 | N/A | R8A774B1HA01BG#G0 | Renesas | IC MCU 32BIT RZ/G2E HDMI OFF | Microprocessors | N/A | N/A | N/A | N/A | 1,305 | |
| N/A | N/A | R8A774B1HA01BG#G2 | Renesas | SOC RZ/G2N HDMI ON(FULL) | Microprocessors | 1022-FCBGA (29x29) | N/A | -40°C ~ 85°C | Core Processor: ARM® Cortex®-A57 Number of Cores/Bus Width: 2 Core, 64-Bit Co-Processors/DSP: ARM® Cortex®-R7 Graphics Acceleration: Yes Display & Interface Controllers: LVDS, MIPI-CSI Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 OTG (2), USB 3.0 (1) Operating Temperature: -40°C ~ 85°C Security Features: AES, ARM TZ, Hash, RSA, Secure Boot, TRNG Mounting Type: Surface Mount Package / Case: 1022-BFBGA, FCBGA Supplier Device Package: 1022-FCBGA (29×29) Additional Interfaces: CANbus, DMA, I2C, I2S, MMC/SD/SDIO, PCI, SPI, UART | 416 | |
| N/A | N/A | R8A774B1HA01BG#U2 | Renesas | SOC RZ/G2N HDMI ON(BULK) | Microprocessors | 1022-FCBGA (29x29) | N/A | -40°C ~ 85°C | Core Processor: ARM® Cortex®-A57 Number of Cores/Bus Width: 2 Core, 64-Bit Co-Processors/DSP: ARM® Cortex®-R7 Graphics Acceleration: Yes Display & Interface Controllers: LVDS, MIPI-CSI Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 OTG (2), USB 3.0 (1) Operating Temperature: -40°C ~ 85°C Security Features: AES, ARM TZ, Hash, RSA, Secure Boot, TRNG Mounting Type: Surface Mount Package / Case: 1022-BFBGA, FCBGA Supplier Device Package: 1022-FCBGA (29×29) Additional Interfaces: CANbus, DMA, I2C, I2S, MMC/SD/SDIO, PCI, SPI, UART | 911 | |
 | | R8A774C0HA01BG#G0 | Renesas | IC MPU RZ/G2E 1.2GHZ 552FBGA | Microprocessors | 552-FBGA (21x21) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 2 Core, 64-Bit Co-Processors/DSP: Multimedia; NEON™ MPE Display & Interface Controllers: MIPI-CSI Ethernet: 10/100Mbps (1), 100/1000Mbps (1) USB: USB 2.0 (1), USB 3.0 (1) Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 552-FBGA (21×21) Additional Interfaces: CAN, I2C, MMC/SD/SDIO, SCI, SCI FIFO, SPDIF, SPI, SSI | 666 | |
 | | R8A774C0HA01BG#GA | Renesas | IC MPU RZ/G2E 1.2GHZ 552FPBGA | Microprocessors | 552-FPBGA | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 2 Core, 64-Bit Co-Processors/DSP: Multimedia; NEON™ MPE Display & Interface Controllers: MIPI-CSI Ethernet: 10/100Mbps (1), 100/1000Mbps (1) USB: USB 2.0 (1), USB 3.0 (1) Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 552-FPBGA Additional Interfaces: CAN, I2C, MMC/SD/SDIO, SCI, SCI FIFO, SPDIF, SPI, SSI | 302 | |
 | | R8A774C0HA01BG#U0 | Renesas | IC MPU RZ/G2E 1.2GHZ 552FBGA | Microprocessors | 552-FBGA (21x21) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 2 Core, 64-Bit Co-Processors/DSP: Multimedia; NEON™ MPE Display & Interface Controllers: MIPI-CSI Ethernet: 10/100Mbps (1), 100/1000Mbps (1) USB: USB 2.0 (1), USB 3.0 (1) Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 552-FBGA (21×21) Additional Interfaces: CAN, I2C, MMC/SD/SDIO, SCI, SCI FIFO, SPDIF, SPI, SSI | 906 | |
 | | R8A774C0HA01BG#UA | Renesas | IC MPU RZ/G2E 1.2GHZ 552FPBGA | Microprocessors | 552-FPBGA | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 2 Core, 64-Bit Co-Processors/DSP: Multimedia; NEON™ MPE Display & Interface Controllers: MIPI-CSI Ethernet: 10/100Mbps (1), 100/1000Mbps (1) USB: USB 2.0 (1), USB 3.0 (1) Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 552-FPBGA Additional Interfaces: CAN, I2C, MMC/SD/SDIO, SCI, SCI FIFO, SPDIF, SPI, SSI | 274 | |
 | | R8A774E0HA01BN#G0 | Renesas | IC MPU RZ 1.2GHZ/1.5GHZ 1022BGA | Microprocessors | 1022-FPBGA | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-A57 Number of Cores/Bus Width: 8 Core, 64-Bit Display & Interface Controllers: DU Ethernet: 10/100Mbps (1), 100/1000Mbps (1) Voltage – I/O: 0.82V, 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 1022-FPBGA Additional Interfaces: CAN, I2C, SCI, SPI | 1,189 | |
| N/A | | R8A774E0HA01BN#G6 | Renesas | SOC RZ/G2H HDMI OFF (FULL) | Microprocessors | 1022-FCBGA (29x29) | N/A | -40°C ~ 85°C | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-A57 Number of Cores/Bus Width: 4, 4 Core, 64-Bit Graphics Acceleration: Yes Display & Interface Controllers: DU USB: USB 2.0 OTG (2), USB 3.0 (1) Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 1022-BFBGA, FCBGA Supplier Device Package: 1022-FCBGA (29×29) Additional Interfaces: CANbus, DMA, I2C, I2S, MMC/SD/SDIO, PCI, SPI, UART | 1,438 | |
 | N/A | R8A774E0HA01BN#U0 | Renesas | IC MPU RZ 1.2GHZ/1.5GHZ 1022BGA | Microprocessors | 1022-FPBGA | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-A57 Number of Cores/Bus Width: 8 Core, 64-Bit Display & Interface Controllers: DU Ethernet: 10/100Mbps (1), 100/1000Mbps (1) Voltage – I/O: 0.82V, 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 1022-FPBGA Additional Interfaces: CAN, I2C, SCI, SPI | 546 | |
| N/A | | R8A774E0HA01BN#U6 | Renesas | SOC RZ/G2H HDMI OFF (BULK) | Microprocessors | 1022-FCBGA (29x29) | N/A | -40°C ~ 85°C | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-A57 Number of Cores/Bus Width: 4, 4 Core, 64-Bit Graphics Acceleration: Yes Display & Interface Controllers: DU USB: USB 2.0 OTG (2), USB 3.0 (1) Operating Temperature: -40°C ~ 85°C Security Features: AES, ARM TZ, Hash, RSA, Secure Boot, TRNG Mounting Type: Surface Mount Package / Case: 1022-BFBGA, FCBGA Supplier Device Package: 1022-FCBGA (29×29) Additional Interfaces: CANbus, DMA, I2C, I2S, MMC/SD/SDIO, PCI, SPI, UART | 776 | |
| N/A | | R8A774E0HA01BN#YBC | Renesas | SOC RZ/G2H HDMI OFF (CS) | Microprocessors | 1022-FCBGA (29x29) | N/A | -40°C ~ 85°C | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-A57 Number of Cores/Bus Width: 4, 4 Core, 64-Bit Graphics Acceleration: Yes Display & Interface Controllers: DU USB: USB 2.0 OTG (2), USB 3.0 (1) Operating Temperature: -40°C ~ 85°C Security Features: AES, ARM TZ, Hash, RSA, Secure Boot, TRNG Mounting Type: Surface Mount Package / Case: 1022-BFBGA, FCBGA Supplier Device Package: 1022-FCBGA (29×29) Additional Interfaces: CANbus, DMA, I2C, I2S, MMC/SD/SDIO, PCI, SPI, UART | 528 | |
| N/A | | R8A774E0HA01BN#YJC | Renesas | SOC RZ/G2H HDMI OFF (WS) | Microprocessors | 1022-FCBGA (29x29) | N/A | -40°C ~ 85°C | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-A57 Number of Cores/Bus Width: 4, 4 Core, 64-Bit Graphics Acceleration: Yes Display & Interface Controllers: DU USB: USB 2.0 OTG (2), USB 3.0 (1) Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 1022-BFBGA, FCBGA Supplier Device Package: 1022-FCBGA (29×29) Additional Interfaces: CANbus, DMA, I2C, I2S, MMC/SD/SDIO, PCI, SPI, UART | 46 | |
 | N/A | R8A774E1HA01BN#G0 | Renesas | IC MCU 32BIT ARM 1022FPBGA | Microprocessors | N/A | N/A | N/A | N/A | 310 | |
| N/A | N/A | R8A774E1HA01BN#G6 | Renesas | SOC RZ/G2H HDMI ON (FULL) | Microprocessors | 1022-FCBGA (29x29) | N/A | -40°C ~ 85°C | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-A57 Number of Cores/Bus Width: 4, 4 Core, 64-Bit Co-Processors/DSP: ARM® Cortex®-R7 Graphics Acceleration: Yes Display & Interface Controllers: LVDS, MIPI-CSI USB: USB 2.0 OTG (2), USB 3.0 (1) Operating Temperature: -40°C ~ 85°C Security Features: AES, ARM TZ, Hash, RSA, Secure Boot, TRNG Mounting Type: Surface Mount Package / Case: 1022-BFBGA, FCBGA Supplier Device Package: 1022-FCBGA (29×29) Additional Interfaces: CANbus, DMA, I2C, I2S, MMC/SD/SDIO, PCI, SPI, UART | 956 | |
 | N/A | R8A774E1HA01BN#U0 | Renesas | IC MCU 32BIT ARM 1022FPBGA | Microprocessors | N/A | N/A | N/A | N/A | 408 | |
| N/A | N/A | R8A774E1HA01BN#U6 | Renesas | SOC RZ/G2H HDMI ON (BULK) | Microprocessors | 1022-FCBGA (29x29) | N/A | -40°C ~ 85°C | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-A57 Number of Cores/Bus Width: 4, 4 Core, 64-Bit Co-Processors/DSP: ARM® Cortex®-R7 Graphics Acceleration: Yes Display & Interface Controllers: LVDS, MIPI-CSI USB: USB 2.0 OTG (2), USB 3.0 (1) Operating Temperature: -40°C ~ 85°C Security Features: AES, ARM TZ, Hash, RSA, Secure Boot, TRNG Mounting Type: Surface Mount Package / Case: 1022-BFBGA, FCBGA Supplier Device Package: 1022-FCBGA (29×29) Additional Interfaces: CANbus, DMA, I2C, I2S, MMC/SD/SDIO, PCI, SPI, UART | 329 | |
 | | R8A77800BDBGV | Renesas | IC MPU SUPERH 400MHZ 449FBGA | Microprocessors | 449-FBGA (21x21) | N/A | -40°C – 85°C | Mounting Type: Surface Mount | 74 | |
 | | R8A77800BNBGV | Renesas | IC MPU SUPERH 400MHZ 449FBGA | Microprocessors | 449-FBGA (21x21) | N/A | -20°C ~ 75°C (TA) | Operating Temperature: -20°C ~ 75°C (TA) Mounting Type: Surface Mount Supplier Device Package: 449-FBGA (21×21) | 24 | |
| N/A | N/A | R8A77860HBGV | Renesas | IC MPU 533MHZ 593HFBGA | Microprocessors | 593-HFBGA (25x25) | N/A | -40°C ~ 85°C (TA) | Number of Cores/Bus Width: 2 Core, 32-Bit RAM Controllers: DDR3, SDRAM Voltage – I/O: 1.25V, 1.5V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 593-HFBGA (25×25) Additional Interfaces: I2C, SCIF, SD | 373 | |