Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,622
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
R7FS3A17C3A01CNB#AA0R7FS3A17C3A01CNB#AA0RenesasIC MCU 32BIT 1MB FLASH 64HWQFNMicrocontrollers64-HWQFN (8x8)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M4
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
CANbus, EBI/EMI, I2C, MMC/SD, QSPI, SCI, SSIE, SPI, UART/USART, USB
Peripherals:
DMA, LCD, LVD, POR, PWM, WDT
Number of I/O:
52
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
192K x 8
Voltage – Supply (Vcc/Vdd):
1.6V ~ 5.5V
Data Converters:
A/D 18x14b SAR; D/A 1x8b, 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-HWQFN (8×8)
Package / Case:
64-WFQFN Exposed Pad
1,442
R7FS3A17C3A01CNB#AC0R7FS3A17C3A01CNB#AC0RenesasIC MCU 32BIT 1MB FLASH 64HWQFNMicrocontrollers64-HWQFN (8x8)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M4
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
CANbus, EBI/EMI, I2C, MMC/SD, QSPI, SCI, SSIE, SPI, UART/USART, USB
Peripherals:
DMA, LCD, LVD, POR, PWM, WDT
Number of I/O:
52
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
192K x 8
Voltage – Supply (Vcc/Vdd):
1.6V ~ 5.5V
Data Converters:
A/D 18x14b; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-HWQFN (8×8)
Package / Case:
64-WFQFN Exposed Pad
760
R7FS3A17C3A01CNB#BA0R7FS3A17C3A01CNB#BA0RenesasSYNERGY MCU PLATFORM S3A1 1MB QFMicrocontrollers64-HWQFN (8x8)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M4F
Core Size:
32-Bit
Speed:
48MHz
Connectivity:
CANbus, EBI/EMI, I2C, MMC/SD, QSPI, SCI, SSIE, SPI, UART/USART, USB
Peripherals:
DMA, LCD, LVD, POR, PWM, WDT
Number of I/O:
52
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
192K x 8
Voltage – Supply (Vcc/Vdd):
1.6V ~ 5.5V
Data Converters:
A/D 18x14b SAR; D/A 2x8b, 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-HWQFN (8×8)
Package / Case:
64-WFQFN Exposed Pad
240
R7FS3A37A2A01CBJ#AC0R7FS3A37A2A01CBJ#AC0RenesasIC MCU 32BIT 512KB FLSH 121LFBGAMicrocontrollers121-LFBGA (8x8)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M4
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
CANbus, EBI/EMI, I2C, MMC/SD, QSPI, SCI, SPI, SSI, UART/USART, USB
Peripherals:
DMA, LCD, LVD, POR, PWM, WDT
Number of I/O:
104
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
96K x 8
Voltage – Supply (Vcc/Vdd):
1.6V ~ 5.5V
Data Converters:
A/D 26x14b; D/A 3x8b, 3x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
121-LFBGA (8×8)
Package / Case:
121-LFBGA
744
R7FS3A37A2A01CLJ#AC0R7FS3A37A2A01CLJ#AC0RenesasIC MCU 32BIT 512KB FLSH 100TFLGAMicrocontrollers100-TFLGA (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M4
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
CANbus, EBI/EMI, I2C, MMC/SD, QSPI, SCI, SPI, SSI, UART/USART, USB
Peripherals:
DMA, LCD, LVD, POR, PWM, WDT
Number of I/O:
84
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
96K x 8
Voltage – Supply (Vcc/Vdd):
1.6V ~ 5.5V
Data Converters:
A/D 25x14b; D/A 3x8b, 3x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-TFLGA (7×7)
Package / Case:
100-TFLGA
430
R7FS3A37A2A01CLK#AC0R7FS3A37A2A01CLK#AC0RenesasIC MCU 32BIT 512KB FLSH 145TFLGAMicrocontrollers145-TFLGA (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M4
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
CANbus, EBI/EMI, I2C, MMC/SD, QSPI, SCI, SPI, SSI, UART/USART, USB
Peripherals:
DMA, LCD, LVD, POR, PWM, WDT
Number of I/O:
126
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
96K x 8
Voltage – Supply (Vcc/Vdd):
1.6V ~ 5.5V
Data Converters:
A/D 28x14b; D/A 3x8b, 3x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
145-TFLGA (7×7)
Package / Case:
145-TFLGA
352
R7FS3A37A2A01CLK#BC0R7FS3A37A2A01CLK#BC0RenesasSYNERGY MCU PLATFORM S3A3 512K 1Microcontrollers145-TFLGA (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M4F
Core Size:
32-Bit
Speed:
48MHz
Connectivity:
CANbus, EBI/EMI, I2C, MMC/SD, QSPI, SCI, SPI, SSI, UART/USART, USB
Peripherals:
DMA, LCD, LVD, POR, PWM, WDT
Number of I/O:
126
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
96K x 8
Voltage – Supply (Vcc/Vdd):
1.6V ~ 5.5V
Data Converters:
A/D 28x14b SAR; D/A 2x8b, 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
145-TFLGA (7×7)
Package / Case:
145-TFLGA
309
R7FS3A37A3A01CFB#AA0R7FS3A37A3A01CFB#AA0RenesasIC MCU 32BIT 512KB FLASH 144LQFPMicrocontrollers144-LFQFP (20x20)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M4
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
CANbus, EBI/EMI, I2C, MMC/SD, QSPI, SCI, SPI, SSI, UART/USART, USB
Peripherals:
DMA, LCD, LVD, POR, PWM, WDT
Number of I/O:
124
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
96K x 8
Voltage – Supply (Vcc/Vdd):
1.6V ~ 5.5V
Data Converters:
A/D 28x14b; D/A 2x8b, 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LFQFP (20×20)
Package / Case:
144-LQFP
221
R7FS3A37A3A01CFB#BA0R7FS3A37A3A01CFB#BA0RenesasIC MCU 32BIT 512KB FLSH 144LFQFPMicrocontrollers144-LFQFP (20x20)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M4
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
CANbus, EBI/EMI, I2C, MMC/SD, QSPI, SCI, SPI, SSI, UART/USART, USB
Peripherals:
DMA, LCD, LVD, POR, PWM, WDT
Number of I/O:
126
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
96K x 8
Voltage – Supply (Vcc/Vdd):
1.6V ~ 5.5V
Data Converters:
A/D 28x14b SAR; D/A 1x8b, 3x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LFQFP (20×20)
Package / Case:
144-LQFP
606
R7FS3A37A3A01CFM#AA0R7FS3A37A3A01CFM#AA0RenesasIC MCU 32BIT 512KB FLASH 64LFQFPMicrocontrollers64-LFQFP (10x10)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M4
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
CANbus, EBI/EMI, I2C, MMC/SD, QSPI, SCI, SPI, SSI, UART/USART, USB
Peripherals:
DMA, LCD, LVD, POR, PWM, WDT
Number of I/O:
52
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
96K x 8
Voltage – Supply (Vcc/Vdd):
1.6V ~ 5.5V
Data Converters:
A/D 18x14b; D/A 3x8b, 3x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
216
R7FS3A37A3A01CFM#BA0R7FS3A37A3A01CFM#BA0RenesasIC MCU 32BIT 512KB FLASH 64LFQFPMicrocontrollers64-LFQFP (10x10)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M4
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
CANbus, EBI/EMI, I2C, MMC/SD, QSPI, SCI, SPI, SSI, UART/USART, USB
Peripherals:
DMA, LCD, LVD, POR, PWM, WDT
Number of I/O:
52
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
96K x 8
Voltage – Supply (Vcc/Vdd):
1.6V ~ 5.5V
Data Converters:
A/D 18x14b SAR; D/A 2x8b, 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
65
R7FS3A37A3A01CFP#AA0R7FS3A37A3A01CFP#AA0RenesasIC MCU 32BIT 512KB FLSH 100LFQFPMicrocontrollers100-LFQFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M4
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
CANbus, EBI/EMI, I2C, MMC/SD, QSPI, SCI, SPI, SSI, UART/USART, USB
Peripherals:
DMA, LCD, LVD, POR, PWM, WDT
Number of I/O:
84
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
96K x 8
Voltage – Supply (Vcc/Vdd):
1.6V ~ 5.5V
Data Converters:
A/D 25x14b; D/A 3x8b, 3x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LFQFP (14×14)
Package / Case:
100-LQFP
1,510
R7FS3A37A3A01CFP#BA0R7FS3A37A3A01CFP#BA0RenesasIC MCU 32BIT 512KB FLSH 100LFQFPMicrocontrollers100-LFQFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M4
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
CANbus, EBI/EMI, I2C, MMC/SD, QSPI, SCI, SPI, SSI, UART/USART, USB
Peripherals:
DMA, LCD, LVD, POR, PWM, WDT
Number of I/O:
84
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
96K x 8
Voltage – Supply (Vcc/Vdd):
1.6V ~ 5.5V
Data Converters:
A/D 25x14b SAR; D/A 2x8b, 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LFQFP (14×14)
Package / Case:
100-LQFP
1,489
R7FS3A37A3A01CNB#AA0R7FS3A37A3A01CNB#AA0RenesasIC MCU 32BIT 512KB FLASH 64HWQFNMicrocontrollers64-HWQFN (8x8)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M4
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
CANbus, EBI/EMI, I2C, MMC/SD, QSPI, SCI, SPI, SSI, UART/USART, USB
Peripherals:
DMA, LCD, LVD, POR, PWM, WDT
Number of I/O:
52
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
96K x 8
Voltage – Supply (Vcc/Vdd):
1.6V ~ 5.5V
Data Converters:
A/D 18x14b SAR; D/A 1x8b, 3x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-HWQFN (8×8)
Package / Case:
64-WFQFN Exposed Pad
208
R7FS3A37A3A01CNB#AC0R7FS3A37A3A01CNB#AC0RenesasIC MCU 32BIT 512KB FLASH 64QFNMicrocontrollers64-HWQFN (8x8)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M4
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
CANbus, EBI/EMI, I2C, MMC/SD, QSPI, SCI, SPI, SSI, UART/USART, USB
Peripherals:
DMA, LCD, LVD, POR, PWM, WDT
Number of I/O:
50
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
96K x 8
Voltage – Supply (Vcc/Vdd):
1.6V ~ 5.5V
Data Converters:
A/D 18x14b; D/A 2x8b, 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-HWQFN (8×8)
Package / Case:
64-WFQFN Exposed Pad
350
R7FS3A37A3A01CNB#BA0R7FS3A37A3A01CNB#BA0RenesasSYNERGY MCU PLATFORM S3A3 512K QMicrocontrollers64-HWQFN (8x8)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M4F
Core Size:
32-Bit
Speed:
48MHz
Connectivity:
CANbus, EBI/EMI, I2C, MMC/SD, QSPI, SCI, SPI, SSI, UART/USART, USB
Peripherals:
DMA, LCD, LVD, POR, PWM, WDT
Number of I/O:
52
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
96K x 8
Voltage – Supply (Vcc/Vdd):
1.6V ~ 5.5V
Data Converters:
A/D 18x14b SAR; D/A 2x8b, 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-HWQFN (8×8)
Package / Case:
64-WFQFN Exposed Pad
173
R7FS3A6782A01CLJ#AC0R7FS3A6782A01CLJ#AC0RenesasIC MCU 32BIT 256KB FLSH 100TFLGAMicrocontrollers100-TFLGA (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M4
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
CANbus, EBI/EMI, I2C, MMC/SD, QSPI, SCI, SPI, SSI, UART/USART, USB
Peripherals:
DMA, LCD, LVD, POR, PWM, WDT
Number of I/O:
84
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.6V ~ 5.5V
Data Converters:
A/D 25x14b; D/A 3x8b, 3x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-TFLGA (7×7)
Package / Case:
100-TFLGA
165
R7FS3A6783A01CFL#AA0R7FS3A6783A01CFL#AA0RenesasIC MCU 32BIT 256KB FLASH 48LFQFPMicrocontrollers48-LFQFP (7x7)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M4
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
CANbus, EBI/EMI, I2C, MMC/SD, QSPI, SCI, SPI, SSI, UART/USART, USB
Peripherals:
DMA, LCD, LVD, POR, PWM, WDT
Number of I/O:
36
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.6V ~ 5.5V
Data Converters:
A/D 14x14b; D/A 3x8b, 3x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-LFQFP (7×7)
Package / Case:
48-LQFP
1,916
R7FS3A6783A01CFL#BA0N/AR7FS3A6783A01CFL#BA0RenesasIC MCU 32BIT 256KB FLASH 48LFQFPMicrocontrollers48-LFQFP (7x7)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M4
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
CANbus, EBI/EMI, I2C, MMC/SD, QSPI, SCI, SPI, SSI, UART/USART, USB
Peripherals:
DMA, LCD, LVD, POR, PWM, WDT
Number of I/O:
36
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.6V ~ 5.5V
Data Converters:
A/D 14x14b SAR; D/A 2x8b, 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-LFQFP (7×7)
Package / Case:
48-LQFP
106
R7FS3A6783A01CFM#AA0R7FS3A6783A01CFM#AA0RenesasIC MCU 32BIT 256KB FLASH 64LFQFPMicrocontrollers64-LFQFP (10x10)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M4
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
CANbus, EBI/EMI, I2C, MMC/SD, QSPI, SCI, SPI, SSI, UART/USART, USB
Peripherals:
DMA, LCD, LVD, POR, PWM, WDT
Number of I/O:
52
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.6V ~ 5.5V
Data Converters:
A/D 18x14b; D/A 3x8b, 3x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
780

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