Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

Featured Brands

About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,622
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
R7FS5D97E3A01CLK#AC0R7FS5D97E3A01CLK#AC0RenesasSYNERGY MCU PLATFORM S5D9 2MB 14Microcontrollers145-TFLGA (7x7)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M4
Core Size:
32-Bit
Speed:
120MHz
Connectivity:
CANbus, Ethernet, I2C, QSPI, SCI, SPI, SSIE, UART/USART, USB
Peripherals:
DMA, LCD, LVD, POR, PWM, WDT
Number of I/O:
110
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
640K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 22x12b SAR; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
145-TFLGA (7×7)
Package / Case:
145-TFLGA
204
R7FS7G27G2A01CBD#AC0R7FS7G27G2A01CBD#AC0RenesasIC MCU 32BIT 3MB FLASH 224LFBGAMicrocontrollers224-LFBGA (13x13)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M4
Core Size:
32-Bit Single-Core
Speed:
240MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, IrDA, MMC/SD, QSPI, SCI, SPI, SSI, UART/USART, USB
Peripherals:
DMA, LCD, LVD, POR, PWM, WDT
Number of I/O:
172
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
640K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 25x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
224-LFBGA (13×13)
Package / Case:
224-LFBGA
558
R7FS7G27G2A01CBG#AC0R7FS7G27G2A01CBG#AC0RenesasIC MCU 32BIT 3MB FLASH 176LFBGAMicrocontrollers176-LFBGA (13x13)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M4
Core Size:
32-Bit Single-Core
Speed:
240MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, IrDA, MMC/SD, QSPI, SCI, SPI, SSI, UART/USART, USB
Peripherals:
DMA, LCD, LVD, POR, PWM, WDT
Number of I/O:
126
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
640K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 21x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LFBGA (13×13)
Package / Case:
176-LFBGA
685
R7FS7G27G2A01CLK#AC0R7FS7G27G2A01CLK#AC0RenesasIC MCU 32BIT 3MB FLASH 145TFLGAMicrocontrollers145-TFLGA (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M4
Core Size:
32-Bit Single-Core
Speed:
240MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, IrDA, MMC/SD, QSPI, SCI, SPI, SSI, UART/USART, USB
Peripherals:
DMA, LCD, LVD, POR, PWM, WDT
Number of I/O:
104
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
640K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 19x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
145-TFLGA (7×7)
Package / Case:
145-TFLGA
275
R7FS7G27G3A01CFB#AA0R7FS7G27G3A01CFB#AA0RenesasIC MCU 32BIT 3MB FLASH 144LQFPMicrocontrollers144-LFQFP (20x20)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M4
Core Size:
32-Bit Single-Core
Speed:
240MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, IrDA, MMC/SD, QSPI, SCI, SPI, SSI, UART/USART, USB
Peripherals:
DMA, LCD, LVD, POR, PWM, WDT
Number of I/O:
104
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
640K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 19x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LFQFP (20×20)
Package / Case:
144-LQFP
834
N/AR7FS7G27G3A01CFB#BA0RenesasSYNERGY MCU PLATFORM S7G2 3MB 14Microcontrollers144-LFQFP (20x20)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M4F
Core Size:
32-Bit
Speed:
240MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, IrDA, MMC/SD, QSPI, SCI, SPI, SSI, UART/USART, USB
Peripherals:
DMA, LCD, LVD, POR, PWM, WDT
Number of I/O:
104
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
640K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 19x12b SAR; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LFQFP (20×20)
Package / Case:
144-LQFP
956
R7FS7G27G3A01CFC#AA0R7FS7G27G3A01CFC#AA0RenesasIC MCU 32BIT 3MB FLASH 176LFQFPMicrocontrollers176-LFQFP (24x24)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M4
Core Size:
32-Bit Single-Core
Speed:
240MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, IrDA, MMC/SD, QSPI, SCI, SPI, SSI, UART/USART, USB
Peripherals:
DMA, LCD, LVD, POR, PWM, WDT
Number of I/O:
126
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
640K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 21x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LFQFP (24×24)
Package / Case:
176-LQFP
722
R7FS7G27G3A01CFC#BA0R7FS7G27G3A01CFC#BA0RenesasSYNERGY MCU PLATFORM S7G2 3MB 17Microcontrollers176-LFQFP (24x24)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M4F
Core Size:
32-Bit
Speed:
240MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, IrDA, MMC/SD, QSPI, SCI, SPI, SSI, UART/USART, USB
Peripherals:
DMA, LCD, LVD, POR, PWM, WDT
Number of I/O:
126
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
640K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 21x12b SAR; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LFQFP (24×24)
Package / Case:
176-LQFP
1,452
R7FS7G27G3A01CFP#AA0R7FS7G27G3A01CFP#AA0RenesasIC MCU 32BIT 3MB FLASH 100LQFPMicrocontrollers100-LFQFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M4
Core Size:
32-Bit Single-Core
Speed:
240MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, IrDA, MMC/SD, QSPI, SCI, SPI, SSI, UART/USART, USB
Peripherals:
DMA, LCD, LVD, POR, PWM, WDT
Number of I/O:
70
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
640K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 16x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LFQFP (14×14)
Package / Case:
100-LQFP
548
R7FS7G27G3A01CFP#BA0R7FS7G27G3A01CFP#BA0RenesasSYNERGY MCU PLATFORM S7G2 3MB 10Microcontrollers100-LFQFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M4F
Core Size:
32-Bit
Speed:
240MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, IrDA, MMC/SD, QSPI, SCI, SPI, SSI, UART/USART, USB
Peripherals:
DMA, LCD, LVD, POR, PWM, WDT
Number of I/O:
70
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
640K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 16x12b SAR; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LFQFP (14×14)
Package / Case:
100-LQFP
458
R7FS7G27H2A01CBD#AC0R7FS7G27H2A01CBD#AC0RenesasIC MCU 32BIT 4MB FLASH 224LFBGAMicrocontrollers224-LFBGA (13x13)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M4
Core Size:
32-Bit Single-Core
Speed:
240MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, IrDA, MMC/SD, QSPI, SCI, SPI, SSI, UART/USART, USB
Peripherals:
DMA, LCD, LVD, POR, PWM, WDT
Number of I/O:
172
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
640K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 25x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
224-LFBGA (13×13)
Package / Case:
224-LFBGA
506
R7FS7G27H2A01CBG#AC0R7FS7G27H2A01CBG#AC0RenesasIC MCU 32BIT 4MB FLASH 176LFBGAMicrocontrollers176-LFBGA (13x13)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M4
Core Size:
32-Bit Single-Core
Speed:
240MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, IrDA, MMC/SD, QSPI, SCI, SPI, SSI, UART/USART, USB
Peripherals:
DMA, LCD, LVD, POR, PWM, WDT
Number of I/O:
126
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
640K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 21x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LFBGA (13×13)
Package / Case:
176-LFBGA
43
R7FS7G27H2A01CLK#AC0R7FS7G27H2A01CLK#AC0RenesasIC MCU 32BIT 4MB FLASH 145TFLGAMicrocontrollers145-TFLGA (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M4
Core Size:
32-Bit Single-Core
Speed:
240MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, IrDA, MMC/SD, QSPI, SCI, SPI, SSI, UART/USART, USB
Peripherals:
DMA, LCD, LVD, POR, PWM, WDT
Number of I/O:
104
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
640K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 19x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
145-TFLGA (7×7)
Package / Case:
145-TFLGA
320
R7FS7G27H3A01CFB#AA0R7FS7G27H3A01CFB#AA0RenesasIC MCU 32BIT 4MB FLASH 144LQFPMicrocontrollers144-LFQFP (20x20)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M4
Core Size:
32-Bit Single-Core
Speed:
240MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, IrDA, MMC/SD, QSPI, SCI, SPI, SSI, UART/USART, USB
Peripherals:
DMA, LCD, LVD, POR, PWM, WDT
Number of I/O:
104
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
640K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 19x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LFQFP (20×20)
Package / Case:
144-LQFP
487
N/AR7FS7G27H3A01CFB#BA0RenesasSYNERGY MCU PLATFORM S7G2 4MB 14Microcontrollers144-LFQFP (20x20)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M4F
Core Size:
32-Bit
Speed:
240MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, IrDA, MMC/SD, QSPI, SCI, SPI, SSI, UART/USART, USB
Peripherals:
DMA, LCD, LVD, POR, PWM, WDT
Number of I/O:
104
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
640K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 19x12b SAR; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LFQFP (20×20)
Package / Case:
144-LQFP
845
R7FS7G27H3A01CFC#AA0R7FS7G27H3A01CFC#AA0RenesasIC MCU 32BIT 4MB FLASH 176LFQFPMicrocontrollers176-LFQFP (24x24)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M4
Core Size:
32-Bit Single-Core
Speed:
240MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, IrDA, MMC/SD, QSPI, SCI, SPI, SSI, UART/USART, USB
Peripherals:
DMA, LCD, LVD, POR, PWM, WDT
Number of I/O:
126
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
640K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 21x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LFQFP (24×24)
Package / Case:
176-LQFP
779
R7FS7G27H3A01CFC#BA0R7FS7G27H3A01CFC#BA0RenesasSYNERGY MCU PLATFORM S7G2 4MB 17Microcontrollers176-LFQFP (24x24)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M4F
Core Size:
32-Bit
Speed:
240MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, IrDA, MMC/SD, QSPI, SCI, SPI, SSI, UART/USART, USB
Peripherals:
DMA, LCD, LVD, POR, PWM, WDT
Number of I/O:
126
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
640K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 21x12b SAR; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LFQFP (24×24)
Package / Case:
176-LQFP
143
R7S721000VCBG#AC0R7S721000VCBG#AC0RenesasIC MPU RZ/A1H 400MHZ 256LFBGAMicroprocessors256-LFBGA (11x11)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
SDRAM, SRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
DVD, VDC
Ethernet:
10/100Mbps (1), 100Mbps (1)
USB:
USB 2.0 (2)
Voltage – I/O:
1.2V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
256-LFBGA
Supplier Device Package:
256-LFBGA (11×11)
Additional Interfaces:
CAN, I2C, IEBus, IrDA, LIN, MediaLB, MMC/SD/SDIO, SCI, SCI FIFO, SPDIF, SPI, SSI
154
R7S721000VCBG#AC1R7S721000VCBG#AC1RenesasIC MPU RZ/A1H 400MHZ 256LFBGAMicroprocessors256-LFBGA (11x11)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
SDRAM, SRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
DVD, VDC
Ethernet:
10/100Mbps (1), 100Mbps (1)
USB:
USB 2.0 (2)
Voltage – I/O:
1.2V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
256-LFBGA
Supplier Device Package:
256-LFBGA (11×11)
Additional Interfaces:
CAN, EBI/EMI, I2C, IEBus, IrDA, LIN, MediaLB, MMC/SD/SDIO, SCI, SCI FIFO, SPDIF, SPI, SSI
290
N/AN/AR7S721000VCFP#AA0RenesasIC MPU RZ/A1H 400MHZ 256LQFPMicroprocessors256-LQFP (28x28)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
SDRAM, SRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
DVD, VDC
Ethernet:
10/100Mbps (1), 100Mbps (1)
USB:
USB 2.0 (2)
Voltage – I/O:
1.2V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
256-LQFP
Supplier Device Package:
256-LQFP (28×28)
Additional Interfaces:
CANbus, EBI/EMI, I2C, IEBus, IrDA, LIN, MediaLB, MMC/SD/SDIO, SCI, SCI FIFO, SPDIF, SPI, SSI
439

See What We Have to Offer!

See What We Have to Offer!

keyboard_arrow_up