R8A774E0HA01BN#G6

The R8A774E0HA01BN#G6 is a Renesas system-on-chip from the R8A774E0H series, integrating ARM® Cortex®-A53 and ARM® Cortex®-A57 processor cores. It is a multi-core, 64-bit embedded microprocessor designed for industrial-class embedded systems that require integrated connectivity, memory support, and hardware security.

With a nominal core speed of 1.2 GHz and support for LPDDR4 memory, this device targets embedded designs that need balanced compute performance, rich I/O, and industrial temperature operation.

Key Features

• Core and Performance  Dual ARM core architectures: ARM® Cortex®-A53 and ARM® Cortex®-A57 with a 4-core, 64-bit configuration and a speed rating of 1.2 GHz.
• Memory  Integrated LPDDR4 memory controller support for modern embedded memory architectures.
• Display and Graphics  Display interface controller (DU) and graphics acceleration to support graphical user interfaces and display-driven applications.
• Connectivity and Storage  Multiple high-speed and legacy interfaces including USB 3.0 (1), USB 2.0 OTG (2), SATA 16Gbps (1), 10/100 Mbps Ethernet (1) and CANbus for broad peripheral and network connectivity.
• Security  Hardware security features including AES, ARM TrustZone, Hash, RSA, Secure Boot and a True Random Number Generator (TRNG) for device authentication and secure boot chains.
• Power and I/O  3.3 V I/O signaling for compatibility with common embedded peripheral standards.
• Package and Mounting  Supplied in a 1022-FCBGA (29×29) package (1022-BFBGA / FCBGA case), designed for surface mount assembly.
• Qualification and Temperature Range  Industrial qualification with an operating temperature range of -40 °C to 85 °C for reliable field operation.
• Compliance  RoHS compliant.

Unique Advantages

• Multi-core 64-bit processing: Four 64-bit ARM cores provide concurrent processing capacity for complex embedded workloads without external co-processors.
• Integrated high-speed I/O: On-chip USB 3.0, USB 2.0 OTG, SATA and Ethernet reduce BOM and simplify board-level design for storage and connectivity.
• Comprehensive security suite: AES, RSA, Hash, ARM TrustZone, Secure Boot and TRNG deliver layered hardware security to support protected boot and data encryption.
• Industrial readiness: Industrial qualification and a -40 °C to 85 °C operating range enable deployment in demanding embedded environments.
• Memory and graphics support: LPDDR4 controller and graphics acceleration enable responsive user interfaces and efficient memory throughput.
• Compact BGA package: 1022-FCBGA 29×29 package supports high pin-count integration in a space-efficient surface-mount form factor.

Why Choose R8A774E0HA01BN#G6?

The R8A774E0HA01BN#G6 positions itself as a purpose-built embedded microprocessor combining multi-core 64-bit ARM processing, integrated LPDDR4 memory support, a wide set of high-speed interfaces and hardware security primitives. Its industrial qualification and extended temperature range make it suitable for embedded designs that require durable operation and integrated connectivity.

This device is well suited for engineering teams building industrial embedded systems that need on-chip storage and peripheral interfaces, hardware-backed security, and compact BGA mounting to optimize board area and BOM complexity.

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