 | | R7S910018CBG#AC0 | Renesas | IC MCU 32BIT ROMLESS 320FBGA | Microcontrollers | 320-FBGA (17x17) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-R4F Core Size: 32-Bit Single-Core Connectivity: CANbus, CSI, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB Peripherals: DMA, POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.14V ~ 3.6V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 320-FBGA (17×17) | 1,027 | |
| N/A | | R7S910020CBG#AC0 | Renesas | RZ/T1-M 450MHZ ROML 544K MDIO SL | Microcontrollers | 112-FBGA (6x6) | N/A | -40°C ~ 110°C (TJ) | Core Processor: ARM® Cortex®-R4F Connectivity: CSI, I2C, SPI, UART/USART Peripherals: DMA, POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.14V ~ 3.6V Data Converters: A/D 16x12b Operating Temperature: -40°C ~ 110°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 112-FBGA (6×6) | 393 | |
| N/A | | R7S910021CBG#AC0 | Renesas | RZ/T1-M 450MHZ ROML 1568K MDIO S | Microcontrollers | 112-FBGA (6x6) | N/A | -40°C ~ 110°C (TJ) | Core Processor: ARM® Cortex®-R4F Connectivity: CSI, I2C, SPI, UART/USART Peripherals: DMA, POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.14V ~ 3.6V Data Converters: A/D 16x12b Operating Temperature: -40°C ~ 110°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 112-FBGA (6×6) | 240 | |
| N/A | | R7S910022CBG#AC0 | Renesas | RZ/T1-M 450MHZ ROML 544K MDIO SL | Microcontrollers | 112-FBGA (6x6) | N/A | -40°C ~ 110°C (TJ) | Core Processor: ARM® Cortex®-R4F Connectivity: CSI, I2C, SPI, UART/USART Peripherals: DMA, POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.14V ~ 3.6V Data Converters: A/D 16x12b Operating Temperature: -40°C ~ 110°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 112-FBGA (6×6) | 187 | |
| N/A | N/A | R7S910023CBG#AC0 | Renesas | IC MCU 32BIT ROMLESS 112LFBGA | Microcontrollers | 112-FBGA (6x6) | N/A | -40°C ~ 110°C (TJ) | Core Processor: ARM® Cortex®-R4F Connectivity: CSI, I2C, SPI, UART/USART Peripherals: DMA, POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.14V ~ 3.6V Data Converters: A/D 16x12b Operating Temperature: -40°C ~ 110°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 112-FBGA (6×6) | 1,389 | |
 | | R7S910025CBA#BC0 | Renesas | IC MCU 32BIT ROMLESS 320LFBGA | Microcontrollers | 320-LFBGA (17x17) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-R4F Connectivity: CANbus, CSI, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB Peripherals: DMA, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.14V ~ 3.6V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 320-LFBGA (17×17) | 121 | |
 | | R7S910025CBG#AC0 | Renesas | IC MCU 32BIT ROMLESS 320FBGA | Microcontrollers | 320-FBGA (17x17) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-R4F Core Size: 32-Bit Single-Core Connectivity: CANbus, CSI, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB Peripherals: DMA, POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.14V ~ 3.6V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 320-FBGA (17×17) | 1,029 | |
 | | R7S910026CBA#BC0 | Renesas | IC MCU 32BIT ROMLESS 320LFBGA | Microcontrollers | 320-LFBGA (17x17) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-R4F Connectivity: CANbus, CSI, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB Peripherals: DMA, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.14V ~ 3.6V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 320-LFBGA (17×17) | 1,084 | |
 | | R7S910026CBG#AC0 | Renesas | IC MCU 32BIT ROMLESS 320FBGA | Microcontrollers | 320-FBGA (17x17) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-R4F Core Size: 32-Bit Single-Core Connectivity: CANbus, CSI, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB Peripherals: DMA, POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.14V ~ 3.6V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 320-FBGA (17×17) | 943 | |
 | | R7S910027CBA#BC0 | Renesas | IC MCU 32BIT ROMLESS 320LFBGA | Microcontrollers | 320-LFBGA (17x17) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-R4F Connectivity: CANbus, CSI, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB Peripherals: DMA, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.14V ~ 3.6V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 320-LFBGA (17×17) | 1,415 | |
 | | R7S910027CBG#AC0 | Renesas | IC MCU 32BIT ROMLESS 320FBGA | Microcontrollers | 320-FBGA (17x17) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-R4F Core Size: 32-Bit Single-Core Connectivity: CANbus, CSI, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB Peripherals: DMA, POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.14V ~ 3.6V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 320-FBGA (17×17) | 327 | |
 | | R7S910028CBA#BC0 | Renesas | IC MCU 32BIT ROMLESS 320LFBGA | Microcontrollers | 320-LFBGA (17x17) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-R4F Connectivity: CANbus, CSI, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB Peripherals: DMA, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.14V ~ 3.6V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 320-LFBGA (17×17) | 1,753 | |
 | | R7S910028CBG#AC0 | Renesas | IC MCU 32BIT ROMLESS 320FBGA | Microcontrollers | 320-FBGA (17x17) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-R4F Core Size: 32-Bit Single-Core Connectivity: CANbus, CSI, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB Peripherals: DMA, POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.14V ~ 3.6V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 320-FBGA (17×17) | 1,285 | |
 | | R7S910035CBA#BC0 | Renesas | IC MCU 32BIT ROMLESS 320LFBGA | Microcontrollers | 320-LFBGA (17x17) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-R4F Connectivity: CANbus, CSI, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB Peripherals: DMA, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.14V ~ 3.6V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 320-LFBGA (17×17) | 614 | |
| N/A | | R7S910035CBG#AC0 | Renesas | IC MCU 32BIT ROMLESS 320FBGA | Microcontrollers | 320-FBGA (17x17) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-R4F Core Size: 32-Bit Single-Core Connectivity: CANbus, CSI, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB Peripherals: DMA, POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.14V ~ 3.6V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 320-FBGA (17×17) | 528 | |
 | | R7S910036CBA#BC0 | Renesas | IC MCU 32BIT ROMLESS 320LFBGA | Microcontrollers | 320-LFBGA (17x17) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-R4F Connectivity: CANbus, CSI, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB Peripherals: DMA, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.14V ~ 3.6V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 320-LFBGA (17×17) | 508 | |
| N/A | | R7S910036CBG#AC0 | Renesas | IC MCU 32BIT ROMLESS 320FBGA | Microcontrollers | 320-FBGA (17x17) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-R4F Core Size: 32-Bit Single-Core Connectivity: CANbus, CSI, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB Peripherals: DMA, POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.14V ~ 3.6V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 320-FBGA (17×17) | 238 | |
 | | R7S921040VCBG#AC0 | Renesas | IC MPU RZ/A2M 528MHZ 176LFBGA | Microprocessors | 176-LFBGA (13x13) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core Co-Processors/DSP: Multimedia; NEON™ MPE Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS, MIPICSI2, Video Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, 3DES, GHASH, RSA, SHA1, SHA224, SHA256 Mounting Type: Surface Mount Supplier Device Package: 176-LFBGA (13×13) Additional Interfaces: CAN, I2C, I2S, IrDA, MMC/SD/SDIO, SCI, SCI FIFO, SPDIF, SPI, SSI | 1,258 | |
 | | R7S921040VCBG#BC0 | Renesas | IC MPU RZ/A2M 528MHZ 176LFBGA | Microprocessors | 176-LFBGA (13x13) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS, MIPICSI2, Video Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, 3DES, GHASH, RSA, SHA1, SHA224, SHA256 Mounting Type: Surface Mount Supplier Device Package: 176-LFBGA (13×13) Additional Interfaces: CAN, I2C, I2S, IrDA, MMC/SD/SDIO, SCI, SCI FIFO, SPDIF, SPI, SSI | 428 | |
 | | R7S921041VCBG#AC0 | Renesas | IC MPU RZ/A2M 528MHZ 256LFBGA | Microprocessors | 256-LFBGA (11x11) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core Co-Processors/DSP: Multimedia; NEON™ MPE Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS, MIPICSI2, Video Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, 3DES, GHASH, RSA, SHA1, SHA224, SHA256 Mounting Type: Surface Mount Supplier Device Package: 256-LFBGA (11×11) Additional Interfaces: CAN, I2C, I2S, IrDA, MMC/SD/SDIO, SCI, SCI FIFO, SPDIF, SPI, SSI | 401 | |