100-LQFP
624
R7FS3A17C3A01CFP#BA0R7FS3A17C3A01CFP#BA0RenesasIC MCU 32BIT 1MB FLASH 100LFQFPMicrocontrollers100-LFQFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M4
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
CANbus, EBI/EMI, I2C, MMC/SD, QSPI, SCI, SSIE, SPI, UART/USART, USB
Peripherals:
DMA, LCD, LVD, POR, PWM, WDT
Number of I/O:
84
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
192K x 8
Voltage – Supply (Vcc/Vdd):
1.6V ~ 5.5V
Data Converters:
A/D 25x14b SAR; D/A 1x8b, 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LFQFP (14×14)
Package / Case:
100-LQFP
885

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