R8A774E0HA01BN#U0
| Part Description |
ARM® Cortex®-A53, ARM® Cortex®-A57 Microprocessor IC RZ/G2E 8 Core, 64-Bit 1.2GHz, 1.5GHz 1022-FPBGA |
|---|---|
| Quantity | 290 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | R8A774E0H |
| Manufacturer | Renesas Electronics Corporation |
| Manufacturing Status | Discontinued at Digi-Key |
| Manufacturer Standard Lead Time | 18 Weeks |
| Datasheet |
Specifications & Environmental
| Core Processor | ARM® Cortex®-A53, ARM® Cortex®-A57 | Device Package | 1022-FPBGA | Display & Interface Controllers | DU | ||
|---|---|---|---|---|---|---|---|
| ECCN | N/A | Ethernet | 10/100Mbps (1), 100/1000Mbps (1) | Graphics Acceleration | No | ||
| HTS Code | N/A | Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | ||
| Mounting Type | Surface Mount | Number of Cores/Bus Width | 8 Core, 64-Bit | Operating Temperature | -40°C ~ 85°C (TA) | ||
| Package / Case | 1022-BGA | RAM Controllers | LPDDR4 | REACH Compliance | REACH Unaffected | ||
| RoHS Compliance | ROHS3 Compliant | Speed | 1.2GHz, 1.5GHz | Supplier Device Package | 1022-FPBGA | ||
| USB | USB (4) | Voltage – I/O | 0.82V, 1.8V, 3.3V |
Overview of R8A774E0HA01BN#U0 – IC MPU RZ 1.2GHZ/1.5GHZ 1022BGA
The R8A774E0HA01BN#U0 is an 8‑core, 64‑bit microprocessor from the Renesas RZ/G2E family featuring ARM® Cortex®‑A53 and ARM® Cortex®‑A57 cores with clock options at 1.2 GHz and 1.5 GHz. Designed for embedded and industrial applications, it combines multicore processing with rich I/O and security features to support high‑performance control, networking, and storage tasks.
With LPDDR4 memory support, multiple high‑speed I/O interfaces and industrial qualification, this device targets designs that require robust compute, connectivity and secure boot capabilities in a surface‑mount 1022‑FPBGA package.
Key Features
- CPU Architecture – Hybrid ARM® Cortex®‑A53 and ARM® Cortex®‑A57 cores delivering an 8‑core, 64‑bit processing subsystem capable of handling parallel embedded workloads.
- Performance – Configurable operating frequencies of 1.2 GHz and 1.5 GHz to match application performance requirements.
- Memory Support – LPDDR4 memory controller support for higher bandwidth system memory.
- Display – DU display interface controller for driving display panels and graphical user interfaces.
- Ethernet Connectivity – Dual Ethernet support including 10/100 Mbps (1 port) and 100/1000 Mbps (1 port) for mixed‑speed network applications.
- Storage Interfaces – Single SATA interface rated at 16 Gbps for high‑speed local storage and data transfer.
- USB – Up to four USB ports for peripheral connectivity and host/device roles.
- Additional I/O – CAN interface for industrial control networks and other serial connectivity options.
- Security Features – Built‑in AES, ARM TrustZone (ARM TZ), Hash, RSA, Secure Boot and TRNG to support device authentication, encryption and secure boot chains.
- Package & Mounting – 1022‑FPBGA (1022‑BGA family) surface‑mount package suited for compact embedded PCBs.
- Industrial Qualification & Temperature Range – Qualified for industrial use with an operating temperature range of −40°C to 85°C.
- Compliance – RoHS compliant.
Typical Applications
- Industrial Control – Multi‑core processing and CAN connectivity enable deterministic control and communication in industrial automation systems.
- Human‑Machine Interfaces (HMI) – DU display support combined with LPDDR4 memory provides the bandwidth and interface needed for advanced operator displays and touch panels.
- Networking & Gateways – Dual Ethernet ports (including 1 Gbps) and multiple USB ports make the device suitable for embedded routers, gateways and protocol converters.
- Edge Storage & Data Logging – SATA 16 Gbps and robust processing allow use in local storage appliances, data loggers and edge servers.
Unique Advantages
- Scalable Multicore Processing: 8‑core, 64‑bit ARM® architecture supports parallel workloads for compute‑intensive embedded tasks.
- Integrated High‑Speed I/O: Combination of LPDDR4, SATA 16 Gbps, multiple USB ports and dual Ethernet reduces external bridge requirements and simplifies system design.
- Hardware Security Building Blocks: AES, RSA, Hash, Secure Boot, ARM TrustZone and TRNG provide a foundation for secure device identity and protected boot processes.
- Industrial Readiness: Industrial qualification and −40°C to 85°C rating support deployment in harsh operating environments.
- Compact Surface‑Mount Package: 1022‑FPBGA package enables high component density for space‑constrained embedded PCBs.
Why Choose R8A774E0HA01BN#U0?
The R8A774E0HA01BN#U0 positions itself as a high‑integration embedded MPU offering multicore ARM® processing, extensive I/O and on‑chip security features in an industrial‑qualified package. It is suited for designers who need a balance of compute performance, network and storage interfaces, and security primitives in a compact BGA footprint.
This part provides a scalable platform for embedded systems, industrial control, HMI and networking applications where long‑term availability, ecosystem support and robust operating temperature range are key design considerations.
Request a quote or submit an inquiry to receive pricing and availability details for R8A774E0HA01BN#U0. Our team can assist with lead times, volume pricing and integration considerations.

Date Founded: 2002
Headquarters: Koto City, Tokyo, Japan
Employees: 21,000+
Revenue: $10 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016