R8A774E0HA01BN#U0

IC MPU RZ 1.2GHZ/1.5GHZ 1022BGA
Part Description

ARM® Cortex®-A53, ARM® Cortex®-A57 Microprocessor IC RZ/G2E 8 Core, 64-Bit 1.2GHz, 1.5GHz 1022-FPBGA

Quantity 290 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesR8A774E0H
ManufacturerRenesas Electronics Corporation
Manufacturing StatusDiscontinued at Digi-Key
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Core ProcessorARM® Cortex®-A53, ARM® Cortex®-A57Device Package1022-FPBGADisplay & Interface ControllersDU
ECCNN/AEthernet10/100Mbps (1), 100/1000Mbps (1)Graphics AccelerationNo
HTS CodeN/AMoisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width8 Core, 64-BitOperating Temperature-40°C ~ 85°C (TA)
Package / Case1022-BGARAM ControllersLPDDR4REACH ComplianceREACH Unaffected
RoHS ComplianceROHS3 CompliantSpeed1.2GHz, 1.5GHzSupplier Device Package1022-FPBGA
USBUSB (4)Voltage – I/O0.82V, 1.8V, 3.3V

Overview of R8A774E0HA01BN#U0 – IC MPU RZ 1.2GHZ/1.5GHZ 1022BGA

The R8A774E0HA01BN#U0 is an 8‑core, 64‑bit microprocessor from the Renesas RZ/G2E family featuring ARM® Cortex®‑A53 and ARM® Cortex®‑A57 cores with clock options at 1.2 GHz and 1.5 GHz. Designed for embedded and industrial applications, it combines multicore processing with rich I/O and security features to support high‑performance control, networking, and storage tasks.

With LPDDR4 memory support, multiple high‑speed I/O interfaces and industrial qualification, this device targets designs that require robust compute, connectivity and secure boot capabilities in a surface‑mount 1022‑FPBGA package.

Key Features

  • CPU Architecture – Hybrid ARM® Cortex®‑A53 and ARM® Cortex®‑A57 cores delivering an 8‑core, 64‑bit processing subsystem capable of handling parallel embedded workloads.
  • Performance – Configurable operating frequencies of 1.2 GHz and 1.5 GHz to match application performance requirements.
  • Memory Support – LPDDR4 memory controller support for higher bandwidth system memory.
  • Display – DU display interface controller for driving display panels and graphical user interfaces.
  • Ethernet Connectivity – Dual Ethernet support including 10/100 Mbps (1 port) and 100/1000 Mbps (1 port) for mixed‑speed network applications.
  • Storage Interfaces – Single SATA interface rated at 16 Gbps for high‑speed local storage and data transfer.
  • USB – Up to four USB ports for peripheral connectivity and host/device roles.
  • Additional I/O – CAN interface for industrial control networks and other serial connectivity options.
  • Security Features – Built‑in AES, ARM TrustZone (ARM TZ), Hash, RSA, Secure Boot and TRNG to support device authentication, encryption and secure boot chains.
  • Package & Mounting – 1022‑FPBGA (1022‑BGA family) surface‑mount package suited for compact embedded PCBs.
  • Industrial Qualification & Temperature Range – Qualified for industrial use with an operating temperature range of −40°C to 85°C.
  • Compliance – RoHS compliant.

Typical Applications

  • Industrial Control – Multi‑core processing and CAN connectivity enable deterministic control and communication in industrial automation systems.
  • Human‑Machine Interfaces (HMI) – DU display support combined with LPDDR4 memory provides the bandwidth and interface needed for advanced operator displays and touch panels.
  • Networking & Gateways – Dual Ethernet ports (including 1 Gbps) and multiple USB ports make the device suitable for embedded routers, gateways and protocol converters.
  • Edge Storage & Data Logging – SATA 16 Gbps and robust processing allow use in local storage appliances, data loggers and edge servers.

Unique Advantages

  • Scalable Multicore Processing: 8‑core, 64‑bit ARM® architecture supports parallel workloads for compute‑intensive embedded tasks.
  • Integrated High‑Speed I/O: Combination of LPDDR4, SATA 16 Gbps, multiple USB ports and dual Ethernet reduces external bridge requirements and simplifies system design.
  • Hardware Security Building Blocks: AES, RSA, Hash, Secure Boot, ARM TrustZone and TRNG provide a foundation for secure device identity and protected boot processes.
  • Industrial Readiness: Industrial qualification and −40°C to 85°C rating support deployment in harsh operating environments.
  • Compact Surface‑Mount Package: 1022‑FPBGA package enables high component density for space‑constrained embedded PCBs.

Why Choose R8A774E0HA01BN#U0?

The R8A774E0HA01BN#U0 positions itself as a high‑integration embedded MPU offering multicore ARM® processing, extensive I/O and on‑chip security features in an industrial‑qualified package. It is suited for designers who need a balance of compute performance, network and storage interfaces, and security primitives in a compact BGA footprint.

This part provides a scalable platform for embedded systems, industrial control, HMI and networking applications where long‑term availability, ecosystem support and robust operating temperature range are key design considerations.

Request a quote or submit an inquiry to receive pricing and availability details for R8A774E0HA01BN#U0. Our team can assist with lead times, volume pricing and integration considerations.

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