Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,621
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
R8A774B1HA01BG#G0N/AR8A774B1HA01BG#G0RenesasIC MCU 32BIT RZ/G2E HDMI OFFMicroprocessorsN/AN/AN/A

N/A

1,305
N/AN/AR8A774B1HA01BG#G2RenesasSOC RZ/G2N HDMI ON(FULL)Microprocessors1022-FCBGA (29x29)N/A-40°C ~ 85°C
Core Processor:
ARM® Cortex®-A57
Number of Cores/Bus Width:
2 Core, 64-Bit
Speed:
1.5GHz
Co-Processors/DSP:
ARM® Cortex®-R7
RAM Controllers:
LPDDR4
Graphics Acceleration:
Yes
Display & Interface Controllers:
LVDS, MIPI-CSI
Ethernet:
10/100/1000Mbps (2)
SATA:
SATA 16Gbps (1)
USB:
USB 2.0 OTG (2), USB 3.0 (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 85°C
Security Features:
AES, ARM TZ, Hash, RSA, Secure Boot, TRNG
Mounting Type:
Surface Mount
Package / Case:
1022-BFBGA, FCBGA
Supplier Device Package:
1022-FCBGA (29×29)
Additional Interfaces:
CANbus, DMA, I2C, I2S, MMC/SD/SDIO, PCI, SPI, UART
416
N/AN/AR8A774B1HA01BG#U2RenesasSOC RZ/G2N HDMI ON(BULK)Microprocessors1022-FCBGA (29x29)N/A-40°C ~ 85°C
Core Processor:
ARM® Cortex®-A57
Number of Cores/Bus Width:
2 Core, 64-Bit
Speed:
1.5GHz
Co-Processors/DSP:
ARM® Cortex®-R7
RAM Controllers:
LPDDR4
Graphics Acceleration:
Yes
Display & Interface Controllers:
LVDS, MIPI-CSI
Ethernet:
10/100/1000Mbps (2)
SATA:
SATA 16Gbps (1)
USB:
USB 2.0 OTG (2), USB 3.0 (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 85°C
Security Features:
AES, ARM TZ, Hash, RSA, Secure Boot, TRNG
Mounting Type:
Surface Mount
Package / Case:
1022-BFBGA, FCBGA
Supplier Device Package:
1022-FCBGA (29×29)
Additional Interfaces:
CANbus, DMA, I2C, I2S, MMC/SD/SDIO, PCI, SPI, UART
911
R8A774C0HA01BG#G0
R8A774C0HA01BG#G0RenesasIC MPU RZ/G2E 1.2GHZ 552FBGAMicroprocessors552-FBGA (21x21)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A53
Number of Cores/Bus Width:
2 Core, 64-Bit
Speed:
1.2GHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
DDR3L
Graphics Acceleration:
No
Display & Interface Controllers:
MIPI-CSI
Ethernet:
10/100Mbps (1), 100/1000Mbps (1)
USB:
USB 2.0 (1), USB 3.0 (1)
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
552-FBGA
Supplier Device Package:
552-FBGA (21×21)
Additional Interfaces:
CAN, I2C, MMC/SD/SDIO, SCI, SCI FIFO, SPDIF, SPI, SSI
666
R8A774C0HA01BG#GA
R8A774C0HA01BG#GARenesasIC MPU RZ/G2E 1.2GHZ 552FPBGAMicroprocessors552-FPBGAN/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A53
Number of Cores/Bus Width:
2 Core, 64-Bit
Speed:
1.2GHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
DDR3L
Graphics Acceleration:
No
Display & Interface Controllers:
MIPI-CSI
Ethernet:
10/100Mbps (1), 100/1000Mbps (1)
USB:
USB 2.0 (1), USB 3.0 (1)
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
552-BGA
Supplier Device Package:
552-FPBGA
Additional Interfaces:
CAN, I2C, MMC/SD/SDIO, SCI, SCI FIFO, SPDIF, SPI, SSI
302
R8A774C0HA01BG#U0
R8A774C0HA01BG#U0RenesasIC MPU RZ/G2E 1.2GHZ 552FBGAMicroprocessors552-FBGA (21x21)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A53
Number of Cores/Bus Width:
2 Core, 64-Bit
Speed:
1.2GHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
DDR3L
Graphics Acceleration:
No
Display & Interface Controllers:
MIPI-CSI
Ethernet:
10/100Mbps (1), 100/1000Mbps (1)
USB:
USB 2.0 (1), USB 3.0 (1)
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
552-FBGA
Supplier Device Package:
552-FBGA (21×21)
Additional Interfaces:
CAN, I2C, MMC/SD/SDIO, SCI, SCI FIFO, SPDIF, SPI, SSI
906
R8A774C0HA01BG#UA
R8A774C0HA01BG#UARenesasIC MPU RZ/G2E 1.2GHZ 552FPBGAMicroprocessors552-FPBGAN/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A53
Number of Cores/Bus Width:
2 Core, 64-Bit
Speed:
1.2GHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
DDR3L
Graphics Acceleration:
No
Display & Interface Controllers:
MIPI-CSI
Ethernet:
10/100Mbps (1), 100/1000Mbps (1)
USB:
USB 2.0 (1), USB 3.0 (1)
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
552-BGA
Supplier Device Package:
552-FPBGA
Additional Interfaces:
CAN, I2C, MMC/SD/SDIO, SCI, SCI FIFO, SPDIF, SPI, SSI
274
R8A774E0HA01BN#G0
R8A774E0HA01BN#G0RenesasIC MPU RZ 1.2GHZ/1.5GHZ 1022BGAMicroprocessors1022-FPBGAN/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-A57
Number of Cores/Bus Width:
8 Core, 64-Bit
Speed:
1.2GHz, 1.5GHz
RAM Controllers:
LPDDR4
Graphics Acceleration:
No
Display & Interface Controllers:
DU
Ethernet:
10/100Mbps (1), 100/1000Mbps (1)
USB:
USB (4)
Voltage – I/O:
0.82V, 1.8V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
1022-BGA
Supplier Device Package:
1022-FPBGA
Additional Interfaces:
CAN, I2C, SCI, SPI
1,189
N/A
R8A774E0HA01BN#G6RenesasSOC RZ/G2H HDMI OFF (FULL)Microprocessors1022-FCBGA (29x29)N/A-40°C ~ 85°C
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-A57
Number of Cores/Bus Width:
4, 4 Core, 64-Bit
Speed:
1.2GHz, 1.5GHz
RAM Controllers:
LPDDR4
Graphics Acceleration:
Yes
Display & Interface Controllers:
DU
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 OTG (2), USB 3.0 (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 85°C
Mounting Type:
Surface Mount
Package / Case:
1022-BFBGA, FCBGA
Supplier Device Package:
1022-FCBGA (29×29)
Additional Interfaces:
CANbus, DMA, I2C, I2S, MMC/SD/SDIO, PCI, SPI, UART
1,438
R8A774E0HA01BN#U0N/AR8A774E0HA01BN#U0RenesasIC MPU RZ 1.2GHZ/1.5GHZ 1022BGAMicroprocessors1022-FPBGAN/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-A57
Number of Cores/Bus Width:
8 Core, 64-Bit
Speed:
1.2GHz, 1.5GHz
RAM Controllers:
LPDDR4
Graphics Acceleration:
No
Display & Interface Controllers:
DU
Ethernet:
10/100Mbps (1), 100/1000Mbps (1)
USB:
USB (4)
Voltage – I/O:
0.82V, 1.8V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
1022-BGA
Supplier Device Package:
1022-FPBGA
Additional Interfaces:
CAN, I2C, SCI, SPI
546
N/A
R8A774E0HA01BN#U6RenesasSOC RZ/G2H HDMI OFF (BULK)Microprocessors1022-FCBGA (29x29)N/A-40°C ~ 85°C
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-A57
Number of Cores/Bus Width:
4, 4 Core, 64-Bit
Speed:
1.2GHz, 1.5GHz
RAM Controllers:
LPDDR4
Graphics Acceleration:
Yes
Display & Interface Controllers:
DU
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 OTG (2), USB 3.0 (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 85°C
Security Features:
AES, ARM TZ, Hash, RSA, Secure Boot, TRNG
Mounting Type:
Surface Mount
Package / Case:
1022-BFBGA, FCBGA
Supplier Device Package:
1022-FCBGA (29×29)
Additional Interfaces:
CANbus, DMA, I2C, I2S, MMC/SD/SDIO, PCI, SPI, UART
776
N/A
R8A774E0HA01BN#YBCRenesasSOC RZ/G2H HDMI OFF (CS)Microprocessors1022-FCBGA (29x29)N/A-40°C ~ 85°C
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-A57
Number of Cores/Bus Width:
4, 4 Core, 64-Bit
Speed:
1.2GHz, 1.5GHz
RAM Controllers:
LPDDR4
Graphics Acceleration:
Yes
Display & Interface Controllers:
DU
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 OTG (2), USB 3.0 (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 85°C
Security Features:
AES, ARM TZ, Hash, RSA, Secure Boot, TRNG
Mounting Type:
Surface Mount
Package / Case:
1022-BFBGA, FCBGA
Supplier Device Package:
1022-FCBGA (29×29)
Additional Interfaces:
CANbus, DMA, I2C, I2S, MMC/SD/SDIO, PCI, SPI, UART
528
N/A
R8A774E0HA01BN#YJCRenesasSOC RZ/G2H HDMI OFF (WS)Microprocessors1022-FCBGA (29x29)N/A-40°C ~ 85°C
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-A57
Number of Cores/Bus Width:
4, 4 Core, 64-Bit
Speed:
1.2GHz, 1.5GHz
RAM Controllers:
LPDDR4
Graphics Acceleration:
Yes
Display & Interface Controllers:
DU
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 OTG (2), USB 3.0 (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 85°C
Mounting Type:
Surface Mount
Package / Case:
1022-BFBGA, FCBGA
Supplier Device Package:
1022-FCBGA (29×29)
Additional Interfaces:
CANbus, DMA, I2C, I2S, MMC/SD/SDIO, PCI, SPI, UART
46
R8A774E1HA01BN#G0N/AR8A774E1HA01BN#G0RenesasIC MCU 32BIT ARM 1022FPBGAMicroprocessorsN/AN/AN/A

N/A

310
N/AN/AR8A774E1HA01BN#G6RenesasSOC RZ/G2H HDMI ON (FULL)Microprocessors1022-FCBGA (29x29)N/A-40°C ~ 85°C
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-A57
Number of Cores/Bus Width:
4, 4 Core, 64-Bit
Speed:
1.2GHz, 1.5GHz
Co-Processors/DSP:
ARM® Cortex®-R7
RAM Controllers:
LPDDR4
Graphics Acceleration:
Yes
Display & Interface Controllers:
LVDS, MIPI-CSI
Ethernet:
10/100Mbps (1)
SATA:
SATA 16Gbps (1)
USB:
USB 2.0 OTG (2), USB 3.0 (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 85°C
Security Features:
AES, ARM TZ, Hash, RSA, Secure Boot, TRNG
Mounting Type:
Surface Mount
Package / Case:
1022-BFBGA, FCBGA
Supplier Device Package:
1022-FCBGA (29×29)
Additional Interfaces:
CANbus, DMA, I2C, I2S, MMC/SD/SDIO, PCI, SPI, UART
956
R8A774E1HA01BN#U0N/AR8A774E1HA01BN#U0RenesasIC MCU 32BIT ARM 1022FPBGAMicroprocessorsN/AN/AN/A

N/A

408
N/AN/AR8A774E1HA01BN#U6RenesasSOC RZ/G2H HDMI ON (BULK)Microprocessors1022-FCBGA (29x29)N/A-40°C ~ 85°C
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-A57
Number of Cores/Bus Width:
4, 4 Core, 64-Bit
Speed:
1.2GHz, 1.5GHz
Co-Processors/DSP:
ARM® Cortex®-R7
RAM Controllers:
LPDDR4
Graphics Acceleration:
Yes
Display & Interface Controllers:
LVDS, MIPI-CSI
Ethernet:
10/100Mbps (1)
SATA:
SATA 16Gbps (1)
USB:
USB 2.0 OTG (2), USB 3.0 (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 85°C
Security Features:
AES, ARM TZ, Hash, RSA, Secure Boot, TRNG
Mounting Type:
Surface Mount
Package / Case:
1022-BFBGA, FCBGA
Supplier Device Package:
1022-FCBGA (29×29)
Additional Interfaces:
CANbus, DMA, I2C, I2S, MMC/SD/SDIO, PCI, SPI, UART
329
R8A77800BDBGV
R8A77800BDBGVRenesasIC MPU SUPERH 400MHZ 449FBGAMicroprocessors449-FBGA (21x21)N/A-40°C – 85°C
Core Processor:
SH-4A
Speed:
400MHz
Mounting Type:
Surface Mount
74
R8A77800BNBGV
R8A77800BNBGVRenesasIC MPU SUPERH 400MHZ 449FBGAMicroprocessors449-FBGA (21x21)N/A-20°C ~ 75°C (TA)
Core Processor:
SH-4A
Speed:
400MHz
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Package / Case:
449-FBGA
Supplier Device Package:
449-FBGA (21×21)
24
N/AN/AR8A77860HBGVRenesasIC MPU 533MHZ 593HFBGAMicroprocessors593-HFBGA (25x25)N/A-40°C ~ 85°C (TA)
Core Processor:
SH-4A
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
533MHz
RAM Controllers:
DDR3, SDRAM
Graphics Acceleration:
No
Ethernet:
IEEE 802.3u
USB:
USB 2.0
Voltage – I/O:
1.25V, 1.5V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
593-BFBGA
Supplier Device Package:
593-HFBGA (25×25)
Additional Interfaces:
I2C, SCIF, SD
373

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