Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,622
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
R7FS3A77C3A01CFP#BA1R7FS3A77C3A01CFP#BA1RenesasIC MCU 32BIT 1MB FLASH 100LFQFPMicrocontrollers100-LFQFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M4
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
CANbus, EBI/EMI, I2C, IrDA, MMC/SD, QSPI, SCI, SPI, UART/USART, USB
Peripherals:
DMA, LCD, LVD, POR, PWM, WDT
Number of I/O:
82
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
16K x 8
RAM Size:
192K x 8
Voltage – Supply (Vcc/Vdd):
1.6V ~ 5.5V
Data Converters:
A/D 25x14b SAR; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LFQFP (14×14)
Package / Case:
100-LQFP
70
R7FS3A77C3A01CNB#AA1R7FS3A77C3A01CNB#AA1RenesasIC MCU 32BIT 1MB FLASH 64HWQFNMicrocontrollers64-HWQFN (8x8)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M4
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
CANbus, I2C, IrDA, MMC/SD, SCI, SPI, UART/USART, USB
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
50
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
16K x 8
RAM Size:
192K x 8
Voltage – Supply (Vcc/Vdd):
1.6V ~ 5.5V
Data Converters:
A/D 18x14b SAR; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-HWQFN (8×8)
Package / Case:
64-WFQFN Exposed Pad
1,682
R7FS3A77C3A01CNB#AC1R7FS3A77C3A01CNB#AC1RenesasIC MCU 32BIT 1MB FLASH 64HWQFNMicrocontrollers64-HWQFN (8x8)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M4
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
CANbus, I2C, IrDA, MMC/SD, SCI, SPI, UART/USART, USB
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
50
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
16K x 8
RAM Size:
192K x 8
Voltage – Supply (Vcc/Vdd):
1.6V ~ 5.5V
Data Converters:
A/D 18x14b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-HWQFN (8×8)
Package / Case:
64-WFQFN Exposed Pad
323
R7FS3A77C3A01CNB#BA1R7FS3A77C3A01CNB#BA1RenesasSYNERGY MCU PLATFORM S3A7 1MB QFMicrocontrollers64-HWQFN (8x8)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M4
Core Size:
32-Bit
Speed:
48MHz
Connectivity:
CANbus, I2C, IrDA, MMC/SD, SCI, SPI, UART/USART, USB
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
50
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
16K x 8
RAM Size:
192K x 8
Voltage – Supply (Vcc/Vdd):
1.6V ~ 5.5V
Data Converters:
A/D 18x14b SAR; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-HWQFN (8×8)
Package / Case:
64-WFQFN Exposed Pad
1,135
R7FS5D37A2A01CLJ#AC0R7FS5D37A2A01CLJ#AC0RenesasIC MCU 32BIT 512KB FLSH 100TFLGAMicrocontrollers100-TFLGA (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M4F
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
CANbus, I2C, IrDA, SCI, SDH, SPI, SSI, UART, USB
Peripherals:
Cap Sense, DMA, LVD, POR, PWM, RTC, WDT
Number of I/O:
76
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 19x12b SAR; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-TFLGA (7×7)
Package / Case:
100-TFLGA
1,228
R7FS5D37A3A01CFM#AA0R7FS5D37A3A01CFM#AA0RenesasIC MCU 32BIT 512KB FLASH 64LFQFPMicrocontrollers64-LFQFP (10x10)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M4F
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
CANbus, I2C, IrDA, SCI, SDH, SPI, SSI, UART, USB
Peripherals:
Cap Sense, DMA, LVD, POR, PWM, RTC, WDT
Number of I/O:
40
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 10x12b SAR; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
1,217
R7FS5D37A3A01CFM#BA0N/AR7FS5D37A3A01CFM#BA0RenesasIC MCU 32BIT 512KB FLASH 64LFQFPMicrocontrollers64-LFQFP (10x10)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M4F
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
CANbus, I2C, IrDA, SCI, SDH, SPI, SSI, UART, USB
Peripherals:
Cap Sense, DMA, LVD, POR, PWM, RTC, WDT
Number of I/O:
40
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 10x12b SAR; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
825
R7FS5D37A3A01CFM#HA0R7FS5D37A3A01CFM#HA0RenesasIC MCU 32BIT 512KB FLASH 64LFQFPMicrocontrollers64-LFQFP (10x10)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M4F
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
CANbus, I2C, IrDA, SCI, SDH, SPI, SSI, UART, USB
Peripherals:
Cap Sense, DMA, LVD, POR, PWM, RTC, WDT
Number of I/O:
40
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 10x12b SAR; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
748
R7FS5D37A3A01CFP#AA0R7FS5D37A3A01CFP#AA0RenesasIC MCU 32BIT 512KB FLSH 100LFQFPMicrocontrollers100-LFQFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M4F
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
CANbus, I2C, IrDA, SCI, SDH, SPI, SSI, UART, USB
Peripherals:
Cap Sense, DMA, LVD, POR, PWM, RTC, WDT
Number of I/O:
67
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 19x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LFQFP (14×14)
Package / Case:
100-LQFP
1,500
R7FS5D37A3A01CFP#BA0R7FS5D37A3A01CFP#BA0RenesasIC MCU 32BIT 512KB FLSH 100LFQFPMicrocontrollers100-LFQFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M4F
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
CANbus, I2C, IrDA, SCI, SDH, SPI, SSI, UART, USB
Peripherals:
Cap Sense, DMA, LVD, POR, PWM, RTC, WDT
Number of I/O:
76
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 19x12b SAR; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LFQFP (14×14)
Package / Case:
100-LQFP
136
R7FS5D37A3A01CFP#HA0N/AR7FS5D37A3A01CFP#HA0RenesasSYNERGY MCU PLATFORM S5D3 256K 1Microcontrollers100-LFQFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M4F
Core Size:
32-Bit
Speed:
120MHz
Connectivity:
CANbus, I2C, IrDA, SCI, SDH, SPI, SSI, UART, USB
Peripherals:
Cap Sense, DMA, LVD, POR, PWM, RTC, WDT
Number of I/O:
76
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 19x12b SAR; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LFQFP (14×14)
Package / Case:
100-LQFP
883
N/AR7FS5D37A3A01CLJ#AC0RenesasSYNERGY MCU PLATFORM S5D3 256K 1Microcontrollers100-TFLGA (7x7)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M4F
Core Size:
32-Bit
Speed:
120MHz
Connectivity:
CANbus, I2C, IrDA, SCI, SDH, SPI, SSI, UART, USB
Peripherals:
Cap Sense, DMA, LVD, POR, PWM, RTC, WDT
Number of I/O:
76
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 19x12b SAR; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-TFLGA (7×7)
Package / Case:
100-TFLGA
36
R7FS5D37A3A01CNB#AA0N/AR7FS5D37A3A01CNB#AA0RenesasIC MCU 32BIT 512KB FLASH 64HWQFNMicrocontrollers64-HWQFN (8x8)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M4F
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
CANbus, I2C, IrDA, SCI, SDH, SPI, SSI, UART, USB
Peripherals:
Cap Sense, DMA, LVD, POR, PWM, RTC, WDT
Number of I/O:
40
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 10x12b SAR; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-HWQFN (8×8)
Package / Case:
64-WFQFN Exposed Pad
1,186
R7FS5D37A3A01CNB#AC0R7FS5D37A3A01CNB#AC0RenesasIC MCU 32BIT 512KB FLASH 64HWQFNMicrocontrollers64-HWQFN (8x8)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M4F
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
CANbus, I2C, IrDA, SCI, SDH, SPI, SSI, UART, USB
Peripherals:
Cap Sense, DMA, LVD, POR, PWM, RTC, WDT
Number of I/O:
40
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 10x12b SAR; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-HWQFN (8×8)
Package / Case:
64-WFQFN Exposed Pad
1,951
R7FS5D37A3A01CNB#BA0R7FS5D37A3A01CNB#BA0RenesasSYNERGY MCU PLATFORM S5D3 512K QMicrocontrollers64-HWQFN (8x8)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M4F
Core Size:
32-Bit
Speed:
120MHz
Connectivity:
CANbus, I2C, IrDA, SCI, SDH, SPI, SSI, UART, USB
Peripherals:
Cap Sense, DMA, LVD, POR, PWM, RTC, WDT
Number of I/O:
40
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 10x12b SAR; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-HWQFN (8×8)
Package / Case:
64-WFQFN Exposed Pad
409
R7FS5D37A3A01CNB#HA0R7FS5D37A3A01CNB#HA0RenesasIC MCU 32BIT 512KB FLASH 64HWQFNMicrocontrollers64-HWQFN (8x8)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M4F
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
CANbus, I2C, IrDA, SCI, SDH, SPI, SSI, UART, USB
Peripherals:
Cap Sense, DMA, LVD, POR, PWM, RTC, WDT
Number of I/O:
40
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 10x12b SAR; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-HWQFN (8×8)
Package / Case:
64-WFQFN Exposed Pad
849
R7FS5D37A3A01CNB#HC0N/AR7FS5D37A3A01CNB#HC0RenesasIC MCU 32BIT 512KB FLASH 64HWQFNMicrocontrollers64-HWQFN (8x8)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M4F
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
CANbus, I2C, IrDA, SCI, SDH, SPI, SSI, UART, USB
Peripherals:
Cap Sense, DMA, LVD, POR, PWM, RTC, WDT
Number of I/O:
40
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 10x12b SAR; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-HWQFN (8×8)
Package / Case:
64-WFQFN Exposed Pad
597
R7FS5D57A2A01CLK#AC0R7FS5D57A2A01CLK#AC0RenesasIC MCU 32BIT 512KB FLSH 145TFLGAMicrocontrollers145-TFLGA (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M4
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, IrDA, MMC/SD, QSPI, SCI, SPI, SSI, UART/USART, USB
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
110
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
384K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 22x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
145-TFLGA (7×7)
Package / Case:
145-TFLGA
74
R7FS5D57A2A01CLK#AC1R7FS5D57A2A01CLK#AC1RenesasIC MCU 32BIT 512KB FLSH 145TFLGAMicrocontrollers145-TFLGA (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M4
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, IrDA, MMC/SD, QSPI, SCI, SPI, SSI, UART/USART, USB
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
109
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
384K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 22x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
145-TFLGA (7×7)
Package / Case:
145-TFLGA
1,314
R7FS5D57A3A01CFB#AA0R7FS5D57A3A01CFB#AA0RenesasIC MCU 32BIT 512KB FLSH 144LFQFPMicrocontrollers144-LFQFP (20x20)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M4
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, IrDA, MMC/SD, QSPI, SCI, SPI, SSI, UART/USART, USB
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
110
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
384K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 22x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LFQFP (20×20)
Package / Case:
144-LQFP
1,742

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