Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,621
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
R7S721000VLFP#AA0
R7S721000VLFP#AA0RenesasIC MPU RZ/A1H 400MHZ 256LQFPMicroprocessors256-LQFP (28x28)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
SDRAM, SRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
DVD, VDC
Ethernet:
10/100Mbps (1), 100Mbps (1)
USB:
USB 2.0 (2)
Voltage – I/O:
1.2V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
256-LQFP
Supplier Device Package:
256-LQFP (28×28)
Additional Interfaces:
CAN, I2C, IEBus, IrDA, LIN, MediaLB, MMC/SD/SDIO, SCI, SCI FIFO, SPDIF, SPI, SSI
990
R7S721001VCBG#AC0
R7S721001VCBG#AC0RenesasIC MPU RZ/A1H 400MHZ 324FBGAMicroprocessors324-FBGA (19x19)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
SDRAM, SRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
DVD, VDC
Ethernet:
10/100Mbps (1), 100Mbps (1)
USB:
USB 2.0 (2)
Voltage – I/O:
1.2V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
324-FBGA
Supplier Device Package:
324-FBGA (19×19)
Additional Interfaces:
CAN, I2C, IEBus, IrDA, LIN, MediaLB, MMC/SD/SDIO, SCI, SCI FIFO, SPDIF, SPI, SSI
296
R7S721001VCBG#AC1
R7S721001VCBG#AC1RenesasIC MPU RZ/A1H 400MHZ 324FBGAMicroprocessors324-FBGA (19x19)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
SDRAM, SRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
DVD, VDC
Ethernet:
10/100Mbps (1), 100Mbps (1)
USB:
USB 2.0 (2)
Voltage – I/O:
1.2V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
324-FBGA
Supplier Device Package:
324-FBGA (19×19)
Additional Interfaces:
CAN, I2C, IEBus, IrDA, LIN, MediaLB, MMC/SD/SDIO, SCI, SCI FIFO, SPDIF, SPI, SSI
1,936
R7S721001VLBG#AC0
R7S721001VLBG#AC0RenesasIC MPU RZ/A1H 400MHZ 324FBGAMicroprocessors324-FBGA (19x19)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
SDRAM, SRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
DVD, VDC
Ethernet:
10/100Mbps (1), 100Mbps (1)
USB:
USB 2.0 (2)
Voltage – I/O:
1.2V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
324-FBGA
Supplier Device Package:
324-FBGA (19×19)
Additional Interfaces:
CAN, I2C, IEBus, IrDA, LIN, MediaLB, MMC/SD/SDIO, SCI, SCI FIFO, SPDIF, SPI, SSI
1,849
N/AN/AR7S721001VLBG#AC1RenesasIC MPU RZ/A1H 400MHZ 324FBGAMicroprocessors324-FBGA (19x19)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
SDRAM, SRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
DVD, VDC
Ethernet:
10/100Mbps (1), 100Mbps (1)
USB:
USB 2.0 (2)
Voltage – I/O:
1.2V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
324-FBGA
Supplier Device Package:
324-FBGA (19×19)
Additional Interfaces:
CANbus, EBI/EMI, I2C, IEBus, IrDA, LIN, MediaLB, MMC/SD/SDIO, SCI, SCI FIFO, SPDIF, SPI, SSI
711
R7S721010VCBG#AC0
R7S721010VCBG#AC0RenesasIC MPU RZ/A1M 400MHZ 256LFBGAMicroprocessors256-LFBGA (11x11)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
SDRAM, SRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
DVD, VDC
Ethernet:
10/100Mbps (1), 100Mbps (1)
USB:
USB 2.0 (2)
Voltage – I/O:
1.2V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
256-LFBGA
Supplier Device Package:
256-LFBGA (11×11)
Additional Interfaces:
CAN, I2C, IEBus, IrDA, LIN, MediaLB, MMC/SD/SDIO, SCI, SCI FIFO, SPDIF, SPI, SSI
605
R7S721010VCFP#AA0
R7S721010VCFP#AA0RenesasIC MPU RZ/A1M 400MHZ 256LQFPMicroprocessors256-LQFP (28x28)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
SDRAM, SRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
DVD, VDC
Ethernet:
10/100Mbps (1), 100Mbps (1)
USB:
USB 2.0 (2)
Voltage – I/O:
1.2V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
256-LQFP
Supplier Device Package:
256-LQFP (28×28)
Additional Interfaces:
CAN, I2C, IEBus, IrDA, LIN, MediaLB, MMC/SD/SDIO, SCI, SCI FIFO, SPDIF, SPI, SSI
574
R7S721010VLFP#AA0
R7S721010VLFP#AA0RenesasIC MPU RZ/A1M 400MHZ 256LQFPMicroprocessors256-LQFP (28x28)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
SDRAM, SRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
DVD, VDC
Ethernet:
10/100Mbps (1), 100Mbps (1)
USB:
USB 2.0 (2)
Voltage – I/O:
1.2V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
256-LQFP
Supplier Device Package:
256-LQFP (28×28)
Additional Interfaces:
CAN, I2C, IEBus, IrDA, LIN, MediaLB, MMC/SD/SDIO, SCI, SCI FIFO, SPDIF, SPI, SSI
417
R7S721011VCBG#AC0
R7S721011VCBG#AC0RenesasIC MPU RZ/A1M 400MHZ 324FBGAMicroprocessors324-FBGA (19x19)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
SDRAM, SRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
DVD, VDC
Ethernet:
10/100Mbps (1), 100Mbps (1)
USB:
USB 2.0 (2)
Voltage – I/O:
1.2V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
324-FBGA
Supplier Device Package:
324-FBGA (19×19)
Additional Interfaces:
CAN, I2C, IEBus, IrDA, LIN, MediaLB, MMC/SD/SDIO, SCI, SCI FIFO, SPDIF, SPI, SSI
796
R7S721011VLBG#AC0
R7S721011VLBG#AC0RenesasIC MPU RZ/A1M 400MHZ 324FBGAMicroprocessors324-FBGA (19x19)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
SDRAM, SRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
DVD, VDC
Ethernet:
10/100Mbps (1), 100Mbps (1)
USB:
USB 2.0 (2)
Voltage – I/O:
1.2V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
324-FBGA
Supplier Device Package:
324-FBGA (19×19)
Additional Interfaces:
CAN, I2C, IEBus, IrDA, LIN, MediaLB, MMC/SD/SDIO, SCI, SCI FIFO, SPDIF, SPI, SSI
884
R7S721020VCBG#AC1
R7S721020VCBG#AC1RenesasIC MPU RZ/A1L 400MHZ 176LFBGAMicroprocessors176-LFBGA (8x8)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
SDRAM, SRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
VDC
Ethernet:
10/100Mbps
USB:
USB 2.0 (2)
Voltage – I/O:
1.2V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
176-LFBGA
Supplier Device Package:
176-LFBGA (8×8)
Additional Interfaces:
CAN, I2C, IEBus, IrDA, LIN, MediaLB, MMC/SD/SDIO, SCI, SCI FIFO, SPDIF, SPI, SSI
672
R7S721020VCFP#AA1
R7S721020VCFP#AA1RenesasIC MPU RZ/A1L 400MHZ 176LFQFPMicroprocessors176-LFQFP (24x24)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
SDRAM, SRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
VDC
Ethernet:
10/100Mbps
USB:
USB 2.0 (2)
Voltage – I/O:
1.2V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
176-LQFP
Supplier Device Package:
176-LFQFP (24×24)
Additional Interfaces:
CAN, I2C, IEBus, IrDA, LIN, MediaLB, MMC/SD/SDIO, SCI, SCI FIFO, SPDIF, SPI, SSI
611
R7S721020VLFP#AA0N/AR7S721020VLFP#AA0RenesasIC MPU RZ/A1L 400MHZ 176LFQFPMicroprocessors176-LFQFP (24x24)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
SDRAM, SRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
VDC
Ethernet:
10/100Mbps
USB:
USB 2.0 (2)
Voltage – I/O:
1.2V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
176-LQFP
Supplier Device Package:
176-LFQFP (24×24)
Additional Interfaces:
CAN, I2C, IEBus, IrDA, LIN, MediaLB, MMC/SD/SDIO, SCI, SCI FIFO, SPDIF, SPI, SSI
1,301
R7S721020VLFP#AA1
R7S721020VLFP#AA1RenesasIC MPU RZ/A1L 400MHZ 176LFQFPMicroprocessors176-LFQFP (24x24)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
SDRAM, SRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
VDC
Ethernet:
10/100Mbps
USB:
USB 2.0 (2)
Voltage – I/O:
1.2V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
176-LQFP
Supplier Device Package:
176-LFQFP (24×24)
Additional Interfaces:
CAN, I2C, IEBus, IrDA, LIN, MediaLB, MMC/SD/SDIO, SCI, SCI FIFO, SPDIF, SPI, SSI
1,078
R7S721021VCFP#AA1
R7S721021VCFP#AA1RenesasIC MPU RZ/A1L 400MHZ 208LFQFPMicroprocessors208-LFQFP (28x28)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
SDRAM, SRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
VDC
Ethernet:
10/100Mbps
USB:
USB 2.0 (2)
Voltage – I/O:
1.2V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
208-LQFP
Supplier Device Package:
208-LFQFP (28×28)
Additional Interfaces:
CAN, I2C, IEBus, IrDA, LIN, MediaLB, MMC/SD/SDIO, SCI, SCI FIFO, SPDIF, SPI, SSI
216
R7S721021VLFP#AA1
R7S721021VLFP#AA1RenesasIC MPU RZ/A1L 400MHZ 208LFQFPMicroprocessors208-LFQFP (28x28)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
SDRAM, SRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
VDC
Ethernet:
10/100Mbps
USB:
USB 2.0 (2)
Voltage – I/O:
1.2V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
208-LQFP
Supplier Device Package:
208-LFQFP (28×28)
Additional Interfaces:
CAN, I2C, IEBus, IrDA, LIN, MediaLB, MMC/SD/SDIO, SCI, SCI FIFO, SPDIF, SPI, SSI
1,125
R7S721030VCBG#AC0
R7S721030VCBG#AC0RenesasIC MPU RZ/A1LU 400MHZ 176LFBGAMicroprocessors176-LFBGA (8x8)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
SDRAM, SRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
VDC
Ethernet:
10/100Mbps (1), 100Mbps (1)
USB:
USB 2.0 (2)
Voltage – I/O:
1.2V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
176-LFBGA
Supplier Device Package:
176-LFBGA (8×8)
Additional Interfaces:
CAN, I2C, IrDA, MMC/SD/SDIO, SCI, SCI FIFO, SPDIF, SPI, SSI
883
R7S721030VCFP#AA0
R7S721030VCFP#AA0RenesasIC MPU RZ/A1LU 400MHZ 176LFQFPMicroprocessors176-LFQFP (24x24)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
SDRAM, SRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
VDC
Ethernet:
10/100Mbps (1), 100Mbps (1)
USB:
USB 2.0 (2)
Voltage – I/O:
1.2V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
176-LQFP
Supplier Device Package:
176-LFQFP (24×24)
Additional Interfaces:
CAN, I2C, IrDA, MMC/SD/SDIO, SCI, SCI FIFO, SPDIF, SPI, SSI
210
R7S721030VLFP#AA0N/AR7S721030VLFP#AA0RenesasIC MPU RZ/A1LU 400MHZ 176LFQFPMicroprocessors176-LFQFP (24x24)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
SDRAM, SRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
VDC
Ethernet:
10/100Mbps (1), 100Mbps (1)
USB:
USB 2.0 (2)
Voltage – I/O:
1.2V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
176-LQFP
Supplier Device Package:
176-LFQFP (24×24)
Additional Interfaces:
CANbus, I2C, IrDA, MMC/SD/SDIO, SCI, SCI FIFO, SPDIF, SPI, SSI
600
R7S721031VCBG#AC0
R7S721031VCBG#AC0RenesasIC MPU RZ/A1LU 400MHZ 233FBGAMicroprocessors233-FBGA (15x15)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core
Speed:
400MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD
USB:
USB 2.0 (1)
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, 3DES, GHASH, RSA, SHA1, SHA224, SHA256
Mounting Type:
Surface Mount
Package / Case:
233-FBGA
Supplier Device Package:
233-FBGA (15×15)
Additional Interfaces:
CAN, I2C, I2S, IrDA, MMC/SD/SDIO, SCI, SCI FIFO, SPDIF, SPI, SSI
1,910

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