 | | R7S921056VCBG#BC0 | Renesas | IC MPU RZ/A2M 528MHZ 256LFBGA | Microprocessors | 256-LFBGA (11x11) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS, MIPICSI2, Video Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, 3DES, GHASH, RSA, SHA1, SHA224, SHA256 Mounting Type: Surface Mount Supplier Device Package: 256-LFBGA (11×11) Additional Interfaces: CAN, I2C, I2S, IrDA, MMC/SD/SDIO, SCI, SCI FIFO, SPDIF, SPI, SSI | 160 | |
 | | R7S921057VCBG#AC0 | Renesas | IC MPU RZ/A2M 528MHZ 272FBGA | Microprocessors | 272-FBGA (17x17) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS, MIPICSI2, Video Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, 3DES, GHASH, RSA, SHA1, SHA224, SHA256 Mounting Type: Surface Mount Supplier Device Package: 272-FBGA (17×17) Additional Interfaces: CAN, I2C, I2S, IrDA, MMC/SD/SDIO, SCI, SCI FIFO, SPDIF, SPI, SSI | 135 | |
 | | R7S921057VCBG#BC0 | Renesas | IC MPU RZ/A2M 528MHZ 272FBGA | Microprocessors | 272-FBGA (17x17) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS, MIPICSI2, Video Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, 3DES, GHASH, RSA, SHA1, SHA224, SHA256 Mounting Type: Surface Mount Supplier Device Package: 272-FBGA (17×17) Additional Interfaces: CAN, I2C, I2S, IrDA, MMC/SD/SDIO, SCI, SCI FIFO, SPDIF, SPI, SSI | 320 | |
 | | R7S921058VCBG#AC0 | Renesas | IC MPU RZ/A2M 528MHZ 324FBGA | Microprocessors | 324-FBGA (19x19) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS, MIPICSI2, Video Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, 3DES, GHASH, RSA, SHA1, SHA224, SHA256 Mounting Type: Surface Mount Supplier Device Package: 324-FBGA (19×19) Additional Interfaces: CAN, I2C, I2S, IrDA, MMC/SD/SDIO, SCI, SCI FIFO, SPDIF, SPI, SSI | 1,085 | |
 | | R7S921058VCBG#BC0 | Renesas | IC MPU RZ/A2M 528MHZ 324FBGA | Microprocessors | 324-FBGA (19x19) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS, MIPICSI2, Video Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, 3DES, GHASH, RSA, SHA1, SHA224, SHA256 Mounting Type: Surface Mount Supplier Device Package: 324-FBGA (19×19) Additional Interfaces: CAN, I2C, I2S, IrDA, MMC/SD/SDIO, SCI, SCI FIFO, SPDIF, SPI, SSI | 1,088 | |
 | | R80188 | Advanced Micro Devices | IC MPU 8MHZ 68CLCC | Microprocessors | 68-CLCC (24.13x24.13) | N/A | 0°C ~ 70°C (TA) | Number of Cores/Bus Width: 1 Core, 16-Bit Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 68-CLCC (24.13×24.13) Additional Interfaces: DMA, EBI/EMI | 619 | |
 | | R80188-10 | Advanced Micro Devices | IC MPU 10MHZ 68CLCC | Microprocessors | 68-CLCC (24.13x24.13) | N/A | 0°C ~ 70°C (TA) | Number of Cores/Bus Width: 1 Core, 16-Bit Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 68-CLCC (24.13×24.13) Additional Interfaces: DMA, EBI/EMI | 96 | |
 | | R80286-8S | Advanced Micro Devices | IC MPU 8MHZ 68CLCC | Microprocessors | 68-CLCC (24.13x24.13) | N/A | 0°C ~ 85°C (TC) | Number of Cores/Bus Width: 1 Core Operating Temperature: 0°C ~ 85°C (TC) Mounting Type: Surface Mount Supplier Device Package: 68-CLCC (24.13×24.13) | 137 | |
 | | R80C188XL20 | Intel | IC MPU I186 20MHZ 68PLCC | Microprocessors | 68-PLCC | N/A | 0°C ~ 70°C (TA) | Number of Cores/Bus Width: 1 Core, 16-Bit Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 68-LCC (J-Lead) Supplier Device Package: 68-PLCC | 384 | |
| N/A | N/A | R8A20400BG-GU#G0 | Renesas | IC MCU SOC 16BIT SMD | Microcontrollers | N/A | N/A | N/A | N/A | 645 | |
| N/A | N/A | R8A20421ABG-G#G0 | Renesas | IC MCU SOC 16BIT SMD | Microcontrollers | N/A | N/A | N/A | N/A | 1,381 | |
 | | R8A66597DFP#RB1S | Renesas | IC CONTROLLER USB 80-LQFP | Controllers | 80-LFQFP (10x10) | 1.8V, 3.3V | -40°C ~ 85°C | Voltage – Supply: 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C Supplier Device Package: 80-LFQFP (10×10) | 334 | |
 | | R8A77210C133BAV | Renesas | IC MPU SUPERH 133MHZ 256BGA | Microprocessors | 256-LFBGA (11x11) | N/A | -20°C ~ 75°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Operating Temperature: -20°C ~ 75°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-LFBGA (11×11) | 582 | |
| N/A | | R8A77210C133BGV | Renesas | IC MPU SUPERH SH7700 133MHZ | Microprocessors | N/A | N/A | -20°C ~ 75°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Operating Temperature: -20°C ~ 75°C (TA) Mounting Type: Surface Mount | 30 | |
 | | R8A77220AC266BAV | Renesas | IC MPU SUPERH 266MHZ 417BGA | Microprocessors | 417-LFBGA (13x13) | 3.30V | -20°C – 75°C | Core Processor: SH-4AL-DSP Number of Cores/Bus Width: 1 Core, 32-Bit Mounting Type: Surface Mount | 1,374 | |
 | N/A | R8A77220AC266BGV | Renesas | IC MPU SUPERH 266MHZ 449FBGA | Microprocessors | 449-FBGA (21x21) | N/A | -20°C ~ 75°C (TA) | Core Processor: SH-4AL-DSP Number of Cores/Bus Width: 1 Core, 32-Bit Operating Temperature: -20°C ~ 75°C (TA) Mounting Type: Surface Mount Supplier Device Package: 449-FBGA (21×21) | 949 | |
| N/A | N/A | R8A77230AD400BG#U0 | Renesas | IC MCU 32BIT ROMLESS 449FBGA | Microcontrollers | 449-FBGA (21x21) | N/A | -40°C ~ 85°C (TA) | Connectivity: I2C, IrDA, MMC/SD, UART/USART, USB Peripherals: DMA, LCD, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.15V ~ 1.3V Data Converters: A/D 4x10b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 449-FBGA (21×21) | 1,241 | |
| N/A | | R8A77230D400BG | Renesas | IC MCU 32BIT ROMLESS 449FBGA | Microcontrollers | 449-FBGA (21x21) | N/A | -40°C ~ 85°C (TA) | Connectivity: I2C, IrDA, MMC/SD, UART/USART, USB Peripherals: DMA, LCD, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Data Converters: A/D 4x10b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 449-FBGA (21×21) | 838 | |
 | | R8A77420HA02BG#UA | Renesas | IC MPU RZ/G/G1H | Microprocessors | N/A | N/A | – | Core Processor: Quad ARM® Cortex®-A7, Quad ARM® Cortex®-A15 USB: USB 2.0 (2), USB 3.0 (1) | 1,377 | |
| N/A | | R8A77430HA01BG#UA | Renesas | IC MPU RZ/G/G1M 1.5GHZ | Microprocessors | N/A | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A15 Operating Temperature: -40°C ~ 85°C (TA) | 932 | |